TW202301531A - Substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program - Google Patents
Substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
Description
本揭示,係關於基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式。The disclosure relates to a substrate transfer device, a coating processing device, a substrate transfer method, and a substrate transfer program.
在專利文獻1,係揭示有如下述內容:沿著在基板之搬送方向上延伸的兩根導引軌搬送基板,並將機能液的液滴吐出至基板。
[先前技術文獻]
[專利文獻]
[專利文獻1] 日本特開2018-126718號公報[Patent Document 1] Japanese Patent Laid-Open No. 2018-126718
[本發明所欲解決之課題][Problems to be Solved by the Invention]
本揭示,係提供一種使基板搬送中之誤差減少的技術。 [用以解決課題之手段] The present disclosure provides a technique for reducing errors in substrate transfer. [Means to solve the problem]
本揭示之一態樣的基板搬送裝置,係具備有:一對導引軌;第1移動部;第2移動部;複數個保持部;間隔測定部;及控制部。一對導引軌,係被排列於第1方向且沿著與第1方向正交的第2方向延伸。第1移動部,係沿著一對導引軌中之一方的導引軌移動。第2移動部,係沿著一對導引軌中之另一方的導引軌移動。複數個保持部,係分別被設置於第1移動部及第2移動部上,從基板的下方吸附保持基板。間隔測定部,係測定複數個保持部中之相鄰的保持部間之距離。控制部,係控制第1移動部、第2移動部及複數個保持部。複數個保持部,係具備有:吸附部,吸附保持基板;及調整部,調整吸附部的位置。控制部,係以在第1移動部及第2移動部沿著一對導引軌移動的期間,使間隔測定部之測定結果成為固定的方式,一邊控制調整部來調整吸附部之位置,一邊搬送基板。 [發明之效果] A substrate transfer device according to an aspect of the present disclosure includes: a pair of guide rails; a first moving part; a second moving part; a plurality of holding parts; a distance measuring part; and a control part. The pair of guide rails are arranged in a first direction and extend along a second direction perpendicular to the first direction. The first moving part moves along one of the pair of guide rails. The second moving part moves along the other guide rail of the pair of guide rails. The plurality of holding parts are respectively provided on the first moving part and the second moving part, and suck and hold the substrate from below the substrate. The distance measuring unit measures the distance between adjacent holding parts among the plurality of holding parts. The control unit controls the first moving unit, the second moving unit and the plurality of holding units. The plurality of holding parts are provided with: a suction part for holding the substrate by suction; and an adjustment part for adjusting the position of the suction part. The control part controls the adjusting part to adjust the position of the suction part while the first moving part and the second moving part move along the pair of guide rails so that the measurement result of the distance measuring part becomes fixed. Transport the substrate. [Effect of Invention]
根據本揭示,可使基板搬送中之誤差減少。According to the present disclosure, errors in substrate transfer can be reduced.
以下,參閱附加圖面,詳細地說明本申請案所揭示之基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式的實施形態。另外,並非藉由以下所示之實施形態來限定所揭示的基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式。Hereinafter, with reference to the attached drawings, embodiments of the substrate conveying device, the coating processing device, the substrate conveying method, and the substrate conveying program disclosed in this application will be described in detail. In addition, the disclosed substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program are not limited by the embodiments described below.
在以下參閱的各圖面中,係為了容易理解說明,而表示「規定相互正交之X軸方向、Y軸方向及Z軸方向,並將Z軸正方向設成為垂直向上方向」的正交座標系統。In each of the drawings referred to below, for the sake of easy understanding of the description, the orthogonality of "regulating the mutually orthogonal X-axis direction, Y-axis direction, and Z-axis direction, and setting the positive direction of the Z-axis as the vertical upward direction" is shown. coordinate system.
又,在此,係規定前後方向並規定左右方向,該前後方向,係將Y軸正方向設成為前方,將Y軸負方向設成為後方,該左右方向,係將X軸正方向設成為右方,將X軸負方向設成為左方。又,規定上下方向,該上下方向,係將Z軸正方向設成為上方,將Z軸負方向設成為下方。基板處理裝置1,係一邊從後方朝向前方沿著前後方向搬送基板S,一邊處理基板S。亦即,基板處理裝置1,係一邊沿著搬送方向(Y軸方向)搬送基板S,一邊處理基板S。Here, the front-rear direction is defined and the left-right direction is defined. In the front-rear direction, the positive direction of the Y-axis is defined as the front, and the negative direction of the Y-axis is defined as the rear. In the left-right direction, the positive direction of the X-axis is defined as the right. Set the negative direction of the X axis to the left. In addition, the up-down direction is defined, and in the up-down direction, the positive direction of the Z-axis is defined as upward, and the negative direction of the Z-axis is defined as downward. The
<整體構成>
參閱圖1,說明關於實施形態之基板處理裝置1的整體構成。圖1,係表示實施形態的基板處理裝置1之一部分的示意平面圖。基板處理裝置1,係一邊沿水平方向搬送工件即基板S,一邊以噴墨方式對基板S進行描繪。基板S,係例如被使用於平板顯示器的基板。
<Overall composition>
Referring to FIG. 1, the overall configuration of a
基板處理裝置1,係具備有:上浮平台2(平台部之一例);第1導引軌3_1;及第2導引軌3_2。又,基板處理裝置1,係具備有:第1移動部4_1;第2移動部4_2;第1保持部5_1;第2保持部5_2;第3保持部5_3;及第4保持部5_4。又,基板處理裝置1,係具備有:複數個塗佈部6;維護部7;及控制裝置8。The
另外,以下,係有時將第1導引軌3_1及第2導引軌3_2統稱記載為「導引軌3」。又,有時將第1移動部4_1及第2移動部4_2統稱記載為「移動部4」。又,有時將第1保持部5_1~第4保持部5_4統稱記載為「保持部5」。In addition, below, the 1st guide rail 3_1 and the 2nd guide rail 3_2 may be collectively described as "the
上浮平台2,係具有多數個噴出口(未圖示)。上浮平台2,係從噴出口朝向基板S之下面噴吹經壓縮的氣體(例如空氣),對基板S賦予作用於上方的力(以下,記載為「上浮力」)。上浮平台2,係以賦予上浮力的方式,調整被保持於保持部5的吸附部55(參閱圖2)之基板S的上浮高度。亦即,上浮平台2,係從下方對被保持於保持部5的吸附部55之基板S噴吹氣體,調整基板S的上浮高度。The
上浮平台2,係包含有搬入基板S的搬入平台及搬出基板S的搬出平台。搬入平台,係被設置於基板處理裝置1的後方側(Y軸負方向側)。搬出平台,係被設置於基板處理裝置1的前方側(Y軸正方向側)。The
另外,上浮平台2,係亦可沿著搬送方向(Y軸方向)設置複數個。位於塗佈部6之下方的上浮平台2上之基板S的上浮高度之範圍,係比其他的上浮平台2上之基板S的上浮高度之範圍窄。例如,位於塗佈部6之下方的上浮平台2上之基板S的上浮高度之範圍,係30~60μm。其他的上浮平台2上之基板S的上浮高度之範圍,係200~2000μm。In addition, a plurality of
例如,在位於塗佈部6之下方的上浮平台2中,係亦可藉由「朝向基板S之下面吐出經壓縮的空氣,並且吸引基板S與上浮平台2之間的空氣」的方式,調整基板S的上浮高度。For example, in the
第1導引軌3_1及第2導引軌3_2,係被排列於左右方向(X軸方向)且沿著搬送方向(Y軸方向)延伸。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arranged in the left-right direction (X-axis direction), and extend along a conveyance direction (Y-axis direction).
第1導引軌3_1及第2導引軌3_2,係被配置為在左右方向(X軸方向)夾著上浮平台2。第1導引軌3_1,係被配置於上浮平台2的X軸正方向側,第2導引軌3_2,係被配置於上浮平台2的X軸負方向側。第1導引軌3_1及第2導引軌3_2,係例如藉由花崗岩所構成。與搬送方向(Y軸方向)正交之導引軌3的剖面,係例如矩形狀。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arrange|positioned so that the
第1移動部4_1,係被設置於第1導引軌3_1上,沿著第1導引軌3_1移動。第2移動部4_2,係被設置於第2導引軌3_2上,沿著第2導引軌3_2移動。另外,第1移動部4_1及第2移動部4_2,係分別具有馬達等的驅動部,可各自獨立地移動。The 1st moving part 4_1 is installed on the 1st guide rail 3_1, and moves along the 1st guide rail 3_1. The 2nd moving part 4_2 is installed on the 2nd guide rail 3_2, and moves along the 2nd guide rail 3_2. In addition, the 1st moving part 4_1 and the 2nd moving part 4_2 each have a drive part, such as a motor, and can move independently.
複數個保持部5,係分別被設置於第1移動部4_1及第2移動部4_2上,從基板S的下方吸附保持基板S。The plurality of
具體而言,複數個保持部5中之第1保持部5_1及第2保持部5_2,係被設置於第1移動部4_1上,第3保持部5_3及第4保持部5_4,係被設置於第2移動部4_2上。第1保持部5_1及第2保持部5_2,係在第1移動部4_1上,沿著搬送方向(Y軸方向)以第1保持部5_1及第2保持部5_2的順序排列。又,第3保持部5_3及第4保持部5_4,係在第2移動部4_2上,沿著搬送方向(Y軸方向)以第3保持部5_3及第4保持部5_4的順序排列。另外,複數個保持部5之數量,係並不限定於四個。Specifically, among the plurality of
在實施形態中,複數個(在此,係四個)保持部5,係從基板S之下方吸附保持基板S的四角。基板S,係在藉由複數個保持部5保持四角且藉由上浮平台2而上浮的狀態下,藉由第1移動部4_1及第2移動部4_2,沿著搬送方向(Y軸正方向)搬送。In the embodiment, a plurality of (here, four) holding
塗佈部6,係對沿著搬送方向(Y軸正方向)所搬送的基板S塗佈機能液。機能液,係墨水。塗佈部6,係對藉由上浮平台2(平台部之一例)調整了上浮高度的基板S塗佈機能液。具體而言,塗佈部6,係藉由對基板S吐出機能液的方式,對基板S塗佈機能液。塗佈部6,係沿著左右方向(X軸方向)配置複數個。在圖1所示之例子中,係雖表示沿著左右方向(X軸方向)配置了七個塗佈部6的狀態,但塗佈部6之數量並不限於此。塗佈部6,係具有吐出機能液的複數個頭部,將機能液從各頭部吐出至基板S。The coating unit 6 is for coating the functional liquid on the substrate S being transported along the transport direction (Y-axis positive direction). Functional fluid, ink. The coating unit 6 applies the functional liquid to the substrate S whose floating height is adjusted by the floating platform 2 (an example of the platform unit). Specifically, the application unit 6 applies the functional liquid to the substrate S by discharging the functional liquid onto the substrate S. A plurality of application parts 6 are arranged along the left-right direction (X-axis direction). In the example shown in FIG. 1 , although seven application parts 6 are arranged along the left-right direction (X-axis direction), the number of application parts 6 is not limited to this. The application unit 6 has a plurality of heads for discharging the functional liquid, and discharges the functional liquid onto the substrate S from each head.
