CN121175380A - 树脂组合物、膜、覆金属层叠板和电路基板 - Google Patents

树脂组合物、膜、覆金属层叠板和电路基板

Info

Publication number
CN121175380A
CN121175380A CN202480032297.1A CN202480032297A CN121175380A CN 121175380 A CN121175380 A CN 121175380A CN 202480032297 A CN202480032297 A CN 202480032297A CN 121175380 A CN121175380 A CN 121175380A
Authority
CN
China
Prior art keywords
resin composition
liquid crystal
temperature
film
thermoplastic liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480032297.1A
Other languages
English (en)
Chinese (zh)
Inventor
杉井浩晃
白神基
井手彩矢佳
小野寺稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Publication of CN121175380A publication Critical patent/CN121175380A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN202480032297.1A 2023-05-15 2024-05-13 树脂组合物、膜、覆金属层叠板和电路基板 Pending CN121175380A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023080082 2023-05-15
JP2023-080082 2023-05-15
PCT/JP2024/017577 WO2024237224A1 (ja) 2023-05-15 2024-05-13 樹脂組成物、フィルム、金属張積層板および回路基板

Publications (1)

Publication Number Publication Date
CN121175380A true CN121175380A (zh) 2025-12-19

Family

ID=93519656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480032297.1A Pending CN121175380A (zh) 2023-05-15 2024-05-13 树脂组合物、膜、覆金属层叠板和电路基板

Country Status (5)

Country Link
JP (1) JPWO2024237224A1 (https=)
KR (1) KR20260008755A (https=)
CN (1) CN121175380A (https=)
TW (1) TW202502894A (https=)
WO (1) WO2024237224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202532212A (zh) * 2023-12-12 2025-08-16 日商東洋鋼鈑股份有限公司 延伸液晶聚合物薄膜、層積體、電路基板、及延伸液晶聚合物薄膜的製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639756B2 (ja) 2003-11-05 2011-02-23 住友化学株式会社 芳香族液晶ポリエステルおよびそのフィルムならびにそれらの用途
JP6295013B2 (ja) * 2016-02-29 2018-03-14 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
KR102612138B1 (ko) * 2017-03-31 2023-12-08 주식회사 쿠라레 열가소성 액정 폴리머 및 그 필름
JP6991083B2 (ja) * 2018-03-20 2022-01-12 住友化学株式会社 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
JP7390127B2 (ja) * 2019-02-15 2023-12-01 住友化学株式会社 液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP7703301B2 (ja) * 2020-06-30 2025-07-07 株式会社Ｅｎｅｏｓマテリアル 樹脂組成物および該樹脂組成物からなる樹脂成形品
TW202239833A (zh) * 2020-12-21 2022-10-16 日商富士軟片股份有限公司 聚合物膜以及積層體及其製造方法

Also Published As

Publication number Publication date
WO2024237224A1 (ja) 2024-11-21
KR20260008755A (ko) 2026-01-16
JPWO2024237224A1 (https=) 2024-11-21
TW202502894A (zh) 2025-01-16

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