CN117120551A - 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 - Google Patents

热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 Download PDF

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Publication number
CN117120551A
CN117120551A CN202280023756.0A CN202280023756A CN117120551A CN 117120551 A CN117120551 A CN 117120551A CN 202280023756 A CN202280023756 A CN 202280023756A CN 117120551 A CN117120551 A CN 117120551A
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CN
China
Prior art keywords
thermosetting resin
resin composition
cured product
film
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280023756.0A
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English (en)
Chinese (zh)
Inventor
金沢康代
管众
中居弘进
仲田和贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN117120551A publication Critical patent/CN117120551A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202280023756.0A 2021-03-24 2022-03-14 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 Pending CN117120551A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021049808 2021-03-24
JP2021-049808 2021-03-24
PCT/JP2022/011180 WO2022202427A1 (ja) 2021-03-24 2022-03-14 熱硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電気電子部品

Publications (1)

Publication Number Publication Date
CN117120551A true CN117120551A (zh) 2023-11-24

Family

ID=83395130

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280023756.0A Pending CN117120551A (zh) 2021-03-24 2022-03-14 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件

Country Status (4)

Country Link
JP (1) JP7417008B2 (enrdf_load_stackoverflow)
CN (1) CN117120551A (enrdf_load_stackoverflow)
TW (1) TW202248360A (enrdf_load_stackoverflow)
WO (1) WO2022202427A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240076682A (ko) * 2022-11-22 2024-05-30 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 패키지
JP7552944B1 (ja) 2023-12-27 2024-09-18 ａｒｔｉｅｎｃｅ株式会社 ドライフィルム、その硬化物および、電子部品

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10178053A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JP2002146310A (ja) * 2000-08-07 2002-05-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びにフレキシブル印刷回路基板
CN107207837A (zh) * 2015-01-21 2017-09-26 太阳油墨制造株式会社 热固化性树脂组合物、干膜、固化物和印刷电路板
CN109426078A (zh) * 2017-08-30 2019-03-05 太阳油墨制造株式会社 固化性树脂组合物、干膜、固化物和印刷电路板
WO2019163292A1 (ja) * 2018-02-22 2019-08-29 太陽インキ製造株式会社 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板
CN110520475A (zh) * 2017-03-31 2019-11-29 太阳控股株式会社 固化性树脂组合物、干膜、固化物、电子部件及印刷电路板
CN110753881A (zh) * 2018-03-30 2020-02-04 太阳油墨制造株式会社 碱显影型感光性树脂组合物、干膜、固化物和印刷电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4172179B2 (ja) * 2002-01-30 2008-10-29 日立化成工業株式会社 熱硬化性樹脂組成物、接着フィルム、銅張り積層板及びプリント配線板
JP5735029B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6724930B2 (ja) * 2015-12-24 2020-07-15 コニカミノルタ株式会社 偏光板保護フィルム、その製造方法及び偏光板
CN110546184B (zh) * 2017-04-28 2022-08-26 昭和电工材料株式会社 密封用膜、密封结构体和密封结构体的制造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10178053A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JP2002146310A (ja) * 2000-08-07 2002-05-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びにフレキシブル印刷回路基板
CN107207837A (zh) * 2015-01-21 2017-09-26 太阳油墨制造株式会社 热固化性树脂组合物、干膜、固化物和印刷电路板
CN110520475A (zh) * 2017-03-31 2019-11-29 太阳控股株式会社 固化性树脂组合物、干膜、固化物、电子部件及印刷电路板
CN109426078A (zh) * 2017-08-30 2019-03-05 太阳油墨制造株式会社 固化性树脂组合物、干膜、固化物和印刷电路板
WO2019163292A1 (ja) * 2018-02-22 2019-08-29 太陽インキ製造株式会社 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板
CN111742014A (zh) * 2018-02-22 2020-10-02 太阳油墨制造株式会社 层叠型电子部件用树脂组合物、干膜、固化物、层叠型电子部件和印刷电路板
CN110753881A (zh) * 2018-03-30 2020-02-04 太阳油墨制造株式会社 碱显影型感光性树脂组合物、干膜、固化物和印刷电路板

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TW202248360A (zh) 2022-12-16
JPWO2022202427A1 (enrdf_load_stackoverflow) 2022-09-29
WO2022202427A1 (ja) 2022-09-29
JP7417008B2 (ja) 2024-01-17

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