TW202419966A - 帶導電圖案的陶瓷生片的製造方法、積層體的製造方法及煆燒體的製造方法 - Google Patents

帶導電圖案的陶瓷生片的製造方法、積層體的製造方法及煆燒體的製造方法 Download PDF

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Publication number
TW202419966A
TW202419966A TW112120711A TW112120711A TW202419966A TW 202419966 A TW202419966 A TW 202419966A TW 112120711 A TW112120711 A TW 112120711A TW 112120711 A TW112120711 A TW 112120711A TW 202419966 A TW202419966 A TW 202419966A
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TW
Taiwan
Prior art keywords
ceramic green
green sheet
photosensitive layer
conductive pattern
substrate
Prior art date
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TW112120711A
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English (en)
Chinese (zh)
Inventor
松下大輔
橋本大樹
高瀬皓平
小山麻里恵
Original Assignee
日商東麗股份有限公司
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Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202419966A publication Critical patent/TW202419966A/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Producing Shaped Articles From Materials (AREA)
TW112120711A 2022-06-28 2023-06-02 帶導電圖案的陶瓷生片的製造方法、積層體的製造方法及煆燒體的製造方法 TW202419966A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-103220 2022-06-28
JP2022103220 2022-06-28

Publications (1)

Publication Number Publication Date
TW202419966A true TW202419966A (zh) 2024-05-16

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TW112120711A TW202419966A (zh) 2022-06-28 2023-06-02 帶導電圖案的陶瓷生片的製造方法、積層體的製造方法及煆燒體的製造方法

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JP (1) JPWO2024004461A1 (https=)
CN (1) CN119013624A (https=)
TW (1) TW202419966A (https=)
WO (1) WO2024004461A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7640798B1 (ja) 2024-09-12 2025-03-05 ノリタケ株式会社 積層セラミック電子部品の内部電極用ペースト、および、積層セラミック電子部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3151049B2 (ja) * 1991-11-29 2001-04-03 旭化成株式会社 薄膜状光重合性導電ペースト組成物積層体
JP2017182901A (ja) * 2016-03-28 2017-10-05 東レ株式会社 感光性導電ペースト及び、それを用いた電子部品の製造方法

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JPWO2024004461A1 (https=) 2024-01-04
CN119013624A (zh) 2024-11-22
WO2024004461A1 (ja) 2024-01-04

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