TW202439540A - 基板、電子裝置及基板之製造方法 - Google Patents

基板、電子裝置及基板之製造方法 Download PDF

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Publication number
TW202439540A
TW202439540A TW113106660A TW113106660A TW202439540A TW 202439540 A TW202439540 A TW 202439540A TW 113106660 A TW113106660 A TW 113106660A TW 113106660 A TW113106660 A TW 113106660A TW 202439540 A TW202439540 A TW 202439540A
Authority
TW
Taiwan
Prior art keywords
mounting surface
substrate
recess
metallization layer
base metallization
Prior art date
Application number
TW113106660A
Other languages
English (en)
Chinese (zh)
Inventor
松元佑弥
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202439540A publication Critical patent/TW202439540A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW113106660A 2023-02-28 2024-02-23 基板、電子裝置及基板之製造方法 TW202439540A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-030327 2023-02-28
JP2023030327 2023-02-28

Publications (1)

Publication Number Publication Date
TW202439540A true TW202439540A (zh) 2024-10-01

Family

ID=92590608

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106660A TW202439540A (zh) 2023-02-28 2024-02-23 基板、電子裝置及基板之製造方法

Country Status (3)

Country Link
JP (1) JPWO2024181272A1 (https=)
TW (1) TW202439540A (https=)
WO (1) WO2024181272A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4755426B2 (ja) * 2005-02-23 2011-08-24 株式会社住友金属エレクトロデバイス セラミック基板の製造方法
JP4644882B2 (ja) * 2005-05-30 2011-03-09 富士フイルム株式会社 配線基板製造方法、配線基板、吐出ヘッド及び画像形成装置
JP5124389B2 (ja) * 2008-08-27 2013-01-23 新光電気工業株式会社 配線基板
JP2010226419A (ja) * 2009-03-24 2010-10-07 Seiko Epson Corp 圧電デバイスおよびその製造方法
US11388819B2 (en) * 2018-01-24 2022-07-12 Kyocera Corporation Wiring board, electronic device, and electronic module

Also Published As

Publication number Publication date
JPWO2024181272A1 (https=) 2024-09-06
WO2024181272A1 (ja) 2024-09-06

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