JPWO2023074630A1 - - Google Patents

Info

Publication number
JPWO2023074630A1
JPWO2023074630A1 JP2023556430A JP2023556430A JPWO2023074630A1 JP WO2023074630 A1 JPWO2023074630 A1 JP WO2023074630A1 JP 2023556430 A JP2023556430 A JP 2023556430A JP 2023556430 A JP2023556430 A JP 2023556430A JP WO2023074630 A1 JPWO2023074630 A1 JP WO2023074630A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556430A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074630A1 publication Critical patent/JPWO2023074630A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP2023556430A 2021-10-26 2022-10-24 Pending JPWO2023074630A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2021/039426 WO2023073799A1 (ja) 2021-10-26 2021-10-26 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法
PCT/JP2022/039546 WO2023074630A1 (ja) 2021-10-26 2022-10-24 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023074630A1 true JPWO2023074630A1 (ja) 2023-05-04

Family

ID=84336329

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023556429A Pending JPWO2023074629A1 (ja) 2021-10-26 2022-10-24
JP2023556430A Pending JPWO2023074630A1 (ja) 2021-10-26 2022-10-24

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2023556429A Pending JPWO2023074629A1 (ja) 2021-10-26 2022-10-24

Country Status (4)

Country Link
JP (2) JPWO2023074629A1 (ja)
CN (2) CN115524924A (ja)
TW (1) TW202323309A (ja)
WO (3) WO2023073799A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4935833B2 (ja) * 2009-01-23 2012-05-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP2010249884A (ja) * 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
JP5387896B2 (ja) * 2009-06-05 2014-01-15 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
KR20130088166A (ko) * 2010-11-17 2013-08-07 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
US9482946B2 (en) * 2011-03-30 2016-11-01 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device
CN105431778A (zh) * 2013-08-02 2016-03-23 日立化成株式会社 感光性树脂组合物
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2016031413A (ja) * 2014-07-28 2016-03-07 日立化成株式会社 レーザー直描露光用感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
JP6828546B2 (ja) * 2017-03-23 2021-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Also Published As

Publication number Publication date
CN115524924A (zh) 2022-12-27
WO2023074630A1 (ja) 2023-05-04
WO2023074629A1 (ja) 2023-05-04
WO2023073799A1 (ja) 2023-05-04
TW202323309A (zh) 2023-06-16
JPWO2023074629A1 (ja) 2023-05-04
CN115469510A (zh) 2022-12-13

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