TW202340377A - 導熱性矽氧組成物 - Google Patents

導熱性矽氧組成物 Download PDF

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Publication number
TW202340377A
TW202340377A TW112104513A TW112104513A TW202340377A TW 202340377 A TW202340377 A TW 202340377A TW 112104513 A TW112104513 A TW 112104513A TW 112104513 A TW112104513 A TW 112104513A TW 202340377 A TW202340377 A TW 202340377A
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TW
Taiwan
Prior art keywords
thermally conductive
silicone composition
conductive silicone
component
mass
Prior art date
Application number
TW112104513A
Other languages
English (en)
Chinese (zh)
Inventor
久保埜瞳子
辻謙一
Original Assignee
日商信越化學工業股份有限公司
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Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW202340377A publication Critical patent/TW202340377A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112104513A 2022-02-28 2023-02-09 導熱性矽氧組成物 TW202340377A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-029345 2022-02-28
JP2022029345 2022-02-28

Publications (1)

Publication Number Publication Date
TW202340377A true TW202340377A (zh) 2023-10-16

Family

ID=87765646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112104513A TW202340377A (zh) 2022-02-28 2023-02-09 導熱性矽氧組成物

Country Status (7)

Country Link
US (1) US20250129216A1 (https=)
EP (1) EP4488335A4 (https=)
JP (1) JPWO2023162636A1 (https=)
KR (1) KR20240153987A (https=)
CN (1) CN119137215A (https=)
TW (1) TW202340377A (https=)
WO (1) WO2023162636A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024142155A (ja) * 2023-03-29 2024-10-10 信越化学工業株式会社 オルガノポリシロキサン

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139818A (ja) * 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
US6620515B2 (en) * 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5648619B2 (ja) 2011-10-26 2015-01-07 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6042307B2 (ja) 2013-10-16 2016-12-14 信越化学工業株式会社 硬化性熱伝導性樹脂組成物、該組成物の製造方法、該組成物の硬化物、該硬化物の使用方法、該組成物の硬化物を有する半導体装置、及び該半導体装置の製造方法
WO2015114939A1 (ja) * 2014-01-31 2015-08-06 信越化学工業株式会社 オルガノポリシロキサン化合物及びその製造方法並びに付加硬化型シリコーン組成物
JP6187349B2 (ja) 2014-03-26 2017-08-30 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
CN106221236B (zh) * 2016-07-26 2019-09-10 深圳市金无曼工业新材料有限公司 可常温或加温凝胶化制备的双组份导热硅脂及其制备方法
JP6943028B2 (ja) * 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
US11072706B2 (en) * 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
JP7070320B2 (ja) * 2018-10-18 2022-05-18 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6957435B2 (ja) * 2018-10-23 2021-11-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN113661216B (zh) * 2019-04-10 2023-09-19 汉高股份有限及两合公司 导热性硅酮灌封组合物
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
CN110982277B (zh) * 2019-12-23 2022-02-22 成都硅宝科技股份有限公司 一种单组分耐温导热硅泥组合物及其制备方法
JP7285231B2 (ja) * 2020-05-08 2023-06-01 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP6997834B1 (ja) * 2020-06-26 2022-01-24 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2022009486A1 (ja) * 2020-07-07 2022-01-13 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
JP7541874B2 (ja) * 2020-08-26 2024-08-29 デクセリアルズ株式会社 熱伝導性組成物及びこれを用いた熱伝導性シート
CN112159647A (zh) * 2020-09-30 2021-01-01 深圳市飞荣达科技股份有限公司 一种低硬度易返工的单组分导热凝胶及其制备方法
CN113527893A (zh) * 2021-08-13 2021-10-22 深圳先进电子材料国际创新研究院 一种高迟滞热界面材料及其制备方法和应用

Also Published As

Publication number Publication date
WO2023162636A1 (ja) 2023-08-31
EP4488335A4 (en) 2026-03-25
US20250129216A1 (en) 2025-04-24
JPWO2023162636A1 (https=) 2023-08-31
CN119137215A (zh) 2024-12-13
EP4488335A1 (en) 2025-01-08
KR20240153987A (ko) 2024-10-24

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