塗佈部6,係可沿著被排列於Y軸方向且沿著X軸方向延伸的一對軌道9移動。一對軌道9,係例如被設置為相對於上浮平台2向右方延伸。在上浮平台2之右方的一對軌道9間,係設置有維護部7。塗佈部6,係可在成為維護部7之上方的位置與對基板S吐出機能液的位置之間移動。塗佈部6,係藉由驅動裝置例如線性馬達,沿著一對軌道9在左右方向移動。複數個塗佈部6,係亦可獨立地在左右方向移動,且亦可一體地在左右方向移動。The applicator 6 is movable along a pair of
維護部7,係進行塗佈部6之頭部的維護,解除或防止塗佈部6之頭部的吐出不良等。另外,維護部7,係亦可被設置於上浮平台2的上方。The
控制裝置8,係例如電腦,具備有控制部81與記憶部82。在記憶部82,係儲存有控制在基板處理裝置1中所執行之各種處理的程式。控制部81,係藉由讀出並執行被記憶於記憶部82之程式(基板搬送程式之一例)的方式,控制基板處理裝置1的動作。The
另外,該程式,係被記錄於可藉由電腦而讀取的記憶媒體者,且亦可為從記憶媒體被安裝於控制裝置8的記憶部82者。作為電腦可讀取之記憶媒體,係例如有硬碟(HD)、軟碟片(FD)、光碟(CD)、磁光碟(MO)、記憶卡等。In addition, the program is recorded on a storage medium that can be read by a computer, and may be installed in the memory unit 82 of the
<保持部>
其次,參閱圖2及圖3,說明關於保持部5的構成。圖2,係實施形態之保持部5的示意平面圖。又,圖3,係實施形態之保持部5的示意側視圖。另外,在圖2及圖3,係雖表示第1保持部5_1作為一例,但第2保持部5_2~第4保持部5_4的構成亦與第1保持部5_1相同。
<Maintenance Department>
Next, referring to FIG. 2 and FIG. 3 , the configuration of the holding
如圖2及圖3所示般,保持部5,係具備有:基底部50;第1調整部51;第2調整部52;轉動部53;臂部54;及吸附部55。As shown in FIGS. 2 and 3 , the holding
吸附部55,係吸附保持基板S。具體而言,吸附部55,係具備有:複數個吸附盤551。複數個吸附盤551,係被排列設置於水平方向(在此,係Y軸方向)。另外,在此,係雖表示吸附部55具備有三個吸附盤551時的例子,但吸附盤551之數量並不限定於三個。吸附部55,係藉由複數個吸附盤551,吸附基板S的下面並保持基板S。The
基底部50、第1調整部51、第2調整部52、轉動部53及臂部54,係調整吸附部55相對於移動部4之相對位置的調整部之一例。The
基底部50,係被固定於移動部4上。第1調整部51,係被設置於基底部50上,可在基底部50上沿著左右方向(X軸方向)移動。第2調整部52,係被設置於第1調整部51上,可在第1調整部51上沿著前後方向(Y軸方向)移動。轉動部53,係被設置於第2調整部52上,可繞垂直軸(Z軸)旋轉。臂部54,係延伸於水平方向的構件,在基端部被支撐於轉動部53,並在前端部支撐吸附部55。The
如此一來,調整部,係使第1調整部51沿著左右方向(X軸方向)移動,藉此,可使吸附部55在左右方向(X軸方向)移動。亦即,第1調整部51,係可沿著左右方向(X軸方向),調整吸附部55相對於移動部4的位置。In this way, the adjustment unit moves the
又,調整部,係使第2調整部52沿著前後方向(Y軸方向)移動,藉此,可使吸附部55在前後方向(Y軸方向)移動。亦即,第2調整部52,係可沿著前後方向(Y軸方向),調整吸附部55相對於移動部4的位置。In addition, the adjustment unit moves the
又,調整部,係藉由轉動部53繞垂直軸(Z軸)轉動的方式,可使經由臂部54被支撐於轉動部53的吸附部55繞垂直軸(Z軸)轉動。亦即,轉動部53,係可在以垂直軸(Z軸方向)為中心之圓周方向上調整吸附部55相對於移動部4的位置。In addition, the adjusting part can rotate the
另外,第1調整部51及第2調整部52,係分別具有馬達等的驅動部,可各自獨立地移動。另一方面,轉動部53,係例如軸承且不具有驅動部,以追隨於第1調整部51及第2調整部52之動作的方式,使吸附部55轉動。另外,並不限於此,亦可在轉動部53設置驅動部。Moreover, the
然而,一對導引軌3,係沿著基板S的搬送方向即前後方向(Y軸方向)延伸。作為一例,一對導引軌3之前後方向(Y軸方向)上的長度,係3~7m左右。如此一來,由於一對導引軌3較長,因此,恐有難以完全筆直地形成且在左右方向(X軸方向)產生例如數μm左右的變形之虞。相同地,在一對導引軌3,係恐有在垂直方向(Z軸方向)亦產生數μm的變形之虞。又,即便假設可筆直地形成一對導引軌3,亦恐有因環境變化(例如,溫度變化)而事後產生變形之虞。However, the pair of
如此一來,當在一對導引軌3存在變形時,則恐有複數個(在此,係四個)保持部5的相對位置產生偏移之虞。關於該點,參閱圖4及圖5而進行說明。圖4,係表示「當在實施形態的導引軌3產生了左右方向上之變形的情況下,複數個保持部5之相對位置產生偏移」之態樣的示意圖。圖5,係表示「當在實施形態的導引軌3產生了垂直方向上之變形的情況下,複數個保持部5之相對位置產生偏移」之態樣的示意圖。In this way, when there is deformation in the pair of
另外,在圖4及圖5中,係以一點鏈線表示當在一對導引軌3未產生變形時的導引軌3及保持部5。如圖4及圖5中實線所示般,在圖4及圖5中,係為了容易理解而誇張地表示產生於一對導引軌3的變形。In addition, in FIG. 4 and FIG. 5 , the
又,以下,係將第1保持部5_1及第2保持部5_2間的距離記載為「第1間隔G1」,並將第3保持部5_3及第4保持部5_4間的距離記載為「第2間隔G2」。又,將第1保持部5_1及第3保持部5_3間的距離記載為「第3間隔G3」,並將第2保持部5_2及第4保持部5_4間的距離記載為「第4間隔G4」。Also, hereinafter, the distance between the first holding part 5_1 and the second holding part 5_2 is described as "the first gap G1", and the distance between the third holding part 5_3 and the fourth holding part 5_4 is described as "the second gap G1". Interval G2". In addition, the distance between the first holding part 5_1 and the third holding part 5_3 is described as "the third gap G3", and the distance between the second holding part 5_2 and the fourth holding part 5_4 is described as "the fourth gap G4". .
如圖4所示般,當在第1導引軌3_1產生左右方向(X軸方向)上之變形的情況下,第1保持部5_1及第2保持部5_2間的距離即第1間隔G1,係從在第1導引軌3_1未產生變形時的第1間隔G1發生變化。具體而言,在第1導引軌3_1產生變形時的第1間隔G1,係比在第1導引軌3_1未產生變形時的第1間隔G1短。此係關於第3保持部5_3及第4保持部5_4間的距離即第2間隔G2亦相同。As shown in FIG. 4, when the first guide rail 3_1 is deformed in the left-right direction (X-axis direction), the distance between the first holding part 5_1 and the second holding part 5_2, that is, the first gap G1, The system changes from the first gap G1 when the first guide rail 3_1 is not deformed. Specifically, the first interval G1 when the first guide rail 3_1 is deformed is shorter than the first interval G1 when the first guide rail 3_1 is not deformed. The same applies to the second gap G2 which is the distance between the third holding portion 5_3 and the fourth holding portion 5_4.
又,當在第1導引軌3_1產生左右方向(X軸方向)上之變形的情況下,設置於第1導引軌3_1側的保持部5與設置於第2導引軌3_2側的保持部5之間的距離亦發生變化。例如,在圖4所示之例子中,係因一對導引軌3之變形,第2保持部5_2及第4保持部5_4間的距離即第4間隔G4比在一對導引軌3沒有變形時的第4間隔G4長。另外,在此,係雖表示了第4間隔G4變長時的例子,但導引軌3變形時的第3間隔G3及第4間隔G4,係亦有時比導引軌3未變形時的第3間隔G3及第4間隔G4短。又,第3間隔G3及第4間隔G4之變化,係在一對導引軌3中之僅一方變形的情況下亦可能會產生。Also, when the first guide rail 3_1 is deformed in the left-right direction (X-axis direction), the holding
又,如圖5所示般,當在第1導引軌3_1產生垂直方向(Z軸方向)上之變形的情況下,第1間隔G1亦從在第1導引軌3_1未產生變形時的第1間隔G1發生變化。具體而言,在第1導引軌3_1產生變形時的第1間隔G1,係比在第1導引軌3_1未產生變形時的第1間隔G1短。此係關於第3保持部5_3及第4保持部5_4間的距離即第2間隔G2亦相同。Also, as shown in FIG. 5, when the deformation in the vertical direction (Z-axis direction) occurs in the first guide rail 3_1, the first gap G1 also changes from that when the first guide rail 3_1 does not deform. The first interval G1 changes. Specifically, the first interval G1 when the first guide rail 3_1 is deformed is shorter than the first interval G1 when the first guide rail 3_1 is not deformed. The same applies to the second gap G2 which is the distance between the third holding portion 5_3 and the fourth holding portion 5_4.
