JPWO2023162636A1 - - Google Patents

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Publication number
JPWO2023162636A1
JPWO2023162636A1 JP2024502964A JP2024502964A JPWO2023162636A1 JP WO2023162636 A1 JPWO2023162636 A1 JP WO2023162636A1 JP 2024502964 A JP2024502964 A JP 2024502964A JP 2024502964 A JP2024502964 A JP 2024502964A JP WO2023162636 A1 JPWO2023162636 A1 JP WO2023162636A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024502964A
Other languages
Japanese (ja)
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JPWO2023162636A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023162636A1 publication Critical patent/JPWO2023162636A1/ja
Publication of JPWO2023162636A5 publication Critical patent/JPWO2023162636A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024502964A 2022-02-28 2023-02-03 Pending JPWO2023162636A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022029345 2022-02-28
PCT/JP2023/003586 WO2023162636A1 (ja) 2022-02-28 2023-02-03 熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
JPWO2023162636A1 true JPWO2023162636A1 (https=) 2023-08-31
JPWO2023162636A5 JPWO2023162636A5 (https=) 2024-10-11

Family

ID=87765646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502964A Pending JPWO2023162636A1 (https=) 2022-02-28 2023-02-03

Country Status (7)

Country Link
US (1) US20250129216A1 (https=)
EP (1) EP4488335A4 (https=)
JP (1) JPWO2023162636A1 (https=)
KR (1) KR20240153987A (https=)
CN (1) CN119137215A (https=)
TW (1) TW202340377A (https=)
WO (1) WO2023162636A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024142155A (ja) * 2023-03-29 2024-10-10 信越化学工業株式会社 オルガノポリシロキサン

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139818A (ja) * 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2002003718A (ja) * 2000-06-23 2002-01-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
WO2003052818A1 (en) * 2001-12-14 2003-06-26 Dow Corning Corporation Thermally conductive phase change materials
JP2020063380A (ja) * 2018-10-18 2020-04-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2020066670A (ja) * 2018-10-23 2020-04-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020206626A1 (en) * 2019-04-10 2020-10-15 Henkel Ag & Co. Kgaa Thermally conductive silicone potting composition
JP2021080311A (ja) * 2019-11-14 2021-05-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
JP2021514014A (ja) * 2018-02-15 2021-06-03 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． ゲルタイプ熱界面材料
CN113527893A (zh) * 2021-08-13 2021-10-22 深圳先进电子材料国际创新研究院 一种高迟滞热界面材料及其制备方法和应用
JP2021176945A (ja) * 2020-05-08 2021-11-11 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2021261147A1 (ja) * 2020-06-26 2021-12-30 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2022009486A1 (ja) * 2020-07-07 2022-01-13 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
JP2022038407A (ja) * 2020-08-26 2022-03-10 デクセリアルズ株式会社 熱伝導性組成物及びこれを用いた熱伝導性シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5648619B2 (ja) 2011-10-26 2015-01-07 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6042307B2 (ja) 2013-10-16 2016-12-14 信越化学工業株式会社 硬化性熱伝導性樹脂組成物、該組成物の製造方法、該組成物の硬化物、該硬化物の使用方法、該組成物の硬化物を有する半導体装置、及び該半導体装置の製造方法
WO2015114939A1 (ja) * 2014-01-31 2015-08-06 信越化学工業株式会社 オルガノポリシロキサン化合物及びその製造方法並びに付加硬化型シリコーン組成物
JP6187349B2 (ja) 2014-03-26 2017-08-30 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
CN106221236B (zh) * 2016-07-26 2019-09-10 深圳市金无曼工业新材料有限公司 可常温或加温凝胶化制备的双组份导热硅脂及其制备方法
JP6943028B2 (ja) * 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
CN110982277B (zh) * 2019-12-23 2022-02-22 成都硅宝科技股份有限公司 一种单组分耐温导热硅泥组合物及其制备方法
CN112159647A (zh) * 2020-09-30 2021-01-01 深圳市飞荣达科技股份有限公司 一种低硬度易返工的单组分导热凝胶及其制备方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139818A (ja) * 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2002003718A (ja) * 2000-06-23 2002-01-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
WO2003052818A1 (en) * 2001-12-14 2003-06-26 Dow Corning Corporation Thermally conductive phase change materials
JP2021514014A (ja) * 2018-02-15 2021-06-03 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． ゲルタイプ熱界面材料
JP2020063380A (ja) * 2018-10-18 2020-04-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2020066670A (ja) * 2018-10-23 2020-04-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020206626A1 (en) * 2019-04-10 2020-10-15 Henkel Ag & Co. Kgaa Thermally conductive silicone potting composition
JP2021080311A (ja) * 2019-11-14 2021-05-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
JP2021176945A (ja) * 2020-05-08 2021-11-11 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2021261147A1 (ja) * 2020-06-26 2021-12-30 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2022009486A1 (ja) * 2020-07-07 2022-01-13 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
JP2022038407A (ja) * 2020-08-26 2022-03-10 デクセリアルズ株式会社 熱伝導性組成物及びこれを用いた熱伝導性シート
CN113527893A (zh) * 2021-08-13 2021-10-22 深圳先进电子材料国际创新研究院 一种高迟滞热界面材料及其制备方法和应用

Also Published As

Publication number Publication date
WO2023162636A1 (ja) 2023-08-31
EP4488335A4 (en) 2026-03-25
US20250129216A1 (en) 2025-04-24
TW202340377A (zh) 2023-10-16
CN119137215A (zh) 2024-12-13
EP4488335A1 (en) 2025-01-08
KR20240153987A (ko) 2024-10-24

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