TW202246450A - 有機el密封材用紫外線硬化性樹脂組成物 - Google Patents

有機el密封材用紫外線硬化性樹脂組成物 Download PDF

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Publication number
TW202246450A
TW202246450A TW111108682A TW111108682A TW202246450A TW 202246450 A TW202246450 A TW 202246450A TW 111108682 A TW111108682 A TW 111108682A TW 111108682 A TW111108682 A TW 111108682A TW 202246450 A TW202246450 A TW 202246450A
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TW
Taiwan
Prior art keywords
resin composition
organic
curable resin
ultraviolet curable
sealing material
Prior art date
Application number
TW111108682A
Other languages
English (en)
Chinese (zh)
Inventor
白石巧充
宮尾宙
Original Assignee
日商三井化學股份有限公司
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Publication date
Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202246450A publication Critical patent/TW202246450A/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647Polyepoxides

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
TW111108682A 2021-03-10 2022-03-10 有機el密封材用紫外線硬化性樹脂組成物 TW202246450A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021038538 2021-03-10
JP2021-038538 2021-03-10

Publications (1)

Publication Number Publication Date
TW202246450A true TW202246450A (zh) 2022-12-01

Family

ID=83226767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108682A TW202246450A (zh) 2021-03-10 2022-03-10 有機el密封材用紫外線硬化性樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2022191232A1 (ja)
KR (1) KR20230110585A (ja)
CN (1) CN116998220A (ja)
TW (1) TW202246450A (ja)
WO (1) WO2022191232A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4158460B2 (ja) 2002-08-30 2008-10-01 コニカミノルタホールディングス株式会社 活性エネルギー線硬化性樹脂組成物
JP7010824B2 (ja) * 2017-06-07 2022-01-26 積水化学工業株式会社 有機el表示素子用封止剤
JP7078720B2 (ja) * 2018-06-20 2022-05-31 三井化学株式会社 表示素子用封止剤およびその硬化物
KR102389442B1 (ko) * 2018-08-10 2022-04-21 미쓰이 가가쿠 가부시키가이샤 봉지제
KR102442754B1 (ko) * 2018-08-31 2022-09-13 미쓰이 가가쿠 가부시키가이샤 봉지제
JP7115744B2 (ja) 2018-12-17 2022-08-09 協立化学産業株式会社 有機el素子の封止用のカチオン重合硬化型インクジェット用樹脂組成物
KR20220016941A (ko) * 2019-07-05 2022-02-10 미쓰이 가가쿠 가부시키가이샤 유기 el 표시 소자용 봉지제 및 유기 el 표시 장치
JP7325018B2 (ja) * 2019-10-15 2023-08-14 パナソニックIpマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法、発光装置、及びタッチパネル

Also Published As

Publication number Publication date
CN116998220A (zh) 2023-11-03
JPWO2022191232A1 (ja) 2022-09-15
KR20230110585A (ko) 2023-07-24
WO2022191232A1 (ja) 2022-09-15

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