如此一來,當在導引軌3產生變形的情況下,第1間隔G1~第4間隔G4發生變化。亦即,複數個保持部5的相對位置發生變化。換言之,複數個吸附部55的相對位置發生變化。當複數個吸附部55的相對位置發生變化時,則吸附部55與基板S之位置關係發生變化。藉此,因吸附部55相對於基板S偏移而變得難以高精度地搬送基板S。特別是,如實施形態之基板處理裝置1般,在第1移動部4_1及第2移動部4_2並非一體而是獨立的情況下,複數個保持部5之相對位置容易因導引軌3的變形而偏移。In this way, when the
因此,在實施形態之基板處理裝置1中,係以在第1移動部4_1及第2移動部4_2移動的期間,使第1間隔G1~第4間隔G4成為固定的方式,控制各保持部5之第1調整部51及第2調整部52,調整吸附部55相對於移動部4的位置。Therefore, in the
<測定系統>
關於該點具體地進行說明。首先,參閱圖6,說明關於基板處理裝置1所具備的測定系統之構成。圖6,係表示實施形態的測定系統之構成的示意圖。
<Measuring system>
This point will be specifically described. First, referring to FIG. 6 , the configuration of the measurement system included in the
如圖6所示般,基板處理裝置1,係具備有測定系統100。測定系統100,係測定複數個保持部5中之相鄰的保持部5間之距離的間隔測定部之一例。又,測定系統100,係亦作為分別測定沿著第1移動部4及第2移動部4的前後方向(Y軸方向)之移動距離的移動距離測定部之一例。As shown in FIG. 6 , the
測定系統100,係使用雷射干涉法,計測距測定部位的距離。測定系統100,係具備有:投光部110,投射雷射光;受光部120,接收從投光部110所投射的雷射光;及光學系統130,被配置於從投光部110至受光部120之雷射光的光路上。The
投光部110,係具備有:光源111;複數個分束鏡112~115;及複數個射束彎束器116~118。光源111,係產生雷射光。複數個分束鏡112~115,係以預定之分割比,將所入射的雷射光分割成兩個雷射光。複數個射束彎束器116~118,係變更所入射的雷射光之行進方向。The
分束鏡112,係將從光源111所入射的雷射光分割而朝向分束鏡113及後述的干涉計134d投射光。分束鏡113,係將從分束鏡112所入射的雷射光分割而朝向分束鏡114及射束彎束器116投射光。分束鏡114,係將從分束鏡113所入射的雷射光分割而朝向射束彎束器118及後述的干涉計134b投射光。分束鏡115,係將從後述的射束彎束器116所入射的雷射光分割而朝向射束彎束器117及後述的分束鏡132投射光。The
射束彎束器116,係將從分束鏡113所入射的雷射方向之行進方向變更90度而朝向分束鏡115投射光。射束彎束器117,係將從分束鏡115所入射的雷射方向之行進方向變更90度而朝向後述的干涉計134c投射光。射束彎束器118,係將從分束鏡114所入射的雷射方向之行進方向變更90度而朝向後述的干涉計134a投射光。The
受光部120,係具備有:複數個受光器121~126。受光器121,係接收在後述的測定部位131a反射之雷射光,受光器122,係接收在後述的測定部位131b反射之雷射光,受光器123,係接收在後述的測定部位131c反射之雷射光。受光器124,係接收在後述的測定部位131d反射之雷射光,受光器125,係接收在後述的測定部位131e反射之雷射光,受光器126,係接收在後述的測定部位131f反射之雷射光。The
另外,投光部110、受光部120及光學系統130,係沿著前後方向(Y軸方向)而配置。又,複數個受光器121~126中之受光器121~125,係位於投光部110的Y軸正方向側且光學系統130的Y軸負方向側,受光器126,係位於光學系統130的Y軸正方向側。In addition, the
光學系統130,係具備有:複數個測定部位131a~131f;分束鏡132;射束彎束器133;及複數個干涉計134a~134f。The
複數個測定部位131a~131f,係照射雷射光的部位。複數個測定部位131a~131f,係具有與所入射的雷射光垂直之反射面。The plurality of
測定部位131a,係例如被設置於第1移動部4_1,測定部位131b,係例如被設置於第2移動部4_2。又,測定部位131c,係例如被設置於第2保持部5_2,測定部位131d,係例如被設置於第4保持部5_4,測定部位131e,係例如被設置於第3保持部5_3,測定部位131f,係例如被設置於第4保持部5_4。複數個測定部位131a~131f,係將所入射的雷射光反射至與入射方向相反之方向。另外,沿著Y軸正方向直進的雷射光被入射至測定部位131a~131d,沿著X軸負方向直進的雷射光被入射至測定部位131e及131d。The
分束鏡132,係被設置於第1保持部5_1。分束鏡132,係將從分束鏡115所入射的雷射光分割而朝向干涉計134e及射束彎束器133投射光。射束彎束器133,係被設置於第2調整部52。射束彎束器133,係將從分束鏡132所入射的雷射光之行進方向變更90度而朝向干涉計134f投射光。The
複數個干涉計134a~134f,係例如使用被設置於內部之分束鏡,將所入射的雷射光分割成兩個雷射光。又,複數個干涉計134a~134f,係藉由被設置於內部之反射鏡,使經分割的雷射光中之一方反射。藉由干涉計134a~134f內之反射鏡所反射的雷射光(參考路徑)與藉由測定部位131a~131f所反射的雷射光(測定路徑),係在干涉計134a~134f內之分束鏡再結合而入射至受光器121~126。The plurality of
測定系統100,係基於藉由「對由受光器121~126所接受到的雷射光進行光學信號處理」而獲得之兩道雷射光的相位差,測定距測定部位131a~131f的距離。The
具體而言,干涉計134a,係被配置於「在受光器121與測定部位131a之間遠離第1移動部4_1」的位置。干涉計134a,係將從射束彎束器118所投射的雷射光分割成兩道。藉由干涉計134a所分割的兩道雷射光中之一方,係朝向干涉計134a內之反射鏡投射光,另一方,係朝向測定部位131a投射光。而且,在干涉計134a內再結合之雷射光,係被受光器121接收。測定系統100,係基於藉由受光器121所接收到的雷射光,可獲得從干涉計134a至測定部位131a的距離,亦即第1移動部4_1的移動距離即第1移動距離D1。Specifically, the
干涉計134b,係被配置於「在受光器122與測定部位131b之間遠離第2移動部4_2」的位置。干涉計134b,係將從分束鏡114所投射的雷射光分割成兩道。藉由干涉計134b所分割的兩道雷射光中之一方,係朝向干涉計134b內之反射鏡投射光,另一方,係朝向測定部位131b投射光。而且,在干涉計134b內再結合之雷射光,係被受光器122接收。測定系統100,係基於藉由受光器122所接收到的雷射光,可獲得從干涉計134b至測定部位131b的距離,亦即第2移動部4_2的移動距離即第2移動距離D2。The
干涉計134c,係被設置於第1保持部5_1。干涉計134c,係將從射束彎束器117所投射的雷射光分割成兩道。藉由干涉計134c所分割的兩道雷射光中之一方,係朝向干涉計134c內之反射鏡投射光,另一方,係朝向測定部位131c投射光。而且,在干涉計134c內再結合之雷射光,係被受光器123接收。測定系統100,係基於藉由受光器123所接收到的雷射光,可獲得從干涉計134c至測定部位131b的距離,亦即第1保持部5_1及第2保持部5_2間的距離即第1間隔G1。The
干涉計134d,係被設置於第3保持部5_3。干涉計134d,係將從分束鏡112所投射的雷射光分割成兩道。藉由干涉計134d所分割的兩道雷射光中之一方,係朝向干涉計134d內之反射鏡投射光,另一方,係朝向測定部位131d投射光。而且,在干涉計134d內再結合之雷射光,係被受光器124接收。測定系統100,係基於藉由受光器124所接收到的雷射光,可獲得從干涉計134d至測定部位131d的距離,亦即第3保持部5_3及第4保持部5_4間的距離即第2間隔G2。The
干涉計134e,係被設置於第1保持部5_1。從分束鏡115所投射而藉由分束鏡132分割的雷射光被入射至干涉計134e。干涉計134e,係將從分束鏡132所入射的雷射光分割成兩道。藉由干涉計134e所分割的兩道雷射光中之一方,係朝向干涉計134e內之反射鏡投射光,另一方,係朝向測定部位131e投射光。而且,在干涉計134e內再結合之雷射光,係被受光器125接收。測定系統100,係基於藉由受光器125所接收到的雷射光,可獲得從干涉計134e至測定部位131e的距離,亦即第1保持部5_1及第3保持部5_3間的距離即第3間隔G3。The
干涉計134f,係被設置於第2保持部5_2。從分束鏡132所投射而藉由分束鏡133變更路徑的雷射光被入射至干涉計134f。干涉計134f,係將從射束彎束器133所入射的雷射光分割成兩道。藉由干涉計134f所分割的兩道雷射光中之一方,係朝向干涉計134f內之反射鏡投射光,另一方,係朝向測定部位131f投射光。而且,在干涉計134f內再結合之雷射光,係被受光器126接收。測定系統100,係基於藉由受光器126所接收到的雷射光,可獲得從干涉計134f至測定部位131f的距離,亦即第2保持部5_2及第4保持部5_4間的距離即第4間隔G4。The
測定系統100之測定結果即第1移動距離D1、第2移動距離D2及第1間隔G1~第4間隔G4,係被輸出至控制裝置8。The measurement results of the
圖7,係用以說明實施形態的光學系統130之設置位置的示意圖。如圖7所示般,干涉計134c、134e及分束鏡132,係被設置於第1保持部5_1中之第2調整部52。FIG. 7 is a schematic view illustrating the installation position of the
如此一來,在作為間隔測定部之測定系統100中,光學系統130中之被設置於第1保持部5_1的干涉計134c、134e及分束鏡132,係被設置於第1調整部51及第2調整部52中位於上方的調整部。藉由設成為該構成,由於可使干涉計134c、134e及分束鏡132之高度位置更接近基板S的高度位置,因此,可更精度良好地測定第1間隔G1及第3間隔G3。In this way, in the
又,在轉動部53以外的場所設置干涉計134c、134e及分束鏡132,藉此,可抑制第1間隔G1及第3間隔G3的測定精度因轉動部53之轉動而下降的情形。Furthermore,
另外,在實施形態中,係雖表示在第1調整部51上設置第2調整部52時的例子,但亦可在第2調整部52上設置第1調整部51。在該情況下,干涉計134c、134e及分束鏡132,係亦可被設置於第1調整部51。In addition, in the embodiment, an example was shown in which the
又,干涉計134c、134e及分束鏡132,係經由升降機構150被固定於第2調整部52。升降機構150,係被固定於第2調整部52,使平台151沿著垂直方向(Z軸方向)移動。干涉計134c、134e及分束鏡132,係被設置於平台151上。In addition, the
在進行第1間隔G1及第3間隔G3之測定的情況下,測定系統100,係使用升降機構150來使平台151上升,藉此,使干涉計134c、134e及分束鏡132位於比吸附部55的上面(亦即吸附面)更上方。藉由設成為該構成,由於可使干涉計134c、134e及分束鏡132之高度位置進一步接近基板S的高度位置,因此,可更精度良好地測定第1間隔G1及第3間隔G3。又,測定系統100,係在不進行測定的情況下,使用升降機構150來使干涉計134c、134e及分束鏡132下降,使其位於比吸附部55的上面更下方。藉此,可抑制干涉計134c、134e及分束鏡132妨礙基板S之搬送的情形。In the case of measuring the first interval G1 and the third interval G3, the
另外,在圖7中,係作為一例,表示了被設置於第1保持部5_1之干涉計134c、134e及分束鏡132的配置。與其相同地,設置於第2保持部5_2之光學系統130的一部分(射束彎束器133及干涉計134f)、設置於第3保持部5_3之光學系統130的一部分(干涉計134d)亦經由升降機構150被設置於第2調整部52。In addition, in FIG. 7, the arrangement|positioning of the
又,光學系統130中之測定部位131a,係被配置於比第1調整部51及第2調整部52更下方。例如,在圖7所示的例子中,測定部位131a,係被設置於第1移動部4_1之移動方向(Y軸正方向)上的後端部(亦即Y軸負方向側的端部)。In addition, the
如此一來,在作為移動距離測定部之測定系統100中,光學系統130中之被設置於第1保持部5_1的測定部位131a,係亦可被設置於比第1調整部51及第2調整部52更下方。藉由設成為該構成,例如在導引軌3於垂直方向(Z軸方向)變形的情況下,與在第1調整部51或第2調整部52設置了測定部位131a的情形相比,可將該變形之影響抑制得較小。因此,可精度良好地測定第1移動距離D1。In this way, in the
另外,在圖7中,係表示了測定部位131a被設置於第1移動部4_1時的例子。並不限於此,測定部位131a,係亦可被設置於「與第1移動部4_1一起移動的第1移動部4_1以外之構件中位於比第1調整部51及第2調整部52更下方」的場所。例如,測定部位131a,係亦可被設置於基底部50。In addition, in FIG. 7, the example in which the
又,在圖7中,係作為一例,表示了被設置於第1保持部5_1之測定部位131a的配置。與其相同地,設置於第3保持部5_3之測定部位131b亦被設置於比第3保持部5_3所具備的第1調整部51及第2調整部52更下方。In addition, in FIG. 7, the arrangement|positioning of the
並不限於上述例子,測定部位131a,係例如亦可被設置於第1調整部51或亦可被設置於第2調整部52。在接近基板S之位置設置測定部位131a的方式,可精度良好地測定第1移動距離D1。The
另外,測定系統100中之投光部110、受光器121、122、測定部位131a、131b、干涉計134a、134b,係移動距離測定部之一例。具體而言,投光部110、受光器121、測定部位131a、干涉計134a,係分別測定沿著第1移動部4_1的前後方向(Y軸方向)之移動距離的第1移動距離測定部之一例。又,投光部110、受光器122、測定部位131b、干涉計134b,係分別測定沿著第2移動部4_2的前後方向(Y軸方向)之移動距離的第2移動距離測定部之一例。In addition, the
又,測定系統100中之投光部110、受光器123~126、測定部位131c~131f、分束鏡132、射束彎束器133及干涉計134c~134f,係測定相鄰的保持部5間之距離的間隔測定部之一例。具體而言,投光部110、受光器123、測定部位131c及干涉計134c,係測定第1間隔G1的第1間隔測定部之一例。又,投光部110、受光器124、測定部位131d及干涉計134d,係測定第2間隔G2的第2間隔測定部之一例。又,投光部110、受光器125、測定部位131e、分束鏡132及干涉計134e,係測定第3間隔G3的第3間隔測定部之一例。又,投光部110、受光器126、測定部位131f、分束鏡132、射束彎束器133及干涉計134f,係測定第4間隔G4的第4間隔測定部之一例。In addition, the
