TW202248360A - 熱硬化性樹脂組成物、乾膜、硬化物、印刷電路板及電氣電子元件 - Google Patents

熱硬化性樹脂組成物、乾膜、硬化物、印刷電路板及電氣電子元件 Download PDF

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Publication number
TW202248360A
TW202248360A TW111110827A TW111110827A TW202248360A TW 202248360 A TW202248360 A TW 202248360A TW 111110827 A TW111110827 A TW 111110827A TW 111110827 A TW111110827 A TW 111110827A TW 202248360 A TW202248360 A TW 202248360A
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TW
Taiwan
Prior art keywords
thermosetting resin
resin composition
film
printed circuit
dry film
Prior art date
Application number
TW111110827A
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English (en)
Chinese (zh)
Inventor
金沢康代
管衆
中居弘進
仲田和貴
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW202248360A publication Critical patent/TW202248360A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
TW111110827A 2021-03-24 2022-03-23 熱硬化性樹脂組成物、乾膜、硬化物、印刷電路板及電氣電子元件 TW202248360A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021049808 2021-03-24
JP2021-049808 2021-03-24

Publications (1)

Publication Number Publication Date
TW202248360A true TW202248360A (zh) 2022-12-16

Family

ID=83395130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110827A TW202248360A (zh) 2021-03-24 2022-03-23 熱硬化性樹脂組成物、乾膜、硬化物、印刷電路板及電氣電子元件

Country Status (4)

Country Link
JP (1) JP7417008B2 (enrdf_load_stackoverflow)
CN (1) CN117120551A (enrdf_load_stackoverflow)
TW (1) TW202248360A (enrdf_load_stackoverflow)
WO (1) WO2022202427A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240076682A (ko) * 2022-11-22 2024-05-30 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 패키지
JP7552944B1 (ja) 2023-12-27 2024-09-18 artience株式会社 ドライフィルム、その硬化物および、電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JPH10178053A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2002146310A (ja) * 2000-08-07 2002-05-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びにフレキシブル印刷回路基板
JP4172179B2 (ja) * 2002-01-30 2008-10-29 日立化成工業株式会社 熱硬化性樹脂組成物、接着フィルム、銅張り積層板及びプリント配線板
JP5735029B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP6268310B2 (ja) * 2015-01-21 2018-01-24 太陽インキ製造株式会社 絶縁性熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6724930B2 (ja) * 2015-12-24 2020-07-15 コニカミノルタ株式会社 偏光板保護フィルム、その製造方法及び偏光板
JP7134166B2 (ja) * 2017-03-31 2022-09-09 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品およびプリント配線板
CN110546184B (zh) * 2017-04-28 2022-08-26 昭和电工材料株式会社 密封用膜、密封结构体和密封结构体的制造方法
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR20200124700A (ko) * 2018-02-22 2020-11-03 다이요 잉키 세이조 가부시키가이샤 적층형 전자 부품용 수지 조성물, 드라이 필름, 경화물, 적층형 전자 부품 및 프린트 배선판
CN110753881B (zh) * 2018-03-30 2024-06-21 太阳控股株式会社 碱显影型感光性树脂组合物、干膜、固化物和印刷电路板

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Publication number Publication date
CN117120551A (zh) 2023-11-24
JPWO2022202427A1 (enrdf_load_stackoverflow) 2022-09-29
WO2022202427A1 (ja) 2022-09-29
JP7417008B2 (ja) 2024-01-17

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