KR20240090270A - 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법 - Google Patents

감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법 Download PDF

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KR20240090270A
KR20240090270A KR1020247014269A KR20247014269A KR20240090270A KR 20240090270 A KR20240090270 A KR 20240090270A KR 1020247014269 A KR1020247014269 A KR 1020247014269A KR 20247014269 A KR20247014269 A KR 20247014269A KR 20240090270 A KR20240090270 A KR 20240090270A
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South Korea
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mass
photosensitive resin
less
resin composition
component
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KR1020247014269A
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English (en)
Korean (ko)
Inventor
시호 다나카
게이시 오노
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가부시끼가이샤 레조낙
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
KR1020247014269A 2021-10-26 2022-10-24 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법 Pending KR20240090270A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2021/039426 2021-10-26
PCT/JP2021/039426 WO2023073799A1 (ja) 2021-10-26 2021-10-26 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法
PCT/JP2022/039545 WO2023074629A1 (ja) 2021-10-26 2022-10-24 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Publications (1)

Publication Number Publication Date
KR20240090270A true KR20240090270A (ko) 2024-06-21

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KR1020247014269A Pending KR20240090270A (ko) 2021-10-26 2022-10-24 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법
KR1020247014270A Pending KR20240090271A (ko) 2021-10-26 2022-10-24 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

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KR1020247014270A Pending KR20240090271A (ko) 2021-10-26 2022-10-24 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

Country Status (6)

Country Link
US (1) US20250004369A1 (https=)
JP (2) JPWO2023074630A1 (https=)
KR (2) KR20240090270A (https=)
CN (2) CN115469510A (https=)
TW (1) TW202323309A (https=)
WO (3) WO2023073799A1 (https=)

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WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2019028398A (ja) 2017-08-03 2019-02-21 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及び、プリント配線板の製造方法

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JP4935833B2 (ja) * 2009-01-23 2012-05-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP5327310B2 (ja) * 2009-02-26 2013-10-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010249884A (ja) * 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
JP5387896B2 (ja) * 2009-06-05 2014-01-15 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
WO2012067107A1 (ja) * 2010-11-17 2012-05-24 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US9482946B2 (en) * 2011-03-30 2016-11-01 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device
KR20160039579A (ko) * 2013-08-02 2016-04-11 히타치가세이가부시끼가이샤 감광성 수지 조성물
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2016031413A (ja) * 2014-07-28 2016-03-07 日立化成株式会社 レーザー直描露光用感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
WO2017043544A1 (ja) * 2015-09-11 2017-03-16 旭化成株式会社 感光性樹脂組成物
JP6828546B2 (ja) * 2017-03-23 2021-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
WO2021137467A1 (ko) * 2019-12-31 2021-07-08 코오롱인더스트리 주식회사 감광성 수지층, 이를 이용한 드라이 필름 포토레지스트, 및 감광성 엘리먼트
CN112433445B (zh) * 2020-11-06 2023-12-26 福斯特(安吉)新材料有限公司 一种用于uv led光源打标的感光性树脂组合物及干膜抗蚀剂
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Patent Citations (1)

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JP2019028398A (ja) 2017-08-03 2019-02-21 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及び、プリント配線板の製造方法

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Publication number Publication date
KR20240090271A (ko) 2024-06-21
WO2023073799A1 (ja) 2023-05-04
TW202323309A (zh) 2023-06-16
WO2023074630A1 (ja) 2023-05-04
CN115469510A (zh) 2022-12-13
WO2023074629A1 (ja) 2023-05-04
CN115524924A (zh) 2022-12-27
JPWO2023074629A1 (https=) 2023-05-04
JPWO2023074630A1 (https=) 2023-05-04
US20250004369A1 (en) 2025-01-02

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