TW202400749A - 聚酯系黏著劑組成物、聚酯系黏著劑、黏著片、裝飾薄膜、電子構件用薄膜及裝飾成形體 - Google Patents

聚酯系黏著劑組成物、聚酯系黏著劑、黏著片、裝飾薄膜、電子構件用薄膜及裝飾成形體 Download PDF

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Publication number
TW202400749A
TW202400749A TW112110546A TW112110546A TW202400749A TW 202400749 A TW202400749 A TW 202400749A TW 112110546 A TW112110546 A TW 112110546A TW 112110546 A TW112110546 A TW 112110546A TW 202400749 A TW202400749 A TW 202400749A
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TW
Taiwan
Prior art keywords
polyester
polyester resin
structural unit
adhesive
mol
Prior art date
Application number
TW112110546A
Other languages
English (en)
Chinese (zh)
Inventor
坂本健斗
中根宇之
Original Assignee
日商三菱化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三菱化學股份有限公司 filed Critical 日商三菱化學股份有限公司
Publication of TW202400749A publication Critical patent/TW202400749A/zh

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181Acids containing aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/20Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW112110546A 2022-03-23 2023-03-22 聚酯系黏著劑組成物、聚酯系黏著劑、黏著片、裝飾薄膜、電子構件用薄膜及裝飾成形體 TW202400749A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022046187 2022-03-23
JP2022-046187 2022-03-23

Publications (1)

Publication Number Publication Date
TW202400749A true TW202400749A (zh) 2024-01-01

Family

ID=88101123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110546A TW202400749A (zh) 2022-03-23 2023-03-22 聚酯系黏著劑組成物、聚酯系黏著劑、黏著片、裝飾薄膜、電子構件用薄膜及裝飾成形體

Country Status (7)

Country Link
US (1) US20240417599A1 (https=)
EP (1) EP4497797A4 (https=)
JP (1) JPWO2023182325A1 (https=)
KR (1) KR20240144353A (https=)
CN (1) CN118891337A (https=)
TW (1) TW202400749A (https=)
WO (1) WO2023182325A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3090221B2 (ja) * 1991-04-30 2000-09-18 東洋紡績株式会社 ポリエステル系粘着剤
JP3324159B2 (ja) 1992-10-16 2002-09-17 東洋紡績株式会社 熱可塑性ポリエステルエラストマー
JPH06145633A (ja) * 1992-11-11 1994-05-27 Toyobo Co Ltd ポリエステル系感圧性接着剤組成物
JP5267129B2 (ja) * 2006-12-08 2013-08-21 東洋インキScホールディングス株式会社 接着剤組成物、その製造方法及び接着剤組成物を用いた積層体
JP5353000B2 (ja) * 2007-05-29 2013-11-27 東洋インキScホールディングス株式会社 ポリエステル樹脂の製造方法及び感圧式接着剤組成物
JP2009280776A (ja) * 2008-04-25 2009-12-03 Toyo Ink Mfg Co Ltd 感圧式接着剤組成物及び感圧式接着フィルム
JP2018193537A (ja) * 2017-05-18 2018-12-06 東洋紡株式会社 ポリエステル系粘着剤とその粘着シート
JP7215157B2 (ja) 2017-12-29 2023-01-31 三菱ケミカル株式会社 ポリエステル系粘着剤組成物、ポリエステル系粘着剤、粘着フィルム、耐熱粘着フィルム用粘着剤組成物、マスキング用耐熱粘着フィルム、マスキング用耐熱粘着フィルムの使用方法
JP7729048B2 (ja) * 2020-02-13 2025-08-26 三菱ケミカル株式会社 粘着剤組成物、粘着剤、粘着シートおよび両面粘着シート
JP7127674B2 (ja) 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤
CN115315499A (zh) 2020-03-30 2022-11-08 东洋纺株式会社 粘接剂组合物和粘接片材、层叠体及印刷线路板

Also Published As

Publication number Publication date
US20240417599A1 (en) 2024-12-19
WO2023182325A1 (ja) 2023-09-28
EP4497797A4 (en) 2025-07-02
JPWO2023182325A1 (https=) 2023-09-28
EP4497797A1 (en) 2025-01-29
CN118891337A (zh) 2024-11-01
KR20240144353A (ko) 2024-10-02

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