TW202302831A - 基板的製造方法及表面處理方法 - Google Patents

基板的製造方法及表面處理方法 Download PDF

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Publication number
TW202302831A
TW202302831A TW111100937A TW111100937A TW202302831A TW 202302831 A TW202302831 A TW 202302831A TW 111100937 A TW111100937 A TW 111100937A TW 111100937 A TW111100937 A TW 111100937A TW 202302831 A TW202302831 A TW 202302831A
Authority
TW
Taiwan
Prior art keywords
water
surface treatment
soluble polymer
grinding
polished
Prior art date
Application number
TW111100937A
Other languages
English (en)
Chinese (zh)
Inventor
鈴木啓太
渡邊優一
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202302831A publication Critical patent/TW202302831A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW111100937A 2021-03-31 2022-01-10 基板的製造方法及表面處理方法 TW202302831A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021059470A JP2022155989A (ja) 2021-03-31 2021-03-31 基板の製造方法および表面処理方法
JP2021-059470 2021-03-31

Publications (1)

Publication Number Publication Date
TW202302831A true TW202302831A (zh) 2023-01-16

Family

ID=83558673

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111100937A TW202302831A (zh) 2021-03-31 2022-01-10 基板的製造方法及表面處理方法

Country Status (3)

Country Link
JP (1) JP2022155989A (ja)
KR (1) KR102650639B1 (ja)
TW (1) TW202302831A (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI437938B (zh) 2007-03-01 2014-05-11 Ajinomoto Kk A method of manufacturing a circuit board, a subsequent thin film to which a metal film is attached, and a circuit board
CN105451940B (zh) * 2013-08-09 2018-12-11 福吉米株式会社 研磨完的研磨对象物的制造方法及研磨用组合物试剂盒
JP6495230B2 (ja) * 2016-12-22 2019-04-03 花王株式会社 シリコンウェーハ用リンス剤組成物
JP7495283B2 (ja) 2019-09-06 2024-06-04 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法

Also Published As

Publication number Publication date
JP2022155989A (ja) 2022-10-14
KR102650639B1 (ko) 2024-03-21
KR20220136084A (ko) 2022-10-07

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