KR20260008755A - 수지 조성물, 필름, 금속 피복 적층판 및 회로 기판 - Google Patents

수지 조성물, 필름, 금속 피복 적층판 및 회로 기판

Info

Publication number
KR20260008755A
KR20260008755A KR1020257037615A KR20257037615A KR20260008755A KR 20260008755 A KR20260008755 A KR 20260008755A KR 1020257037615 A KR1020257037615 A KR 1020257037615A KR 20257037615 A KR20257037615 A KR 20257037615A KR 20260008755 A KR20260008755 A KR 20260008755A
Authority
KR
South Korea
Prior art keywords
resin composition
liquid crystal
temperature
paragraph
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257037615A
Other languages
English (en)
Korean (ko)
Inventor
히로아키 스기이
모토이 시라가
사야카 이데
미노루 오노데라
Original Assignee
주식회사 쿠라레
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 쿠라레 filed Critical 주식회사 쿠라레
Publication of KR20260008755A publication Critical patent/KR20260008755A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020257037615A 2023-05-15 2024-05-13 수지 조성물, 필름, 금속 피복 적층판 및 회로 기판 Pending KR20260008755A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023080082 2023-05-15
JPJP-P-2023-080082 2023-05-15
PCT/JP2024/017577 WO2024237224A1 (ja) 2023-05-15 2024-05-13 樹脂組成物、フィルム、金属張積層板および回路基板

Publications (1)

Publication Number Publication Date
KR20260008755A true KR20260008755A (ko) 2026-01-16

Family

ID=93519656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257037615A Pending KR20260008755A (ko) 2023-05-15 2024-05-13 수지 조성물, 필름, 금속 피복 적층판 및 회로 기판

Country Status (5)

Country Link
JP (1) JPWO2024237224A1 (https=)
KR (1) KR20260008755A (https=)
CN (1) CN121175380A (https=)
TW (1) TW202502894A (https=)
WO (1) WO2024237224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202532212A (zh) * 2023-12-12 2025-08-16 日商東洋鋼鈑股份有限公司 延伸液晶聚合物薄膜、層積體、電路基板、及延伸液晶聚合物薄膜的製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639756B2 (ja) 2003-11-05 2011-02-23 住友化学株式会社 芳香族液晶ポリエステルおよびそのフィルムならびにそれらの用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6295013B2 (ja) * 2016-02-29 2018-03-14 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
KR102612138B1 (ko) * 2017-03-31 2023-12-08 주식회사 쿠라레 열가소성 액정 폴리머 및 그 필름
JP6991083B2 (ja) * 2018-03-20 2022-01-12 住友化学株式会社 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
JP7390127B2 (ja) * 2019-02-15 2023-12-01 住友化学株式会社 液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP7703301B2 (ja) * 2020-06-30 2025-07-07 株式会社Ｅｎｅｏｓマテリアル 樹脂組成物および該樹脂組成物からなる樹脂成形品
TW202239833A (zh) * 2020-12-21 2022-10-16 日商富士軟片股份有限公司 聚合物膜以及積層體及其製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639756B2 (ja) 2003-11-05 2011-02-23 住友化学株式会社 芳香族液晶ポリエステルおよびそのフィルムならびにそれらの用途

Also Published As

Publication number Publication date
CN121175380A (zh) 2025-12-19
WO2024237224A1 (ja) 2024-11-21
JPWO2024237224A1 (https=) 2024-11-21
TW202502894A (zh) 2025-01-16

Similar Documents

Publication Publication Date Title
CN110446738B (zh) 热塑性液晶聚合物及其膜
JP6854124B2 (ja) 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN112292421B (zh) 可通过热处理来降低介质损耗角正切的含有全芳香族液晶聚酯树脂的树脂成型品和电气电子元件
EP4067433B1 (en) Method for producing lcp film for circuit boards, and lcp film for circuit boards melt extruded from t-die
JP7156814B2 (ja) 機械特性と誘電特性に優れた液晶ポリエステル樹脂
CN101613519B (zh) 树脂组合物及由该树脂组合物得到的模塑制品
KR102796455B1 (ko) 액정 폴리에스테르 분말, 액정 폴리에스테르 조성물, 필름의 제조 방법, 및 적층체의 제조 방법
CN114945468B (zh) 液晶聚酯树脂、液晶聚酯树脂组合物、成型品、叠层体和液晶聚酯树脂膜及其制造方法
KR20210048443A (ko) 적층체용 액정 폴리에스테르 수지, 액정 폴리에스테르 수지 조성물, 적층체 및 액정 폴리에스테르 수지 필름
CN115279832A (zh) 树脂组合物以及由该树脂组合物构成的树脂成型品
US20220282034A1 (en) Liquid crystal polymer particles, thermosetting resin composition, and molded article
KR20260008755A (ko) 수지 조성물, 필름, 금속 피복 적층판 및 회로 기판
KR20230093014A (ko) 액정 폴리머 입자, 열경화성 수지 조성물, 및 성형체
KR102828067B1 (ko) 필름 및 적층체
JP2024042190A (ja) 液晶ポリエステル樹脂組成物およびそれからなる成形品
WO2025084231A1 (ja) 熱可塑性液晶ポリマー、樹脂組成物、フィルム、金属張積層板および回路基板
CN115667398A (zh) 液晶聚酯液态组合物、液晶聚酯膜、层叠体以及液晶聚酯膜的制造方法
KR20230047430A (ko) 액상 조성물, 액상 조성물의 제조 방법, 액정 폴리에스테르 필름의 제조 방법 및 적층체의 제조 방법
JP2025034179A (ja) 絶縁フィルム

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)