TW202347434A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TW202347434A
TW202347434A TW112117650A TW112117650A TW202347434A TW 202347434 A TW202347434 A TW 202347434A TW 112117650 A TW112117650 A TW 112117650A TW 112117650 A TW112117650 A TW 112117650A TW 202347434 A TW202347434 A TW 202347434A
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TW
Taiwan
Prior art keywords
substrate
liquid
nozzle
potentiometer
processing liquid
Prior art date
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TW112117650A
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English (en)
Chinese (zh)
Inventor
竹口啲史
中庄谷孝仁
小佐井一樹
篠原和義
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202347434A publication Critical patent/TW202347434A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW112117650A 2022-05-26 2023-05-12 基板處理裝置及基板處理方法 TW202347434A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022086351 2022-05-26
JP2022-086351 2022-05-26

Publications (1)

Publication Number Publication Date
TW202347434A true TW202347434A (zh) 2023-12-01

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ID=88919089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112117650A TW202347434A (zh) 2022-05-26 2023-05-12 基板處理裝置及基板處理方法

Country Status (3)

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JP (1) JPWO2023228776A1 (enrdf_load_stackoverflow)
TW (1) TW202347434A (enrdf_load_stackoverflow)
WO (1) WO2023228776A1 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186633A (ja) * 2002-12-06 2004-07-02 Shimada Phys & Chem Ind Co Ltd 平板状被処理物の処理装置および処理方法
JP2008016660A (ja) * 2006-07-06 2008-01-24 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5408982B2 (ja) * 2008-12-09 2014-02-05 芝浦メカトロニクス株式会社 基板の帯電除去装置及び帯電除去方法
JP2011222886A (ja) * 2010-04-14 2011-11-04 Panasonic Corp 基板洗浄方法及び基板洗浄装置
JP2014194965A (ja) * 2013-03-28 2014-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2019046869A (ja) * 2017-08-30 2019-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

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Publication number Publication date
WO2023228776A1 (ja) 2023-11-30
JPWO2023228776A1 (enrdf_load_stackoverflow) 2023-11-30

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