<控制裝置>
其次,參閱圖8,說明關於控制裝置8的構成。圖8,係表示實施形態的控制裝置8之構成的方塊圖。如圖8所示般,控制裝置8,係具備有:控制部81;及記憶部82。
<Control device>
Next, referring to FIG. 8 , the configuration of the
控制部81,係控制器(controller)。控制部81,係例如藉由下述方式來實現:藉由CPU(Central Processing Unit)或MPU(Micro Processing Unit)等,將RAM作為作業區域執行被記憶於控制裝置8內部之記憶裝置的各種程式。又,控制部81,係控制器,例如藉由ASIC (Application Specific Integrated Circuit)或FPGA(Field Programmable Gate Array)等的集成電路來實現。控制部81,係如圖8所示般,具備有測定處理部811、變更處理部812及搬送處理部813,實現或執行以下所說明的處理之功能或作用。The control unit 81 is a controller. The control unit 81 is realized, for example, by using a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), etc., using RAM as a work area to execute various programs stored in a storage device inside the
記憶部82,係例如藉由RAM(Random Access Memory)、快閃記憶體(Flash Memory)等的半導體記憶體元件或硬碟、光碟等的記憶裝置來實現。如圖8所示般,記憶部82,係記憶有:搬送資訊821;第1移動部調整資訊822;及第2移動部調整資訊823。又,記憶部82,係記憶有:第1保持部調整資訊824;第2保持部調整資訊825;第3保持部調整資訊826;及第4保持部調整資訊827。The memory unit 82 is realized by, for example, semiconductor memory elements such as RAM (Random Access Memory) and flash memory (Flash Memory), or memory devices such as hard disks and optical disks. As shown in FIG. 8, the memory unit 82 memorizes: transfer information 821; first moving unit adjustment information 822; and second moving unit adjustment information 823. Also, the memory unit 82 memorizes: first holding unit adjustment information 824 ; second holding unit adjustment information 825 ; third holding unit adjustment information 826 ; and fourth holding unit adjustment information 827 .
搬送資訊821,係表示「在一對導引軌3上的各地點,對移動部4及保持部5指示之移動量」的資訊。一對導引軌3上之各地點,係例如以基板S的搬送路徑中之自起點起的距離(假設一對導引軌3沒有變形時之移動部4的移動距離,以下記載為「理想移動距離」)來表示。The conveyance information 821 is information indicating "the amount of movement instructed to the moving
例如每隔理想移動距離50mm,輸出相對於移動部4及保持部5之移動指令。在搬送資訊821,係每隔理想移動距離50mm,建立對第1移動部4_1及第2移動部4_2分別指示之移動量的對應關係。例如在搬送資訊821,係亦可每隔理想移動距離50mm,建立50mm作為對第1移動部4_1及第2移動部4_2分別指示之移動量的對應關係。第1移動部4_1及第2移動部4_2,係在每次接收移動指示時,在導引軌上逐次移動50mm。For example, a movement command with respect to the moving
在搬送資訊821,係例如亦可建立考慮了一對導引軌3的變形之移動量的對應關係,該移動量,係基於使用了雷射干涉計等之事前的測定所獲得。例如,在理想移動距離100mm之地點,對第1移動部4_1輸出移動量50mm的移動指令後,藉由事前之測定明確了實際到達的是149mm之地點。在該情況下,在搬送資訊821,係亦可將移動量51mm與理想移動距離100mm建立對應關係。輸出該移動指令,使第1移動部4_1及第2移動部4_2移動51mm,藉此,可使第1移動部4_1及第2移動部4_2到達150mm的地點。In the conveyance information 821, for example, a correspondence relation of the movement amount considering the deformation of the pair of
另外,在此,在搬送資訊821中與移動量建立對應關係之資訊雖為理想移動距離,但在搬送資訊821中與移動量建立對應關係之資訊,係亦可為相對於移動部4及保持部5之移動指令的輸出次數。亦即,搬送資訊821,係亦可為將「移動指令所含有的移動量與相對於移動部4及保持部5之移動指令的輸出次數建立了對應關係」之資訊。In addition, here, although the information associated with the movement amount in the transfer information 821 is the ideal travel distance, the information associated with the movement amount in the transfer information 821 may also be the information corresponding to the moving
又,在搬送資訊821,係例如每隔理想移動距離50mm,建立對第1保持部5_1~第4保持部5_4分別指示之移動量的對應關係。關於各保持部5之搬送資訊821,係指將第1調整部51的移動量(以下,記載為「X移動量」)、第2調整部52的移動量(以下,記載為「Y移動量」)與理想移動距離(或移動指令之輸出次數)建立了對應關係之資訊。在此,關於各保持部5之搬送資訊821,係例如考慮了基於事前的測定之一對導引軌3的變形者。但是,並不限於此,關於各保持部5之搬送資訊821,係亦可為不考慮一對導引軌3的變形者。該情況下之關於各保持部5的搬送資訊821,係相對於理想移動距離(或移動指令之輸出次數),作為X移動量及Y移動量皆與「0」建立對應關係。Moreover, in the conveyance information 821, for example, the corresponding relationship of the amount of movement instructed to each of the first holding part 5_1 to the fourth holding part 5_4 is established for every ideal moving distance of 50 mm. The transport information 821 of each holding
以第1移動部調整資訊822為代表之各調整資訊822~827,係指用以調整在搬送資訊821中建立了對應關係之移動量的資訊。Each of the adjustment information 822 to 827 represented by the first movement unit adjustment information 822 is information for adjusting the amount of movement associated with the transfer information 821 .
第1移動部調整資訊822,係表示用以「調整在第1導引軌3_1上的各地點,對第1移動部4_1輸出之移動指令所含有的移動量」之調整值的資訊。又,第2移動部調整資訊823,係表示用以「調整在第2導引軌3_2上的各地點,對第2移動部4_2輸出之移動指令所含有的移動量」之調整值的資訊。The 1st moving part adjustment information 822 is the information which shows the adjustment value for "adjusting the movement amount contained in the movement command output to the 1st moving part 4_1 at each point on the 1st guide rail 3_1." Moreover, the 2nd moving part adjustment information 823 is information which shows the adjustment value for "adjusting the movement amount contained in the movement command output to the 2nd moving part 4_2 at each point on the 2nd guide rail 3_2."
作為一例,參閱圖9,說明關於第1移動部調整資訊822的內容。圖9,係表示實施形態的第1移動部調整資訊822之一例的圖。如圖9所示般,第1移動部調整資訊822,係指將「移動指令之輸出次數」項目、「理想移動距離」項目及「調整值」項目建立了對應關係的資訊。在「移動指令之輸出次數」項目,係儲存有相對於第1移動部4_1之移動指令的輸出次數。在「理想移動距離」項目,係儲存有在假設一對導引軌3沒有變形的情況下,輸出被儲存於所對應的「移動指令之輸出次數」之次數的移動指令後之第1移動部4_1的理想移動距離。在「調整值」項目,係儲存有關於第1移動部4_1之搬送資訊821所儲存的移動量之調整值。As an example, referring to FIG. 9 , the content of the first moving unit adjustment information 822 will be described. FIG. 9 is a diagram showing an example of the first moving unit adjustment information 822 according to the embodiment. As shown in FIG. 9 , the first movement unit adjustment information 822 is information in which the item "number of times of output of movement command", the item "ideal moving distance" and the item "adjustment value" are associated with each other. In the "number of times of output of movement command" item, the number of times of output of movement commands to the first moving unit 4_1 is stored. In the "ideal moving distance" item, the first moving part after outputting the moving command for the number of times stored in the corresponding "number of times of output of the moving command" assuming that the pair of
例如,在圖9所示之例子中,係將理想移動距離「50(mm)」及調整值「-1(μm)」與移動指令之輸出次數「一(次)」建立對應關係。此係表示對第1移動部4_1輸出第一次的移動指令時之第1移動部4_1的理想移動距離為「50(mm)」。又,表示將在搬送資訊821中與相對於第1移動部4_1之第一次的移動指令建立了對應關係之移動量調整「-1(μm)」。另外,關於圖9所示之「調整值(μm)」的正負,係將往Y軸正方向側進行調整的情形設成為「+」,將往Y軸負方向側進行調整的情形設成為「-」。For example, in the example shown in FIG. 9 , the ideal moving distance "50 (mm)" and the adjustment value "-1 (μm)" are associated with the output times of the moving command "one (time)". This means that the ideal moving distance of the first moving part 4_1 when the first moving command is output to the first moving part 4_1 is "50 (mm)". In addition, it indicates that the movement amount associated with the first movement command with respect to the first movement unit 4_1 in the transportation information 821 is adjusted by "-1 (μm)". In addition, regarding the sign of "adjustment value (μm)" shown in FIG. 9, the case of adjusting to the positive side of the Y-axis is set to "+", and the case of adjustment to the negative side of the Y-axis is set to "+". -".
