KR20250168158A - 감광성 수지 필름, 프린트 배선판 및 반도체 패키지 - Google Patents

감광성 수지 필름, 프린트 배선판 및 반도체 패키지

Info

Publication number
KR20250168158A
KR20250168158A KR1020257021918A KR20257021918A KR20250168158A KR 20250168158 A KR20250168158 A KR 20250168158A KR 1020257021918 A KR1020257021918 A KR 1020257021918A KR 20257021918 A KR20257021918 A KR 20257021918A KR 20250168158 A KR20250168158 A KR 20250168158A
Authority
KR
South Korea
Prior art keywords
photosensitive resin
resin film
component
printed wiring
silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257021918A
Other languages
English (en)
Korean (ko)
Inventor
코헤이 아베
료 유키오카
다케시 노지리
마사히로 미야사카
하야토 사와모토
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250168158A publication Critical patent/KR20250168158A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
KR1020257021918A 2023-04-06 2024-04-03 감광성 수지 필름, 프린트 배선판 및 반도체 패키지 Pending KR20250168158A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-061898 2023-04-06
JP2023061898 2023-04-06
PCT/JP2024/013720 WO2024210146A1 (ja) 2023-04-06 2024-04-03 感光性樹脂フィルム、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
KR20250168158A true KR20250168158A (ko) 2025-12-02

Family

ID=92973101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257021918A Pending KR20250168158A (ko) 2023-04-06 2024-04-03 감광성 수지 필름, 프린트 배선판 및 반도체 패키지

Country Status (5)

Country Link
JP (1) JPWO2024210146A1 (https=)
KR (1) KR20250168158A (https=)
CN (1) CN119137540A (https=)
TW (1) TW202448971A (https=)
WO (1) WO2024210146A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026078787A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 感光性エレメント、プリント配線板及びプリント配線板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07304931A (ja) 1994-05-13 1995-11-21 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法
JP2017116652A (ja) 2015-12-22 2017-06-29 日立化成株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014080908A1 (ja) * 2012-11-26 2014-05-30 東レ株式会社 ネガ型感光性樹脂組成物
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07304931A (ja) 1994-05-13 1995-11-21 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法
JP2017116652A (ja) 2015-12-22 2017-06-29 日立化成株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
CN119137540A (zh) 2024-12-13
WO2024210146A1 (ja) 2024-10-10
JPWO2024210146A1 (https=) 2024-10-10
TW202448971A (zh) 2024-12-16

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Legal Events

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PA0105 International application

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PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)