TW202425152A - 組件連接技術 - Google Patents

組件連接技術 Download PDF

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Publication number
TW202425152A
TW202425152A TW112145194A TW112145194A TW202425152A TW 202425152 A TW202425152 A TW 202425152A TW 112145194 A TW112145194 A TW 112145194A TW 112145194 A TW112145194 A TW 112145194A TW 202425152 A TW202425152 A TW 202425152A
Authority
TW
Taiwan
Prior art keywords
component
contact areas
nanowires
contact
components
Prior art date
Application number
TW112145194A
Other languages
English (en)
Chinese (zh)
Inventor
奧拉夫 貝勒姆
塞巴斯蒂安 奎德瑙
弗洛里安 偉班柏恩
Original Assignee
德商奈米懷德有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商奈米懷德有限公司 filed Critical 德商奈米懷德有限公司
Publication of TW202425152A publication Critical patent/TW202425152A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/224—Bumps having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/701—Direct bonding of chips, wafers or substrates characterised by the pads after the direct bonding
    • H10W80/743—Direct bonding of chips, wafers or substrates characterised by the pads after the direct bonding having disposition changed during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors

Landscapes

  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW112145194A 2022-12-07 2023-11-22 組件連接技術 TW202425152A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022132447.8A DE102022132447A1 (de) 2022-12-07 2022-12-07 Verbinden von Bauteilen
DE102022132447.8 2022-12-07

Publications (1)

Publication Number Publication Date
TW202425152A true TW202425152A (zh) 2024-06-16

Family

ID=88874593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112145194A TW202425152A (zh) 2022-12-07 2023-11-22 組件連接技術

Country Status (7)

Country Link
EP (1) EP4631099A1 (de)
JP (1) JP2025538759A (de)
KR (1) KR20250109742A (de)
CN (1) CN120303781A (de)
DE (1) DE102022132447A1 (de)
TW (1) TW202425152A (de)
WO (1) WO2024120784A1 (de)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4167212B2 (ja) * 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
JP4870048B2 (ja) * 2007-08-20 2012-02-08 富士通株式会社 電子部品装置及びその製造方法
JP5292772B2 (ja) * 2007-11-15 2013-09-18 富士通株式会社 電子部品及びその製造方法
JP5298768B2 (ja) * 2008-10-27 2013-09-25 富士通株式会社 電子部品及びその製造方法
JP5187148B2 (ja) * 2008-11-12 2013-04-24 富士通株式会社 半導体装置及びその製造方法
JP5332775B2 (ja) * 2009-03-18 2013-11-06 富士通株式会社 電子部品及びその製造方法
DE102018122007A1 (de) * 2018-09-10 2020-03-12 Nanowired Gmbh Anordnung miteinander verbundener Bauelemente sowie Verfahren zur Verbindung von Bauelementen
DE102020116671A1 (de) * 2020-06-24 2021-12-30 Nanowired Gmbh Waferbonding
US12243848B2 (en) * 2021-05-14 2025-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and systems for improving fusion bonding

Also Published As

Publication number Publication date
WO2024120784A1 (de) 2024-06-13
EP4631099A1 (de) 2025-10-15
KR20250109742A (ko) 2025-07-17
JP2025538759A (ja) 2025-11-28
CN120303781A (zh) 2025-07-11
DE102022132447A1 (de) 2024-06-13

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