第1保持部調整資訊824,係表示用以「調整在第1導引軌3_1上的各地點,對第1保持部5_1輸出之移動指令所含有的移動量」之調整值的資訊。又,第2保持部調整資訊825,係表示用以「調整在第1導引軌3_1上的各地點,對第2保持部5_2輸出之移動指令所含有的移動量」之調整值的資訊。又,第3保持部調整資訊826,係表示用以「調整在第2導引軌3_2上的各地點,對第3保持部5_3輸出之移動指令所含有的移動量」之調整值的資訊。又,第4保持部調整資訊827,係表示用以「調整在第2導引軌3_2上的各地點,對第4保持部5_4輸出之移動指令所含有的移動量」之調整值的資訊。The first holding unit adjustment information 824 is information indicating an adjustment value for “adjusting the amount of movement included in the movement command output to the first holding unit 5_1 at each point on the first guide rail 3_1 ”. Also, the second holding unit adjustment information 825 is information indicating an adjustment value for “adjusting the amount of movement included in the movement command output to the second holding unit 5_2 at each point on the first guide rail 3_1 ”. Also, the third holding unit adjustment information 826 is information indicating an adjustment value for “adjusting the amount of movement included in the movement command output to the third holding unit 5_3 at each point on the second guide rail 3_2”. Also, the fourth holding unit adjustment information 827 is information indicating an adjustment value for “adjusting the amount of movement included in the movement command output to the fourth holding unit 5_4 at each point on the second guide rail 3_2”.
作為一例,參閱圖10,說明關於第1保持部調整資訊824的內容。圖10,係表示實施形態的第1保持部調整資訊824之一例的圖。如圖10所示般,第1保持部調整資訊824,係指將「移動指令之輸出次數」項目、「理想移動距離」項目、「X調整值」項目及「Y調整值」項目建立了對應關係的資訊。As an example, referring to FIG. 10 , the contents of the first holding unit adjustment information 824 will be described. FIG. 10 is a diagram showing an example of the first holding unit adjustment information 824 according to the embodiment. As shown in FIG. 10, the first holding unit adjustment information 824 refers to the correspondence between the item "number of times of output of movement command", the item "ideal moving distance", the item "X adjustment value" and the item "Y adjustment value". relationship information.
在「移動指令之輸出次數」項目,係儲存有相對於第1保持部5_1所具備的第1調整部51及第2調整部52之移動指令的輸出次數。在「理想移動距離」項目,係儲存有在假設一對導引軌3沒有變形的情況下,輸出被儲存於所對應的「移動指令之輸出次數」之次數的移動指令後之第1移動部4_1的理想移動距離。在「X調整值」項目,係儲存有調整關於第1保持部5_1之搬送資訊821所儲存的X移動量之值。在「Y調整值」項目,係儲存有調整關於第1保持部5_1之搬送資訊821所儲存的Y移動量之值。In the item "number of times of output of the movement command", the number of times of output of the movement command with respect to the
例如,在圖10所示之例子中,係將理想移動距離「50(mm)」、X調整值「0(μm)」及Y調整值「3(μm)」與移動指令之輸出次數「1(次)」建立對應關係。此係表示對第1保持部5_1輸出第一次的移動指令時之第1移動部4_1的理想移動距離為「50(mm)」。又,表示將在搬送資訊821中與相對於第1保持部5_1之第一次的移動指令建立了對應關係之X移動量調整「0(μm)」,並將Y移動量調整「3(μm)」。For example, in the example shown in Figure 10, the ideal moving distance "50 (mm)", the X adjustment value "0 (μm)" and the Y adjustment value "3 (μm)" and the output times of the movement command "1 (times)" to establish a corresponding relationship. This means that the ideal moving distance of the first moving part 4_1 when the first moving command is output to the first holding part 5_1 is "50 (mm)". In addition, it indicates that the X movement amount corresponding to the first movement command with respect to the first holding unit 5_1 in the transfer information 821 is adjusted to "0 (μm)", and the Y movement amount is adjusted to "3 (μm) )".
另外,關於圖10所示之「X調整值(μm)」的正負,係將往X軸正方向側進行調整的情形設成為「+」,將往Y軸負方向側進行調整的情形設成為「-」。又,關於圖10所示之「Y調整值(μm)」的正負,係將往Y軸正方向側進行調整的情形設成為「+」,將往Y軸負方向側進行調整的情形設成為「-」。In addition, regarding the sign of "X adjustment value (μm)" shown in FIG. 10, the case of adjusting to the positive side of the X-axis is set to "+", and the case of adjusting to the negative side of the Y-axis is set to "+". "-". In addition, regarding the sign of "Y adjustment value (μm)" shown in FIG. 10, the case of adjusting to the positive side of the Y-axis is set to "+", and the case of adjusting to the negative side of the Y-axis is set to "-".
控制部81,係以在第1移動部4_1及第2移動部4_2沿著一對導引軌3移動的期間,使測定系統100之測定結果成為固定的方式,控制各保持部5之調整部,調整吸附部55相對於移動部4的位置。該控制部81,係具備有:測定處理部811;變更處理部812;及搬送處理部813。The control unit 81 controls the adjustment unit of each holding
測定處理部811,係一邊使第1移動部4_1及第2移動部4_2沿著一對導引軌3移動,一邊執行由測定系統100所進行的測定。藉此,可獲得第1導引軌3_1上的各地點之第1移動距離D1、第1間隔G1、第3間隔G3及第4間隔G4的資訊與第2導引軌3_2上的各地點之第2移動距離D2及第2間隔G2的資訊。由測定處理部811所進行的測定處理,係在複數個保持部5未保持基板S的狀態下執行。The
變更處理部812,係基於「在由測定處理部811所進行的測定處理中,藉由測定系統100所測定到」的第1移動距離D1之測定結果,變更被記憶於記憶部82的第1移動部調整資訊822。相同地,變更處理部812,係基於「在由測定處理部811所進行的測定處理中,藉由測定系統100所測定到」的第2移動距離D2之測定結果,變更被記憶於記憶部82的第2移動部調整資訊823。The change processing unit 812 changes the first moving distance D1 stored in the memory unit 82 based on the measurement result of the first moving distance D1 “measured by the
例如,變更處理部812,係針對相對於第1移動部4_1之每一移動指令(在每次第1移動部4_1依照移動指令進行移動時),判定第1移動部4_1依照移動指令進行移動後的第1移動距離D1是否偏移了理想移動距離。而且,變更處理部812,係在判定為第1移動距離D1偏移了理想移動距離的情況下,以使第1移動距離D1與理想移動距離一致的方式,變更在第1移動部調整資訊822中與其移動指令建立了對應關係的調整值。例如,第1移動部4_1依照第三次之移動指令進行移動後的第1移動距離D1偏移了理想移動距離-1μm。在該情況下,變更處理部812,係將「在第1移動部調整資訊822中與第三次之移動指令建立了對應關係」的調整值與1μm相加。For example, the change processing unit 812 is for each movement command relative to the first movement unit 4_1 (every time the first movement unit 4_1 moves according to the movement command), it is determined that the first movement unit 4_1 moves according to the movement command. Whether the first moving distance D1 deviates from the ideal moving distance. Furthermore, the change processing unit 812 changes the first moving unit adjustment information 822 so that the first moving distance D1 matches the ideal moving distance when it is determined that the first moving distance D1 deviates from the ideal moving distance. The adjustment value that establishes a corresponding relationship with its movement instruction. For example, the first moving distance D1 after the first moving unit 4_1 moves according to the third moving command deviates from the ideal moving distance by −1 μm. In this case, the change processing unit 812 adds 1 μm to the adjustment value of “the third movement command is associated with the first movement unit adjustment information 822 ”.
又,變更處理部812,係基於「在由測定處理部811所進行的測定處理中,藉由測定系統100所測定到」的第1間隔G1~第4間隔G4之測定結果,變更被記憶於記憶部82的第1保持部調整資訊824~第4保持部調整資訊827。Furthermore, the change processing unit 812 is based on the measurement results of the first interval G1 to the fourth interval G4 “measured by the
具體而言,變更處理部812,係針對第1導引軌3_1上之各地點,判定第1間隔G1是否從第1規定值發生了變化。另外,「第1導引軌3_1上之各地點」,係可稱為「相對於第1移動部4_1之每一移動指令」或「在每次第1移動部4_1依照移動指令進行移動時」。又,所謂第1規定值,係指假設第1保持部5_1之吸附部55及第2保持部5_2之吸附部55分別在所規定的位置正確地吸附保持基板S時之第1間隔G1的理想值。假設在一對導引軌3_1沒有變形而筆直的情況下,第1間隔G1,係在基板S的搬送路徑中之從起點至終點為止,被維持於第1規定值。Specifically, the change processing unit 812 determines whether or not the first interval G1 has changed from the first predetermined value for each point on the first guide rail 3_1 . In addition, "each point on the first guide rail 3_1" can be referred to as "every movement command relative to the first moving part 4_1" or "every time the first moving part 4_1 moves according to the movement command". In addition, the so-called first predetermined value refers to the ideal value of the first gap G1 when assuming that the
在此,設成為於第1導引軌3_1上之某地點,換言之,在對第1移動部4_1輸出了移動指令的次數達到了某次數時,第1間隔G1從第1規定值發生了變化。在該情況下,變更處理部812,係以使該地點之第1間隔G1例如在下次搬送處理中與第1規定值一致的方式,變更第1保持部調整資訊824或第2保持部調整資訊825。Here, it is assumed that at a certain point on the first guide rail 3_1, in other words, when the number of times the movement command is output to the first moving unit 4_1 reaches a certain number of times, the first interval G1 changes from the first predetermined value. . In this case, the change processing unit 812 changes the first holding unit adjustment information 824 or the second holding unit adjustment information so that the first distance G1 at the point coincides with the first predetermined value in the next transfer process, for example. 825.
