TW202323309A - 感光性樹脂組成物、感光性元件及積層體之製造方法 - Google Patents

感光性樹脂組成物、感光性元件及積層體之製造方法 Download PDF

Info

Publication number
TW202323309A
TW202323309A TW111140381A TW111140381A TW202323309A TW 202323309 A TW202323309 A TW 202323309A TW 111140381 A TW111140381 A TW 111140381A TW 111140381 A TW111140381 A TW 111140381A TW 202323309 A TW202323309 A TW 202323309A
Authority
TW
Taiwan
Prior art keywords
mass
less
photosensitive resin
resin composition
meth
Prior art date
Application number
TW111140381A
Other languages
English (en)
Chinese (zh)
Inventor
田中志歩
小野敬司
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202323309A publication Critical patent/TW202323309A/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
TW111140381A 2021-10-26 2022-10-25 感光性樹脂組成物、感光性元件及積層體之製造方法 TW202323309A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2021/039426 2021-10-26
PCT/JP2021/039426 WO2023073799A1 (ja) 2021-10-26 2021-10-26 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Publications (1)

Publication Number Publication Date
TW202323309A true TW202323309A (zh) 2023-06-16

Family

ID=84336329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111140381A TW202323309A (zh) 2021-10-26 2022-10-25 感光性樹脂組成物、感光性元件及積層體之製造方法

Country Status (6)

Country Link
US (1) US20250004369A1 (https=)
JP (2) JPWO2023074630A1 (https=)
KR (2) KR20240090270A (https=)
CN (2) CN115469510A (https=)
TW (1) TW202323309A (https=)
WO (3) WO2023073799A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4935833B2 (ja) * 2009-01-23 2012-05-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP5327310B2 (ja) * 2009-02-26 2013-10-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010249884A (ja) * 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
JP5387896B2 (ja) * 2009-06-05 2014-01-15 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
WO2012067107A1 (ja) * 2010-11-17 2012-05-24 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US9482946B2 (en) * 2011-03-30 2016-11-01 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device
KR20160039579A (ko) * 2013-08-02 2016-04-11 히타치가세이가부시끼가이샤 감광성 수지 조성물
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2016031413A (ja) * 2014-07-28 2016-03-07 日立化成株式会社 レーザー直描露光用感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
WO2017043544A1 (ja) * 2015-09-11 2017-03-16 旭化成株式会社 感光性樹脂組成物
JP6828546B2 (ja) * 2017-03-23 2021-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2019028398A (ja) 2017-08-03 2019-02-21 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及び、プリント配線板の製造方法
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
WO2021137467A1 (ko) * 2019-12-31 2021-07-08 코오롱인더스트리 주식회사 감광성 수지층, 이를 이용한 드라이 필름 포토레지스트, 및 감광성 엘리먼트
CN112433445B (zh) * 2020-11-06 2023-12-26 福斯特(安吉)新材料有限公司 一种用于uv led光源打标的感光性树脂组合物及干膜抗蚀剂
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Also Published As

Publication number Publication date
KR20240090271A (ko) 2024-06-21
WO2023073799A1 (ja) 2023-05-04
WO2023074630A1 (ja) 2023-05-04
CN115469510A (zh) 2022-12-13
WO2023074629A1 (ja) 2023-05-04
CN115524924A (zh) 2022-12-27
JPWO2023074629A1 (https=) 2023-05-04
JPWO2023074630A1 (https=) 2023-05-04
KR20240090270A (ko) 2024-06-21
US20250004369A1 (en) 2025-01-02

Similar Documents

Publication Publication Date Title
JPWO2012101908A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法
JPWO2010098175A1 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US20230145264A1 (en) Photosensitive resin composition, photosensitive element, and method for producing wiring board
TW202246897A (zh) 感光性薄膜、感光性元件及積層體之製造方法
TW202323309A (zh) 感光性樹脂組成物、感光性元件及積層體之製造方法
WO2024210041A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及び配線基板の製造方法
TW202406943A (zh) 鹼可溶性樹脂、感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法、及印刷線路板之製造方法
TW202323308A (zh) 感光性樹脂組成物、感光性元件及積層體之製造方法
TW202244078A (zh) 感光性樹脂組成物、感光性元件及積層體之製造方法
JP2010085605A (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
EP4692936A1 (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
TW202530869A (zh) 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
WO2025070065A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び配線基板の製造方法
TW202427056A (zh) 感光性元件及配線基板之製造方法
KR20250095735A (ko) 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 및 프린트 배선판의 제조 방법
WO2025220085A1 (ja) 感光性エレメント、レジストパターンの形成方法、及び配線基板の製造方法
WO2026028349A1 (ja) 感光性エレメント、レジストパターンの形成方法及び配線基板の製造方法
WO2024195502A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及び配線基板の製造方法