TW202448971A - 感光性樹脂膜、印刷線路板及半導體封裝體 - Google Patents

感光性樹脂膜、印刷線路板及半導體封裝體 Download PDF

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Publication number
TW202448971A
TW202448971A TW113112885A TW113112885A TW202448971A TW 202448971 A TW202448971 A TW 202448971A TW 113112885 A TW113112885 A TW 113112885A TW 113112885 A TW113112885 A TW 113112885A TW 202448971 A TW202448971 A TW 202448971A
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TW
Taiwan
Prior art keywords
photosensitive resin
resin film
component
film
inorganic filler
Prior art date
Application number
TW113112885A
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English (en)
Chinese (zh)
Inventor
阿部宏平
雪岡諒
野尻剛
宮阪昌宏
澤本颯人
Original Assignee
日商力森諾科股份有限公司
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Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202448971A publication Critical patent/TW202448971A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
TW113112885A 2023-04-06 2024-04-08 感光性樹脂膜、印刷線路板及半導體封裝體 TW202448971A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-061898 2023-04-06
JP2023061898 2023-04-06

Publications (1)

Publication Number Publication Date
TW202448971A true TW202448971A (zh) 2024-12-16

Family

ID=92973101

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113112885A TW202448971A (zh) 2023-04-06 2024-04-08 感光性樹脂膜、印刷線路板及半導體封裝體

Country Status (5)

Country Link
JP (1) JPWO2024210146A1 (https=)
KR (1) KR20250168158A (https=)
CN (1) CN119137540A (https=)
TW (1) TW202448971A (https=)
WO (1) WO2024210146A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026078787A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 感光性エレメント、プリント配線板及びプリント配線板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法
WO2014080908A1 (ja) * 2012-11-26 2014-05-30 東レ株式会社 ネガ型感光性樹脂組成物
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板
JP7018168B2 (ja) 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法

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Publication number Publication date
CN119137540A (zh) 2024-12-13
WO2024210146A1 (ja) 2024-10-10
JPWO2024210146A1 (https=) 2024-10-10
KR20250168158A (ko) 2025-12-02

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