作為一例,變更處理部812,係變更第1保持部調整資訊824。具體而言,變更處理部812,係變更第1保持部調整資訊824中之對應於第1間隔G1發生了變化的地點(移動指令之輸出次數)之Y調整值。例如,在第1移動部4_1依照第二次之移動指令進行移動後,第1間隔G1從第1規定值變化了「-1μm」。在該情況下,變更處理部812,係在第1保持部調整資訊824中,從與移動指令之輸出次數「2」建立了對應關係的Y調整值「4(μm)」減去1μm而變更成「3(μm)」。藉此,在下次搬送處理時,在對第1移動部4_1輸出第2次之移動指令時,變更對第1保持部5_1的第1調整部51輸出之移動指令所含有的移動量(少1μm)。該結果,第1移動部4_1依照第二次之移動指令進行移動後的第1間隔G1被保持為第1規定值。另外,變更處理部812,係亦可變更第2保持部調整資訊825的Y調整值。As an example, the change processing unit 812 changes the first holding unit adjustment information 824 . Specifically, the change processing unit 812 changes the Y adjustment value corresponding to the point where the first interval G1 has changed (the number of times the movement command is output) in the first holding unit adjustment information 824 . For example, after the first moving part 4_1 moves according to the second movement command, the first gap G1 changes by "-1 μm" from the first predetermined value. In this case, the change processing unit 812 changes by subtracting 1 μm from the Y adjustment value “4 (μm)” associated with the output count “2” of the movement command in the first storage unit adjustment information 824 . into "3 (μm)". Thereby, when the second movement command is output to the first movement unit 4_1 in the next transfer process, the movement amount contained in the movement command output to the
如此一來,變更處理部812,係在測定處理中,在「於第1導引軌3_1之一地點,第1間隔G1從第1規定值發生了變化」的情況下,以使在測定處理後的搬送處理中,上述一地點之第1間隔G1與第1規定值一致的方式,調整第1保持部5_1及第2保持部5_2中之一方的第1調整部51之上述一地點的移動量。藉此,可將上述一地點之第1間隔G1保持為第1預設值。亦即,可保持上述一地點之第1保持部5_1與第2保持部5_2的相對位置。In this way, the change processing unit 812, in the measurement process, in the case of "the first distance G1 has changed from the first predetermined value at a point of the first guide rail 3_1", so that in the measurement process In the subsequent conveying process, the movement of the first adjusting
又,變更處理部812,係針對第2導引軌3_2上之各地點,判定第2間隔G2是否從第2規定值發生了變化。又,所謂第2規定值,係指假設第3保持部5_3之吸附部55及第4保持部5_4之吸附部55分別在所規定的位置正確地吸附保持基板S時之第2間隔G2的理想值。Also, the change processing unit 812 determines whether or not the second gap G2 has changed from the second predetermined value for each point on the second guide rail 3_2. Also, the so-called second predetermined value refers to the ideal value of the second gap G2 when assuming that the
在此,設成為在第2導引軌3_2上之某地點,第2間隔G2從第2規定值發生了變化。在該情況下,變更處理部812,係以使該地點之第2間隔G2例如在下次搬送處理中與第2規定值一致的方式,變更第3保持部調整資訊826或第4保持部調整資訊827。作為一例,變更處理部812,係變更第3保持部調整資訊826。具體而言,變更處理部812,係變更第3保持部調整資訊826中之對應於第2間隔G2發生了變化的地點(移動指令之輸出次數)之Y調整值。另外,變更處理部812,係亦可變更第4保持部調整資訊827的Y調整值。Here, it is assumed that the second gap G2 has changed from the second predetermined value at a certain point on the second guide rail 3_2. In this case, the change processing unit 812 changes the third holding unit adjustment information 826 or the fourth holding unit adjustment information so that the second distance G2 at the point coincides with the second predetermined value in the next transfer process, for example. 827. As an example, the change processing unit 812 changes the third holding unit adjustment information 826 . Specifically, the change processing unit 812 changes the Y adjustment value corresponding to the point where the second interval G2 has changed (the number of times the movement command is output) in the third holding unit adjustment information 826 . In addition, the change processing unit 812 can also change the Y adjustment value of the fourth holding unit adjustment information 827 .
又,變更處理部812,係針對第1導引軌3_1上之各地點,判定第3間隔G3是否從第3規定值發生了變化。又,所謂第3規定值,係指假設第1保持部5_1之吸附部55及第3保持部5_3之吸附部55分別在所規定的位置正確地吸附保持基板S時之第3間隔G3的理想值。Also, the change processing unit 812 determines whether or not the third distance G3 has changed from the third predetermined value for each point on the first guide rail 3_1. In addition, the so-called third predetermined value refers to the ideal value of the third gap G3 when the
在此,設成為在第1導引軌3_1上之某地點,第3間隔G3從第3規定值發生了變化。在該情況下,變更處理部812,係以使該地點之第3間隔G3例如在下次搬送處理中與第3規定值一致的方式,變更第1保持部調整資訊824或第3保持部調整資訊826。作為一例,變更處理部812,係變更第1保持部調整資訊824。具體而言,變更處理部812,係變更第1保持部調整資訊824中之對應於第3間隔G3發生了變化的地點(移動指令之輸出次數)之X調整值。另外,變更處理部812,係亦可變更第3保持部調整資訊826的X調整值。Here, it is assumed that the third gap G3 has changed from the third predetermined value at a certain point on the first guide rail 3_1. In this case, the change processing unit 812 changes the first holding unit adjustment information 824 or the third holding unit adjustment information so that the third distance G3 at the point coincides with the third predetermined value in the next transfer process, for example. 826. As an example, the change processing unit 812 changes the first holding unit adjustment information 824 . Specifically, the change processing unit 812 changes the X adjustment value corresponding to the point where the third interval G3 has changed (the number of times the movement command is output) in the first holding unit adjustment information 824 . In addition, the change processing unit 812 can also change the X adjustment value of the third holding unit adjustment information 826 .
例如,在第1移動部4_1及第2移動部4_2依照第二次之移動指令進行移動後,第3間隔G3從第3規定值變化了「-1μm」。在該情況下,變更處理部812,係在第1保持部調整資訊824中,將與移動指令之輸出次數「2」建立了對應關係的X調整值「5(μm)」和1μm相加而變更成「6(μm)」。藉此,在下次搬送處理時,在對第1移動部4_1及第2移動部4_2輸出第2次之移動指令時,調整對第1保持部5_1的第2調整部52輸出之移動指令所含有的移動量。該結果,第1移動部4_1依照第二次之移動指令進行移動後的第3間隔G3被保持為第3規定值。另外,變更處理部812,係亦可變更第3保持部調整資訊826的X調整值。For example, after the first moving part 4_1 and the second moving part 4_2 move according to the second moving command, the third gap G3 changes by "-1 μm" from the third predetermined value. In this case, the change processing unit 812 adds the X adjustment value “5 (μm)” corresponding to the output count “2” of the movement command to 1 μm in the first holding unit adjustment information 824 . Changed to "6(μm)". Thereby, when the second movement command is output to the first moving unit 4_1 and the second moving unit 4_2 in the next transfer process, the content of the movement command output to the
如此一來,變更處理部812,係在測定處理中,在「於第1導引軌3_1之一地點,第3間隔G3從第3規定值發生了變化」的情況下,以使在測定處理後的搬送處理中,上述一地點之第3間隔G3與第3規定值一致的方式,調整第1保持部5_1及第3保持部5_3中之一方的第2調整部52之上述一地點的移動量。藉此,可將上述一地點之第3間隔G3保持為第3預設值。亦即,可保持上述一地點之第1保持部5_1與第3保持部5_3的相對位置。In this way, the change processing unit 812, in the measurement process, in the case of "the third gap G3 has changed from the third predetermined value at a point of the first guide rail 3_1", so that in the measurement process In the subsequent conveying process, the movement of the second adjusting
又,變更處理部812,係針對第1導引軌3_1上之各地點,判定第4間隔G4是否從第4規定值發生了變化。又,所謂第4規定值,係指假設第2保持部5_2之吸附部55及第4保持部5_4之吸附部55分別在所規定的位置正確地吸附保持基板S時之第4間隔G4的理想值。Also, the change processing unit 812 determines whether or not the fourth gap G4 has changed from the fourth predetermined value for each point on the first guide rail 3_1. Also, the so-called fourth predetermined value refers to the ideal value of the fourth gap G4 when assuming that the
在此,設成為在第1導引軌3_1上之某地點,第4間隔G4從第4規定值發生了變化。在該情況下,變更處理部812,係以使該地點之第4間隔G4例如在下次搬送處理中與第4規定值一致的方式,變更第2保持部調整資訊825或第4保持部調整資訊827。作為一例,變更處理部812,係變更第2保持部調整資訊825。具體而言,變更處理部812,係變更第2保持部調整資訊825中之對應於第4間隔G4發生了變化的地點(移動指令之輸出次數)之X調整值。另外,變更處理部812,係亦可變更第4保持部調整資訊827的X調整值。Here, it is assumed that the fourth gap G4 has changed from the fourth predetermined value at a certain point on the first guide rail 3_1. In this case, the change processing unit 812 changes the second holding unit adjustment information 825 or the fourth holding unit adjustment information so that the fourth distance G4 at the point coincides with the fourth predetermined value in the next transfer process, for example. 827. As an example, the change processing unit 812 changes the second holding unit adjustment information 825 . Specifically, the change processing unit 812 changes the X adjustment value corresponding to the point where the fourth interval G4 has changed (the number of times the movement command is output) in the second holding unit adjustment information 825 . In addition, the change processing unit 812 can also change the X adjustment value of the fourth holding unit adjustment information 827 .
