TW202330287A - 轉印膜及導體圖案形成方法 - Google Patents

轉印膜及導體圖案形成方法 Download PDF

Info

Publication number
TW202330287A
TW202330287A TW111140932A TW111140932A TW202330287A TW 202330287 A TW202330287 A TW 202330287A TW 111140932 A TW111140932 A TW 111140932A TW 111140932 A TW111140932 A TW 111140932A TW 202330287 A TW202330287 A TW 202330287A
Authority
TW
Taiwan
Prior art keywords
layer
mass
photosensitive composition
preferable
meth
Prior art date
Application number
TW111140932A
Other languages
English (en)
Chinese (zh)
Inventor
児玉邦彦
山田悟
鬼塚悠
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202330287A publication Critical patent/TW202330287A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW111140932A 2022-01-28 2022-10-27 轉印膜及導體圖案形成方法 TW202330287A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012230 2022-01-28
JP2022-012230 2022-01-28

Publications (1)

Publication Number Publication Date
TW202330287A true TW202330287A (zh) 2023-08-01

Family

ID=87471080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111140932A TW202330287A (zh) 2022-01-28 2022-10-27 轉印膜及導體圖案形成方法

Country Status (4)

Country Link
JP (1) JPWO2023145156A1 (cg-RX-API-DMAC7.html)
CN (1) CN118542078A (cg-RX-API-DMAC7.html)
TW (1) TW202330287A (cg-RX-API-DMAC7.html)
WO (1) WO2023145156A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102770266B1 (ko) * 2023-08-09 2025-02-21 (주)코아링크 단색 또는 다색 구현이 가능한 컬러 로고 마스크 제조방법 및 그로부터 제조되는 컬러 로고 마스크

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028160B2 (ja) * 1981-12-07 1985-07-03 三井東圧化学株式会社 導電回路の形成方法
JP2002341525A (ja) * 2001-05-14 2002-11-27 Fuji Photo Film Co Ltd ポジ型フォトレジスト転写材料およびそれを用いた基板表面の加工方法
JP2003309337A (ja) * 2002-04-16 2003-10-31 Fujikura Ltd プリント回路基板
JP2004230729A (ja) * 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2010056179A (ja) * 2008-08-26 2010-03-11 Panasonic Electric Works Co Ltd 導体形成シート及び導体形成シートを用いた配線板の製造方法
JP2014027211A (ja) * 2012-07-30 2014-02-06 Jsr Corp 配線基板の製造方法およびシード層形成用組成物
JP7769468B2 (ja) * 2019-12-13 2025-11-13 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム

Also Published As

Publication number Publication date
CN118542078A (zh) 2024-08-23
JPWO2023145156A1 (cg-RX-API-DMAC7.html) 2023-08-03
WO2023145156A1 (ja) 2023-08-03

Similar Documents

Publication Publication Date Title
JP2026042825A (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム
KR20250008081A (ko) 전사 필름, 패턴의 형성 방법, 및 회로 배선의 제조 방법
TW202330287A (zh) 轉印膜及導體圖案形成方法
JP7836291B2 (ja) 積層体の製造方法、回路配線の製造方法
TWI884231B (zh) 感光性轉印材料、樹脂圖案的製造方法、電路配線的製造方法及觸控面板的製造方法
TW202309662A (zh) 感光性組成物、感光性組成物層、轉印膜、具有導體圖案之積層體之製造方法
TW202325543A (zh) 沉積遮罩製造用感光性轉印材料及沉積遮罩之製造方法
JP2023007384A (ja) 積層体、転写フィルム、パターン形成方法、回路配線の製造方法
CN116917122A (zh) 转印膜及导体图案的制造方法
WO2022181611A1 (ja) 導体パターンを有する積層体の製造方法
CN116157741A (zh) 转印膜、层叠体的制造方法、电路配线的制造方法
CN116018262A (zh) 感光性转印材料、树脂图案的制造方法、蚀刻方法及电子器件的制造方法
CN115087927A (zh) 感光性薄膜以及感光性薄膜的制造方法
JP7848140B2 (ja) 積層体の製造方法、回路配線の製造方法、転写フィルム
TWI921429B (zh) 轉印材料及積層體之製造方法
JP7787089B2 (ja) 転写フィルム、積層体の製造方法、回路配線の製造方法
TWI904311B (zh) 轉印材料及積層體之製造方法
CN115485621B (zh) 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
TW202311872A (zh) 具有導體圖案之積層體之製造方法、轉印膜
TW202311049A (zh) 轉印膜、具有導體圖案之積層體之製造方法
TW202307026A (zh) 轉印膜及具有導體圖案之積層體之製造方法
TW202334748A (zh) 轉印膜、具有導體圖案的積層體、具有導體圖案的積層體的製造方法、轉印膜的製造方法
JP2024139429A (ja) 巻回体、樹脂パターンの製造方法、導体パターンを有する積層体の製造方法
TW202513307A (zh) 感光性轉印材料及其製造方法
CN116917123A (zh) 转印膜以及导体图案的制造方法