TW202328390A - 黏著劑組成物、硬化物及熱剝離型黏著薄片 - Google Patents

黏著劑組成物、硬化物及熱剝離型黏著薄片 Download PDF

Info

Publication number
TW202328390A
TW202328390A TW111133698A TW111133698A TW202328390A TW 202328390 A TW202328390 A TW 202328390A TW 111133698 A TW111133698 A TW 111133698A TW 111133698 A TW111133698 A TW 111133698A TW 202328390 A TW202328390 A TW 202328390A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
meth
ethylenically unsaturated
group
acrylate
Prior art date
Application number
TW111133698A
Other languages
English (en)
Chinese (zh)
Inventor
池谷達宏
佐佐木一博
中西健一
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202328390A publication Critical patent/TW202328390A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/067Polyurethanes; Polyureas
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/50Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111133698A 2021-09-10 2022-09-06 黏著劑組成物、硬化物及熱剝離型黏著薄片 TW202328390A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-147416 2021-09-10
JP2021147416 2021-09-10

Publications (1)

Publication Number Publication Date
TW202328390A true TW202328390A (zh) 2023-07-16

Family

ID=85506638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133698A TW202328390A (zh) 2021-09-10 2022-09-06 黏著劑組成物、硬化物及熱剝離型黏著薄片

Country Status (5)

Country Link
JP (1) JPWO2023037914A1 (ko)
KR (1) KR20240039184A (ko)
CN (1) CN117957295A (ko)
TW (1) TW202328390A (ko)
WO (1) WO2023037914A1 (ko)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5049485B2 (ja) 2005-11-08 2012-10-17 ソマール株式会社 粘着剤組成物及び粘着シート
JP5481324B2 (ja) * 2010-09-06 2014-04-23 日東電工株式会社 発泡粘着体
JP2012052038A (ja) * 2010-09-01 2012-03-15 Nitto Denko Corp 電子部品製造工程用仮固定シート
JP6153806B2 (ja) 2013-07-30 2017-06-28 ソマール株式会社 粘着剤組成物及び粘着シート
JP2019116609A (ja) 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
CN113631379A (zh) * 2019-03-28 2021-11-09 琳得科株式会社 粘合片、粘合片的制造方法及半导体装置的制造方法
JPWO2020196757A1 (ko) * 2019-03-28 2020-10-01
WO2020196758A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法

Also Published As

Publication number Publication date
WO2023037914A1 (ja) 2023-03-16
CN117957295A (zh) 2024-04-30
JPWO2023037914A1 (ko) 2023-03-16
KR20240039184A (ko) 2024-03-26

Similar Documents

Publication Publication Date Title
EP2325274B1 (en) Pressure-sensitive adhesive sheet
US9534151B2 (en) Sheet and adhesive sheet
JP5232736B2 (ja) 複合フィルム
JP5399625B2 (ja) 複合フィルム
JP2018039999A (ja) 紫外線硬化型粘着剤、硬化物、粘着シート
JP6075009B2 (ja) 加飾ハードコートフィルム及び加飾ハードコート粘着フィルム。
WO2012128311A1 (ja) 基材フィルムおよび該基材フィルムを備えた粘着シート
JP6528259B2 (ja) 表面保護フィルム
KR20080098497A (ko) 도막 보호 시트
JP2008159437A (ja) 一液型光硬化湿気硬化併用コーティング剤、それで絶縁処理された電気・電子部品、及びその製造方法
TW201936819A (zh) 黏著片及其製造方法、以及圖像顯示裝置之製造方法
WO2018181511A1 (ja) 粘着シートの剥離方法
JP2018095770A (ja) 光硬化性組成物、及び粘着シート
JP2022160306A (ja) 活性エネルギー線硬化性剥離型粘着剤組成物および剥離型粘着シート
JP2004010662A (ja) 複合フィルムとその製造方法および粘着シート
WO2012005221A1 (ja) 多層シートの製造方法および多層シート
WO2011024925A1 (ja) 粘着テープまたはシート用基材、および、粘着テープまたはシート
TW202328390A (zh) 黏著劑組成物、硬化物及熱剝離型黏著薄片
JP7453831B2 (ja) 自己修復性を有する積層体およびその製造方法、ならびにその使用方法
JP2013159692A (ja) シートおよび該シートを用いた粘着シート
JP2021155724A (ja) 活性エネルギー線硬化型粘着剤組成物、粘着剤層、積層体
KR102509251B1 (ko) 점착 시트
JP2020147739A (ja) 粘着シートおよびその製造方法、ならびに画像表示装置
WO2016027908A1 (ja) 表面保護フィルム
JP7338299B2 (ja) 光硬化性粘着剤組成物および粘着シート