搬送處理部813,係控制第1移動部4及複數個保持部5來進行基板S的搬送。具體而言,搬送處理部813,係藉由對第1移動部4輸出移動指令的方式,使第1移動部4沿著導引軌3移動。又,搬送處理部813,係藉由對保持部5之第1調整部51及第2調整部52輸出移動指令的方式,使第1調整部51沿著左右方向(X軸方向)移動,並使第2調整部52沿著前後方向(Y軸方向)移動。又,搬送處理部813,係控制塗佈部6,對所搬送的基板S進行機能液之塗佈。The
搬送處理部813,係使用搬送資訊821及第1移動部調整資訊822,控制第1移動部4_1,藉此,調整第1導引軌3_1上的各地點之第1移動部4_1的移動量。具體而言,搬送處理部813,係使用被儲存於第1移動部調整資訊822的調整值,調整被儲存於搬送資訊821之第1移動部4_1的移動量。而且,搬送處理部813,係對第1移動部4_1輸出包含調整後之移動量的移動指令。The
又,搬送處理部813,係使用搬送資訊821及第2移動部調整資訊823,控制第2移動部4_2,藉此,調整第2導引軌3_2上的各地點之第2移動部4_2的移動量。具體而言,搬送處理部813,係使用被儲存於第2移動部調整資訊823的調整值,調整被儲存於搬送資訊821之第2移動部4_2的移動量。而且,搬送處理部813,係對第2移動部4_2輸出包含調整後之移動量的移動指令。Moreover, the
又,搬送處理部813,係使用搬送資訊821及第1保持部調整資訊824,控制第1保持部5_1的第1調整部51,藉此,調整第1導引軌3_1上的各地點之第1調整部51的移動量。具體而言,搬送處理部813,係使用被儲存於第1保持部調整資訊824的調整值,調整被儲存於搬送資訊821之第1調整部51的移動量。而且,搬送處理部813,係對第1保持部5_1的第1調整部51輸出包含調整後之移動量的移動指令。相同地,搬送處理部813,係使用搬送資訊821及第1保持部調整資訊824,控制第1保持部5_1的第2調整部52,藉此,調整第1導引軌3_1上的各地點之第2調整部52的移動量。具體而言,搬送處理部813,係使用被儲存於第1保持部調整資訊824的調整值,調整被儲存於搬送資訊821之第2調整部52的移動量。而且,搬送處理部813,係對第1保持部5_1的第2調整部52輸出包含調整後之移動量的移動指令。Moreover, the
相同地,搬送處理部813,係使用搬送資訊821及第2保持部調整資訊825,控制第2保持部5_2的第1調整部51及第2調整部52。又,搬送處理部813,係使用搬送資訊821及第3保持部調整資訊826,控制第3保持部5_3的第1調整部51及第2調整部52。又,搬送處理部813,係使用搬送資訊821及第4保持部調整資訊827,控制第4保持部5_4的第1調整部51及第2調整部52。Similarly, the
如此一來,搬送處理部813,係在使第1移動部4_1及第2移動部4_2沿著一對導引軌3移動的期間,基於藉由測定處理所測定到的測定結果,控制第1調整部51及第2調整部52,藉此,調整一對導引軌的各地點之吸附部55的位置。In this way, the
<基板處理裝置之處理流程>
其次,參閱圖11,說明關於實施形態之基板處理裝置1執行的處理中之測定處理及變更處理的程序。圖11,係表示實施形態之基板處理裝置1執行的處理中之測定處理及變更處理之程序的流程圖。圖11所示之各處理,係依照控制裝置8的控制來執行。
<Processing flow of substrate processing equipment>
Next, referring to FIG. 11 , procedures of measurement processing and change processing among the processing performed by the
首先,在基板處理裝置1中,係進行測定處理。具體而言,控制部81,係一邊使移動部4及保持部5移動,一邊執行由測定系統100所進行的測定(步驟S101)。此時,控制部81,係使用搬送資訊821及第1移動部調整資訊822,控制第1移動部4_1,藉此,使第1移動部4_1移動。又,控制部81,係使用搬送資訊821及第2移動部調整資訊823,控制第2移動部4_2,藉此,使第2移動部4_2移動。又,控制部81,係使用搬送資訊821及第1保持部調整資訊824,使第1保持部5_1移動,並使用搬送資訊821及第2保持部調整資訊825,使第2保持部5_2移動。又,控制部81,係使用搬送資訊821及第3保持部調整資訊826,使第3保持部5_3移動,並使用搬送資訊821及第4保持部調整資訊827,使第4保持部5_4移動。First, in the
而且,控制部81,係在每次使移動部4移動時,亦即每次對移動部4輸出移動指令時,使用測定系統100,測定第1移動距離D1、第2移動距離D2及第1間隔G1~第4間隔G4。Moreover, the control unit 81 uses the
接著,在基板處理裝置1中,係進行變更處理。具體而言,控制部81,係判定第1移動距離D1或第2移動距離D2是否從理想移動距離發生了變化(步驟S102)。Next, in the
在步驟S102中,在判定為第1移動距離D1或第2移動距離D2從理想移動距離發生了變化的情況下(步驟S102;Yes),控制部81,係以使第1移動距離D1或第2移動距離D2與理想移動距離一致的方式,變更第1移動部4_1或第2移動部4_2的調整值(步驟S103)。In step S102, when it is determined that the first moving distance D1 or the second moving distance D2 has changed from the ideal moving distance (step S102; Yes), the control unit 81 makes the first moving distance D1 or the second moving
在步驟S102中,在第1移動距離D1或第2移動距離D2並未從理想移動距離發生變化的情況下(步驟S102;No),控制部81,係判定第1間隔G1或第2間隔G2是否從規定值發生了變化(步驟S104)。In step S102, when the first moving distance D1 or the second moving distance D2 has not changed from the ideal moving distance (step S102; No), the control unit 81 determines whether the first interval G1 or the second interval G2 Whether or not there is a change from the predetermined value (step S104).
在步驟S104中,在判定為第1間隔G1或第2間隔G2從規定值發生了變化的情況下(步驟S104;Yes),控制部81,係以使第1間隔G1或第2間隔G2與規定值一致的方式,變更第1保持部5_1的Y調整值或第3保持部5_3的Y調整值(步驟S105)。In step S104, when it is determined that the first interval G1 or the second interval G2 has changed from the predetermined value (step S104; Yes), the control unit 81 makes the first interval G1 or the second interval G2 and If the predetermined value matches, the Y adjustment value of the first holding unit 5_1 or the Y adjustment value of the third holding unit 5_3 is changed (step S105).
在步驟S104中,在第1間隔G1或第2間隔G2並未從規定值發生變化的情況下(步驟S104;No),控制部81,係判定第3間隔G3或第4間隔G4是否從規定值發生了變化(步驟S106)。In step S104, when the first interval G1 or the second interval G2 has not changed from the specified value (step S104; No), the control unit 81 determines whether the third interval G3 or the fourth interval G4 has changed from the specified value. The value is changed (step S106).
在步驟S106中,在判定為第3間隔G3或第4間隔G4從規定值發生了變化的情況下(步驟S106;Yes),控制部81,係以使第3間隔G3或第4間隔G4與規定值一致的方式,變更第1保持部5_1的X調整值或第2保持部5_2的X調整值(步驟S107)。In step S106, when it is determined that the third interval G3 or the fourth interval G4 has changed from the predetermined value (step S106; Yes), the control unit 81 makes the third interval G3 or the fourth interval G4 and If the predetermined value matches, the X adjustment value of the first holding unit 5_1 or the X adjustment value of the second holding unit 5_2 is changed (step S107).
當結束步驟S103、S105、S107的處理時,則控制部81結束測定處理及變更處理。When the processing of steps S103, S105, and S107 ends, the control unit 81 ends the measurement processing and the change processing.
如上述般,實施形態之基板搬送裝置(作為一例,基板處理裝置1),係具備有:一對導引軌(作為一例,第1導引軌3_1及第2導引軌3_2);第1移動部(作為一例,第1移動部4_1);第2移動部(作為一例,第2移動部4_2);複數個保持部(作為一例,第1保持部5_1~第4保持部5_4);間隔測定部(作為一例,測定系統100);及控制部(作為一例,控制部81)。一對導引軌,係被排列於第1方向(作為一例,X軸方向)且沿著與第1方向正交的第2方向(作為一例,Y軸方向)延伸。第1移動部,係沿著一對導引軌中之一方的導引軌移動。第2移動部,係沿著一對導引軌中之另一方的導引軌移動。複數個保持部,係分別被設置於第1移動部及第2移動部上,從基板的下方吸附保持基板(作為一例,基板S)。間隔測定部,係測定複數個保持部中之相鄰的保持部間之距離。控制部,係控制第1移動部、第2移動部及複數個保持部。複數個保持部,係具備有:吸附部(作為一例,吸附部55),吸附保持基板;及調整部(作為一例,第1調整部51及第2調整部52),調整吸附部的位置。控制部,係以在第1移動部及第2移動部沿著一對導引軌移動的期間,使間隔測定部之測定結果成為固定的方式,一邊控制調整部來調整吸附部之位置,一邊搬送基板。As mentioned above, the substrate transfer device of the embodiment (as an example, the substrate processing device 1) is equipped with: a pair of guide rails (as an example, the first guide rail 3_1 and the second guide rail 3_2); The moving part (as an example, the first moving part 4_1); the second moving part (as an example, the second moving part 4_2); a plurality of holding parts (as an example, the first holding part 5_1 to the fourth holding part 5_4); a measurement unit (as an example, the measurement system 100); and a control unit (as an example, the control unit 81). The pair of guide rails are arranged in a first direction (for example, X-axis direction) and extend along a second direction (for example, Y-axis direction) perpendicular to the first direction. The first moving part moves along one of the pair of guide rails. The second moving part moves along the other guide rail of the pair of guide rails. A plurality of holding parts are respectively provided on the first moving part and the second moving part, and suck and hold the substrate (as an example, the substrate S) from below the substrate. The distance measuring unit measures the distance between adjacent holding units among the plurality of holding units. The control unit controls the first moving unit, the second moving unit and the plurality of holding units. A plurality of holding parts are provided with: an adsorption part (as an example, the adsorption part 55), which absorbs and holds the substrate; and an adjustment part (as an example, the
藉此,即便在假設一對導引軌存在有變形的情況下或一對導引軌之變形程度因環境變化而變化的情況下,亦可將複數個保持部彼此的相對位置保持為固定。因此,根據實施形態之基板搬送裝置,可使基板搬送中之誤差減少。Thereby, even if the pair of guide rails is assumed to be deformed or the degree of deformation of the pair of guide rails changes due to environmental changes, the relative positions of the plurality of holding parts can be kept fixed. Therefore, according to the substrate transfer device of the embodiment, errors in substrate transfer can be reduced.
控制部,係亦可執行測定處理與搬送處理。測定處理,係一邊使第1移動部及第2移動部沿著一對導引軌移動,一邊執行由間隔測定部所進行的測定。搬送處理,係在使第1移動部及第2移動部沿著一對導引軌移動的期間,基於藉由測定處理所測定到的測定結果來控制調整部,藉此,一邊調整一對導引軌的各地點之吸附部的位置,一邊進行基板之搬送。藉此,可將複數個保持部彼此的相對位置保持為固定。The control unit can also perform measurement processing and transfer processing. In the measurement process, the measurement by the distance measuring unit is performed while moving the first moving unit and the second moving unit along the pair of guide rails. The conveying process is to control the adjustment unit based on the measurement results measured by the measurement process while the first moving part and the second moving part are moving along the pair of guide rails, thereby adjusting the pair of guide rails. The position of the suction part at each point of the guide rail is carried out while transferring the substrate. Thereby, the relative positions of the plurality of holding parts can be kept fixed.
調整部,係亦可具備有:第1調整部(作為一例,第1調整部51),沿著第1方向調整吸附部的位置;及第2調整部(作為一例,第2調整部52),沿著第2方向調整吸附部的位置。藉此,可沿著第1方向及第2方向調整吸附部55的位置。The adjustment unit may also include: a first adjustment unit (as an example, the first adjustment unit 51), which adjusts the position of the adsorption unit along the first direction; and a second adjustment unit (as an example, the second adjustment unit 52) , adjust the position of the suction part along the second direction. Thereby, the position of the adsorption|
複數個保持部,係亦可包含有:第1保持部(作為一例,第1保持部5_1)及第2保持部(作為一例,第2保持部5_2),在第1移動部上沿著第2方向排列;及第3保持部(作為一例,第3保持部5_3)及第4保持部(作為一例,第4保持部5_4),在第2移動部上沿著第2方向排列。在該情況下,控制部,係亦可在測定處理中,在「於導引軌之一地點,第1保持部及第2保持部間的距離即第1間隔(作為一例,第1間隔G1)從規定值(作為一例,第1規定值)發生了變化」的情況下,以使在測定處理後的搬送處理中,一地點之第1間隔與規定值一致的方式,調整第1保持部及第2保持部中之一方的第1調整部之一地點的移動量。藉此,在進行基板之搬送的期間,可將第1保持部及第2保持部間的距離即第1間隔保持為規定值。A plurality of holding parts can also include: the first holding part (as an example, the first holding part 5_1) and the second holding part (as an example, the second holding part 5_2), along the first moving
複數個保持部,係亦可包含有:第1保持部及第2保持部,在第1移動部上沿著第2方向排列;及第3保持部及第4保持部,在第2移動部上沿著第2方向排列。在該情況下,控制部,係亦可在測定處理中,在「於導引軌之一地點,第1保持部及第3保持部間的距離即第3間隔從規定值(作為一例,第3規定值)發生了變化」的情況下,以使在測定處理後的搬送處理中,一地點之第3間隔與規定值(作為一例,第3規定值)一致的方式,調整第1保持部及第3保持部中之一方的第2調整部之一地點的移動量。藉此,在進行基板之搬送的期間,可將第1保持部及第3保持部間的距離即第3間隔保持為規定值。The plurality of holding parts may also include: a first holding part and a second holding part arranged along the second direction on the first moving part; and a third holding part and a fourth holding part arranged on the second moving part Arranged along the second direction. In this case, the control unit may also change the distance between the first holding unit and the third holding unit, that is, the third distance from a predetermined value (as an example, the third interval at a point on the guide rail) during the measurement process. 3 predetermined value) has changed", adjust the first holding unit so that the third interval at one point coincides with the predetermined value (as an example, the third predetermined value) in the transport process after the measurement process And the movement amount of one point of the second adjustment part of one of the third holding parts. Thereby, the distance between the first holding portion and the third holding portion, that is, the third interval can be maintained at a predetermined value while the substrate is being conveyed.
