TW202317669A - 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法 - Google Patents

密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法 Download PDF

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Publication number
TW202317669A
TW202317669A TW111150208A TW111150208A TW202317669A TW 202317669 A TW202317669 A TW 202317669A TW 111150208 A TW111150208 A TW 111150208A TW 111150208 A TW111150208 A TW 111150208A TW 202317669 A TW202317669 A TW 202317669A
Authority
TW
Taiwan
Prior art keywords
sealing
resin composition
compound
formula
support
Prior art date
Application number
TW111150208A
Other languages
English (en)
Chinese (zh)
Inventor
井上英俊
竝木裕司
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202317669A publication Critical patent/TW202317669A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111150208A 2017-06-29 2018-06-29 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法 TW202317669A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-127855 2017-06-29
JP2017127855 2017-06-29
JP2017-127852 2017-06-29
JP2017-127856 2017-06-29
JP2017127852 2017-06-29
JP2017127856 2017-06-29

Publications (1)

Publication Number Publication Date
TW202317669A true TW202317669A (zh) 2023-05-01

Family

ID=64741613

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111150208A TW202317669A (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法
TW107122469A TWI790246B (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107122469A TWI790246B (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法

Country Status (4)

Country Link
JP (2) JPWO2019004458A1 (ja)
CN (1) CN110719935A (ja)
TW (2) TW202317669A (ja)
WO (1) WO2019004458A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020136600A (ja) * 2019-02-25 2020-08-31 東レ株式会社 半導体または電子部品製造用粘着フィルムならびに半導体または電子部品の製造方法
JP7452028B2 (ja) * 2020-01-23 2024-03-19 株式会社レゾナック 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP2862777B2 (ja) * 1993-11-05 1999-03-03 住友ベークライト株式会社 エポキシ樹脂組成物
JPH07242799A (ja) * 1994-09-19 1995-09-19 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JP2003292739A (ja) * 2002-04-08 2003-10-15 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
JP2008163116A (ja) * 2006-12-27 2008-07-17 Wacker Asahikasei Silicone Co Ltd 半導体封止用樹脂組成物および半導体装置
WO2011125624A1 (ja) * 2010-03-31 2011-10-13 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP6315170B2 (ja) * 2013-09-30 2018-04-25 ナガセケムテックス株式会社 半導体封止用エポキシ樹脂組成物、半導体実装構造体、およびその製造方法
KR20170121171A (ko) * 2015-02-26 2017-11-01 히타치가세이가부시끼가이샤 봉지용 필름 및 이것을 사용한 전자 부품 장치
JP6436107B2 (ja) * 2015-03-10 2018-12-12 住友ベークライト株式会社 封止用樹脂組成物、電子部品の製造方法、および電子部品

Also Published As

Publication number Publication date
JPWO2019004458A1 (ja) 2020-04-30
CN110719935A (zh) 2020-01-21
JP2023054037A (ja) 2023-04-13
WO2019004458A1 (ja) 2019-01-03
TW201905103A (zh) 2019-02-01
TWI790246B (zh) 2023-01-21

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