JPWO2024181272A1 - - Google Patents
Info
- Publication number
- JPWO2024181272A1 JPWO2024181272A1 JP2025503825A JP2025503825A JPWO2024181272A1 JP WO2024181272 A1 JPWO2024181272 A1 JP WO2024181272A1 JP 2025503825 A JP2025503825 A JP 2025503825A JP 2025503825 A JP2025503825 A JP 2025503825A JP WO2024181272 A1 JPWO2024181272 A1 JP WO2024181272A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023030327 | 2023-02-28 | ||
| PCT/JP2024/006299 WO2024181272A1 (ja) | 2023-02-28 | 2024-02-21 | 基板、電子装置、及び、基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024181272A1 true JPWO2024181272A1 (https=) | 2024-09-06 |
| JPWO2024181272A5 JPWO2024181272A5 (https=) | 2025-11-05 |
Family
ID=92590608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025503825A Pending JPWO2024181272A1 (https=) | 2023-02-28 | 2024-02-21 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024181272A1 (https=) |
| TW (1) | TW202439540A (https=) |
| WO (1) | WO2024181272A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4755426B2 (ja) * | 2005-02-23 | 2011-08-24 | 株式会社住友金属エレクトロデバイス | セラミック基板の製造方法 |
| JP4644882B2 (ja) * | 2005-05-30 | 2011-03-09 | 富士フイルム株式会社 | 配線基板製造方法、配線基板、吐出ヘッド及び画像形成装置 |
| JP5124389B2 (ja) * | 2008-08-27 | 2013-01-23 | 新光電気工業株式会社 | 配線基板 |
| JP2010226419A (ja) * | 2009-03-24 | 2010-10-07 | Seiko Epson Corp | 圧電デバイスおよびその製造方法 |
| US11388819B2 (en) * | 2018-01-24 | 2022-07-12 | Kyocera Corporation | Wiring board, electronic device, and electronic module |
-
2024
- 2024-02-21 JP JP2025503825A patent/JPWO2024181272A1/ja active Pending
- 2024-02-21 WO PCT/JP2024/006299 patent/WO2024181272A1/ja not_active Ceased
- 2024-02-23 TW TW113106660A patent/TW202439540A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202439540A (zh) | 2024-10-01 |
| WO2024181272A1 (ja) | 2024-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250820 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250820 |