第1調整部及第2調整部中之一方,係亦可被設置於第1調整部及第2調整部中之另一方上。又,間隔測定部,係亦可具備有:投光部(作為一例,投光部110),投射雷射光;受光部(作為一例,受光部120),接收雷射光;及光學系統(作為一例,光學系統130),被配置於從投光部至受光部之雷射光的光路上。在該情況下,光學系統,係亦可被設置於第1調整部及第2調整部中之一方。藉此,由於可使光學系統之高度位置更接近基板的高度位置,因此,可更精度良好地測定相鄰的保持部彼此之間隔。One of the first adjustment part and the second adjustment part may be provided on the other of the first adjustment part and the second adjustment part. Again, the distance measurement unit can also be equipped with: a light projecting unit (as an example, the light projecting unit 110), which projects laser light; a light receiving unit (as an example, the light receiving unit 120), which receives the laser light; and an optical system (as an example) , the optical system 130) is arranged on the optical path of the laser light from the light projecting part to the light receiving part. In this case, the optical system may be provided in one of the first adjustment unit and the second adjustment unit. Thereby, since the height position of an optical system can be brought closer to the height position of a board|substrate, the distance between adjacent holding parts can be measured more accurately.
間隔測定部,係亦可具備有:升降機構(作為一例,升降機構150),使光學系統升降。藉此,由於可使光學系統之高度位置進一步接近基板的高度位置,因此,可更精度良好地測定相鄰的保持部彼此之間隔。The interval measuring unit may also include a lift mechanism (as an example, lift mechanism 150 ) for lifting the optical system up and down. Thereby, since the height position of an optical system can be brought closer to the height position of a board|substrate, the distance between adjacent holding parts can be measured more accurately.
實施形態之基板搬送裝置,係亦可具備有:移動距離測定部(作為一例,測定系統100),分別測定沿著第1移動部及第2移動部之第2方向的移動距離。藉此,可掌握第1移動部及第2移動部的實際移動距離。The substrate transfer device of the embodiment may also include a moving distance measuring unit (
移動距離測定部,係亦可藉由「接收從第1移動部或與第1移動部一起移動之構件中位於比第1調整部及第2調整部更下方的部位反射之雷射光」的方式,測定第1移動部的移動距離。又,移動距離測定部,係亦可藉由「接收從第2移動部或與第2移動部一起移動之構件中位於比第1調整部及第2調整部更下方的部位反射之雷射光」的方式,測定第2移動部的移動距離。藉此,例如在導引軌於垂直方向(Z軸方向)變形的情況下,可將該變形對於測定精度之影響抑制得較小。The moving distance measuring part can also be "received laser light reflected from the first moving part or a member that moves together with the first moving part that is located below the first adjusting part and the second adjusting part" , to measure the moving distance of the first moving part. In addition, the moving distance measuring part can also be obtained by "receiving laser light reflected from the second moving part or a member that moves together with the second moving part, which is located below the first adjusting part and the second adjusting part." In this way, the moving distance of the second moving part is measured. Thereby, for example, when the guide rail is deformed in the vertical direction (Z-axis direction), the influence of the deformation on the measurement accuracy can be suppressed to be small.
在上述之實施形態中,係雖說明了關於基板處理裝置1具備有塗佈部6且塗佈部6以噴墨方式對基板S進行描繪的例子,但對基板S之加工處理並不限於此。例如,在進行「藉由進行對基板S照射光之處理或吐出去除液之處理的方式,使基板S之表面改質或去除表層之膜」等各種加工處理的情況下,亦可應用本揭示的技術。In the above-mentioned embodiment, although the example in which the
另外,吾人應認為本次所揭示之實施形態,係在所有方面皆為例示而非限定者。實際上,上述實施形態,係可藉由多種形態來實現。又,上述實施形態,係亦可在不脫離添附之申請專利範圍及其意旨的情況下,以各種形態進行省略、置換、變更。In addition, it should be considered that the embodiment disclosed this time is an illustration and not a limitation in any respect. In fact, the above-mentioned embodiments can be realized in various forms. In addition, the above-mentioned embodiments can also be omitted, substituted, and changed in various forms without departing from the scope of the appended claims and their meaning.
1:基板處理裝置 2:上浮平台 3_1:第1導引軌 3_2:第2導引軌 4_1:第1移動部 4_2:第2移動部 5_1:第1保持部 5_2:第2保持部 5_3:第3保持部 5_4:第4保持部 6:塗佈部 8:控制裝置 50:基底部 51:第1調整部 52:第2調整部 53:轉動部 54:臂部 55:吸附部 81:控制部 82:記憶部 100:測定系統 110:投光部 120:受光部 130:光學系統 1: Substrate processing device 2: Floating platform 3_1: The first guide rail 3_2: The second guide rail 4_1: The first mobile department 4_2: The second mobile department 5_1: The first holding part 5_2: The second holding part 5_3: The third holding part 5_4: The 4th holding part 6: Coating department 8: Control device 50: Basal part 51: The first adjustment department 52: The 2nd adjustment department 53: Rotating part 54: arm 55: Adsorption part 81: Control Department 82: memory department 100: Determination system 110: Projector 120: Light receiving part 130: Optical system
[圖1]圖1,係表示實施形態的基板處理裝置之一部分的示意平面圖。 [圖2]圖2,係實施形態之保持部的示意平面圖。 [圖3]圖3,係實施形態之保持部的示意側視圖。 [圖4]圖4,係表示「當在實施形態的導引軌產生了左右方向上之變形的情況下,複數個保持部之相對位置產生偏移」之態樣的示意圖。 [圖5]圖5,係表示「當在實施形態的導引軌產生了垂直方向上之變形的情況下,複數個保持部之相對位置產生偏移」之態樣的示意圖。 [圖6]圖6,係表示實施形態的測定系統之構成的示意圖。 [圖7]圖7,係用以說明實施形態的光學系統之設置位置的示意圖。 [圖8]圖8,係表示實施形態的控制裝置之構成的方塊圖。 [圖9]圖9,係表示實施形態的第1移動部調整資訊之一例的圖。 [圖10]圖10,係表示實施形態的第1保持部調整資訊之一例的圖。 [圖11]圖11,係表示實施形態之基板處理裝置執行的處理中之測定處理及變更處理之程序的流程圖。 [FIG. 1] FIG. 1 is a schematic plan view showing part of a substrate processing apparatus according to an embodiment. [ Fig. 2 ] Fig. 2 is a schematic plan view of a holding portion of the embodiment. [ Fig. 3 ] Fig. 3 is a schematic side view of a holding portion of the embodiment. [FIG. 4] FIG. 4 is a schematic diagram showing a situation in which "when the guide rail of the embodiment is deformed in the left-right direction, the relative positions of the plurality of holding parts are shifted". [ Fig. 5 ] Fig. 5 is a schematic diagram showing a state of "when the guide rail of the embodiment is deformed in the vertical direction, the relative positions of the plurality of holding parts are shifted". [ Fig. 6] Fig. 6 is a schematic diagram showing the configuration of a measurement system according to an embodiment. [FIG. 7] FIG. 7 is a schematic diagram for explaining the installation position of the optical system of the embodiment. [Fig. 8] Fig. 8 is a block diagram showing the configuration of the control device according to the embodiment. [FIG. 9] FIG. 9 is a diagram showing an example of the first moving part adjustment information according to the embodiment. [FIG. 10] FIG. 10 is a diagram showing an example of adjustment information of the first holding part according to the embodiment. [FIG. 11] FIG. 11 is a flowchart showing the procedures of measurement processing and change processing among the processing performed by the substrate processing apparatus according to the embodiment.
1:基板處理裝置 1: Substrate processing device
2:上浮平台 2: Floating platform
3_1(3):第1導引軌 3_1(3): The first guide rail
3_2(3):第2導引軌 3_2(3): The second guide rail
4_1(4):第1移動部 4_1(4): 1st Mobile Division
4_2(4):第2移動部 4_2(4): The second mobile unit
5_1(5):第1保持部 5_1(5): the first holding part
5_2(5):第2保持部 5_2(5): the second holding part
5_3(5):第3保持部 5_3(5): the third holding part
5_4(5):第4保持部 5_4(5): The 4th holding part
6:塗佈部 6: Coating Department
7:維護部 7:Maintenance department
8:控制裝置 8: Control device
9:軌道 9: track
81:控制部 81: Control Department
82:記憶部 82: memory department
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2021-051493 | 2021-03-25 | ||
JP2021051493 | 2021-03-25 |
Publications (1)
Publication Number | Publication Date |
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TW202301531A true TW202301531A (en) | 2023-01-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111108935A TW202301531A (en) | 2021-03-25 | 2022-03-11 | Substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program |
Country Status (3)
Country | Link |
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JP (1) | JPWO2022202396A1 (en) |
TW (1) | TW202301531A (en) |
WO (1) | WO2022202396A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4426276B2 (en) * | 2003-10-06 | 2010-03-03 | 住友重機械工業株式会社 | Conveying device, coating system, and inspection system |
JP2008302487A (en) * | 2007-06-11 | 2008-12-18 | Olympus Corp | Substrate sucking device, substrate transporting device, and outside appearance inspecting device |
JP4495752B2 (en) * | 2007-11-06 | 2010-07-07 | 東京エレクトロン株式会社 | Substrate processing apparatus and coating apparatus |
JP7101583B2 (en) * | 2018-10-04 | 2022-07-15 | 東京エレクトロン株式会社 | Board processing equipment and board processing method |
-
2022
- 2022-03-11 TW TW111108935A patent/TW202301531A/en unknown
- 2022-03-11 WO PCT/JP2022/010829 patent/WO2022202396A1/en active Application Filing
- 2022-03-11 JP JP2023509013A patent/JPWO2022202396A1/ja active Pending
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WO2022202396A1 (en) | 2022-09-29 |
JPWO2022202396A1 (en) | 2022-09-29 |
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