CN116998220A - 有机el密封材料用紫外线固化性树脂组合物 - Google Patents

有机el密封材料用紫外线固化性树脂组合物 Download PDF

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Publication number
CN116998220A
CN116998220A CN202280019501.7A CN202280019501A CN116998220A CN 116998220 A CN116998220 A CN 116998220A CN 202280019501 A CN202280019501 A CN 202280019501A CN 116998220 A CN116998220 A CN 116998220A
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CN
China
Prior art keywords
resin composition
organic
sealing material
curable resin
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280019501.7A
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English (en)
Chinese (zh)
Inventor
白石巧充
宫尾宙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN116998220A publication Critical patent/CN116998220A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647Polyepoxides

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
CN202280019501.7A 2021-03-10 2022-03-09 有机el密封材料用紫外线固化性树脂组合物 Pending CN116998220A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021038538 2021-03-10
JP2021-038538 2021-03-10
PCT/JP2022/010254 WO2022191232A1 (ja) 2021-03-10 2022-03-09 有機el封止材用紫外線硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN116998220A true CN116998220A (zh) 2023-11-03

Family

ID=83226767

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280019501.7A Pending CN116998220A (zh) 2021-03-10 2022-03-09 有机el密封材料用紫外线固化性树脂组合物

Country Status (5)

Country Link
JP (1) JPWO2022191232A1 (ja)
KR (1) KR20230110585A (ja)
CN (1) CN116998220A (ja)
TW (1) TW202246450A (ja)
WO (1) WO2022191232A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4158460B2 (ja) 2002-08-30 2008-10-01 コニカミノルタホールディングス株式会社 活性エネルギー線硬化性樹脂組成物
WO2018225723A1 (ja) * 2017-06-07 2018-12-13 積水化学工業株式会社 有機el表示素子用封止剤
JP7078720B2 (ja) * 2018-06-20 2022-05-31 三井化学株式会社 表示素子用封止剤およびその硬化物
CN111801987A (zh) * 2018-08-10 2020-10-20 三井化学株式会社 密封剂
WO2020044964A1 (ja) * 2018-08-31 2020-03-05 三井化学株式会社 封止剤
JP7115744B2 (ja) 2018-12-17 2022-08-09 協立化学産業株式会社 有機el素子の封止用のカチオン重合硬化型インクジェット用樹脂組成物
JP7412430B2 (ja) * 2019-07-05 2024-01-12 三井化学株式会社 有機el表示素子用封止剤および有機el表示装置
JP7325018B2 (ja) * 2019-10-15 2023-08-14 パナソニックIpマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法、発光装置、及びタッチパネル

Also Published As

Publication number Publication date
TW202246450A (zh) 2022-12-01
JPWO2022191232A1 (ja) 2022-09-15
WO2022191232A1 (ja) 2022-09-15
KR20230110585A (ko) 2023-07-24

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