JPWO2024210146A1 - - Google Patents
Info
- Publication number
- JPWO2024210146A1 JPWO2024210146A1 JP2025513158A JP2025513158A JPWO2024210146A1 JP WO2024210146 A1 JPWO2024210146 A1 JP WO2024210146A1 JP 2025513158 A JP2025513158 A JP 2025513158A JP 2025513158 A JP2025513158 A JP 2025513158A JP WO2024210146 A1 JPWO2024210146 A1 JP WO2024210146A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023061898 | 2023-04-06 | ||
| PCT/JP2024/013720 WO2024210146A1 (ja) | 2023-04-06 | 2024-04-03 | 感光性樹脂フィルム、プリント配線板及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024210146A1 true JPWO2024210146A1 (https=) | 2024-10-10 |
Family
ID=92973101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025513158A Pending JPWO2024210146A1 (https=) | 2023-04-06 | 2024-04-03 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024210146A1 (https=) |
| KR (1) | KR20250168158A (https=) |
| CN (1) | CN119137540A (https=) |
| TW (1) | TW202448971A (https=) |
| WO (1) | WO2024210146A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026078787A1 (ja) * | 2024-10-08 | 2026-04-16 | 株式会社レゾナック | 感光性エレメント、プリント配線板及びプリント配線板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3290296B2 (ja) | 1994-05-13 | 2002-06-10 | 太陽インキ製造株式会社 | 多層プリント配線板及びその製造方法 |
| WO2014080908A1 (ja) * | 2012-11-26 | 2014-05-30 | 東レ株式会社 | ネガ型感光性樹脂組成物 |
| JP6742785B2 (ja) * | 2015-08-13 | 2020-08-19 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
| JP7018168B2 (ja) | 2015-12-22 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 |
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2024
- 2024-04-03 JP JP2025513158A patent/JPWO2024210146A1/ja active Pending
- 2024-04-03 CN CN202480002334.4A patent/CN119137540A/zh active Pending
- 2024-04-03 KR KR1020257021918A patent/KR20250168158A/ko active Pending
- 2024-04-03 WO PCT/JP2024/013720 patent/WO2024210146A1/ja not_active Ceased
- 2024-04-08 TW TW113112885A patent/TW202448971A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN119137540A (zh) | 2024-12-13 |
| WO2024210146A1 (ja) | 2024-10-10 |
| KR20250168158A (ko) | 2025-12-02 |
| TW202448971A (zh) | 2024-12-16 |