JPWO2023228776A1 - - Google Patents
Info
- Publication number
- JPWO2023228776A1 JPWO2023228776A1 JP2024523036A JP2024523036A JPWO2023228776A1 JP WO2023228776 A1 JPWO2023228776 A1 JP WO2023228776A1 JP 2024523036 A JP2024523036 A JP 2024523036A JP 2024523036 A JP2024523036 A JP 2024523036A JP WO2023228776 A1 JPWO2023228776 A1 JP WO2023228776A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022086351 | 2022-05-26 | ||
| PCT/JP2023/017891 WO2023228776A1 (ja) | 2022-05-26 | 2023-05-12 | 基板処理装置、および基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228776A1 true JPWO2023228776A1 (enrdf_load_stackoverflow) | 2023-11-30 |
Family
ID=88919089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523036A Pending JPWO2023228776A1 (enrdf_load_stackoverflow) | 2022-05-26 | 2023-05-12 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023228776A1 (enrdf_load_stackoverflow) |
| TW (1) | TW202347434A (enrdf_load_stackoverflow) |
| WO (1) | WO2023228776A1 (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011222886A (ja) * | 2010-04-14 | 2011-11-04 | Panasonic Corp | 基板洗浄方法及び基板洗浄装置 |
| JP2019046869A (ja) * | 2017-08-30 | 2019-03-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186633A (ja) * | 2002-12-06 | 2004-07-02 | Shimada Phys & Chem Ind Co Ltd | 平板状被処理物の処理装置および処理方法 |
| JP2008016660A (ja) * | 2006-07-06 | 2008-01-24 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| JP5408982B2 (ja) * | 2008-12-09 | 2014-02-05 | 芝浦メカトロニクス株式会社 | 基板の帯電除去装置及び帯電除去方法 |
| JP2014194965A (ja) * | 2013-03-28 | 2014-10-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2023
- 2023-05-12 JP JP2024523036A patent/JPWO2023228776A1/ja active Pending
- 2023-05-12 TW TW112117650A patent/TW202347434A/zh unknown
- 2023-05-12 WO PCT/JP2023/017891 patent/WO2023228776A1/ja active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011222886A (ja) * | 2010-04-14 | 2011-11-04 | Panasonic Corp | 基板洗浄方法及び基板洗浄装置 |
| JP2019046869A (ja) * | 2017-08-30 | 2019-03-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023228776A1 (ja) | 2023-11-30 |
| TW202347434A (zh) | 2023-12-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241112 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250729 |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250819 |