CN119137215A - 导热性有机硅组合物 - Google Patents

导热性有机硅组合物 Download PDF

Info

Publication number
CN119137215A
CN119137215A CN202380023213.3A CN202380023213A CN119137215A CN 119137215 A CN119137215 A CN 119137215A CN 202380023213 A CN202380023213 A CN 202380023213A CN 119137215 A CN119137215 A CN 119137215A
Authority
CN
China
Prior art keywords
thermally conductive
silicone composition
conductive silicone
component
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380023213.3A
Other languages
English (en)
Chinese (zh)
Inventor
久保野瞳子
什谦一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN119137215A publication Critical patent/CN119137215A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380023213.3A 2022-02-28 2023-02-03 导热性有机硅组合物 Pending CN119137215A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-029345 2022-02-28
JP2022029345 2022-02-28
PCT/JP2023/003586 WO2023162636A1 (ja) 2022-02-28 2023-02-03 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
CN119137215A true CN119137215A (zh) 2024-12-13

Family

ID=87765646

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380023213.3A Pending CN119137215A (zh) 2022-02-28 2023-02-03 导热性有机硅组合物

Country Status (7)

Country Link
US (1) US20250129216A1 (https=)
EP (1) EP4488335A4 (https=)
JP (1) JPWO2023162636A1 (https=)
KR (1) KR20240153987A (https=)
CN (1) CN119137215A (https=)
TW (1) TW202340377A (https=)
WO (1) WO2023162636A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024142155A (ja) * 2023-03-29 2024-10-10 信越化学工業株式会社 オルガノポリシロキサン

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139818A (ja) * 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
US6620515B2 (en) * 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5648619B2 (ja) 2011-10-26 2015-01-07 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6042307B2 (ja) 2013-10-16 2016-12-14 信越化学工業株式会社 硬化性熱伝導性樹脂組成物、該組成物の製造方法、該組成物の硬化物、該硬化物の使用方法、該組成物の硬化物を有する半導体装置、及び該半導体装置の製造方法
WO2015114939A1 (ja) * 2014-01-31 2015-08-06 信越化学工業株式会社 オルガノポリシロキサン化合物及びその製造方法並びに付加硬化型シリコーン組成物
JP6187349B2 (ja) 2014-03-26 2017-08-30 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
CN106221236B (zh) * 2016-07-26 2019-09-10 深圳市金无曼工业新材料有限公司 可常温或加温凝胶化制备的双组份导热硅脂及其制备方法
JP6943028B2 (ja) * 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
US11072706B2 (en) * 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
JP7070320B2 (ja) * 2018-10-18 2022-05-18 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6957435B2 (ja) * 2018-10-23 2021-11-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN113661216B (zh) * 2019-04-10 2023-09-19 汉高股份有限及两合公司 导热性硅酮灌封组合物
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
CN110982277B (zh) * 2019-12-23 2022-02-22 成都硅宝科技股份有限公司 一种单组分耐温导热硅泥组合物及其制备方法
JP7285231B2 (ja) * 2020-05-08 2023-06-01 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP6997834B1 (ja) * 2020-06-26 2022-01-24 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2022009486A1 (ja) * 2020-07-07 2022-01-13 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
JP7541874B2 (ja) * 2020-08-26 2024-08-29 デクセリアルズ株式会社 熱伝導性組成物及びこれを用いた熱伝導性シート
CN112159647A (zh) * 2020-09-30 2021-01-01 深圳市飞荣达科技股份有限公司 一种低硬度易返工的单组分导热凝胶及其制备方法
CN113527893A (zh) * 2021-08-13 2021-10-22 深圳先进电子材料国际创新研究院 一种高迟滞热界面材料及其制备方法和应用

Also Published As

Publication number Publication date
WO2023162636A1 (ja) 2023-08-31
EP4488335A4 (en) 2026-03-25
US20250129216A1 (en) 2025-04-24
TW202340377A (zh) 2023-10-16
JPWO2023162636A1 (https=) 2023-08-31
EP4488335A1 (en) 2025-01-08
KR20240153987A (ko) 2024-10-24

Similar Documents

Publication Publication Date Title
JP5304623B2 (ja) 高熱伝導性ポッティング材の選定方法
KR102542191B1 (ko) 열전도성 폴리오르가노실록산 조성물
KR101859617B1 (ko) 가열 경화형 열전도성 실리콘 그리스 조성물
KR102176435B1 (ko) 열전도성 실리콘 조성물
JP5182515B2 (ja) 熱伝導性シリコーングリース組成物
CN108624060B (zh) 固晶用硅酮树脂组合物及固化物
KR20090094761A (ko) 열전도성 실리콘 그리스 조성물
CN109844031B (zh) 导热性有机硅组合物
JP2009209165A (ja) 熱伝導性硬化物及びその製造方法
CN105916957B (zh) 硅酮粘合剂
JP5472055B2 (ja) 熱伝導性シリコーングリース組成物
JP5843364B2 (ja) 熱伝導性組成物
TW202302722A (zh) 散熱凝膠組合物
JP7070320B2 (ja) 熱伝導性シリコーン組成物
KR20160058801A (ko) 실리콘조성물 및 열전도성 실리콘조성물의 제조방법
JP2017075202A (ja) 付加一液硬化型熱伝導性シリコーングリース組成物
CN114846084A (zh) 导热性有机硅组合物
CN109563348B (zh) 导热性有机硅组合物
CN121175378A (zh) 导热性有机硅组合物及固化物
EP4606862A1 (en) Curable organopolysiloxane composition and semiconductor device
JP2021001239A (ja) 熱硬化型熱伝導性シリコーンゴム組成物
CN119137215A (zh) 导热性有机硅组合物
WO2024048335A1 (ja) 熱伝導性シリコーン組成物
WO2025187619A1 (ja) 熱伝導性シリコーン組成物
EP4465368A1 (en) Thixotropic silicone gel composition for spot potting, cured product thereof, and photocoupler

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination