TW202245163A - 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 - Google Patents

鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 Download PDF

Info

Publication number
TW202245163A
TW202245163A TW111103564A TW111103564A TW202245163A TW 202245163 A TW202245163 A TW 202245163A TW 111103564 A TW111103564 A TW 111103564A TW 111103564 A TW111103564 A TW 111103564A TW 202245163 A TW202245163 A TW 202245163A
Authority
TW
Taiwan
Prior art keywords
mirror
finished
resin film
bag
friction
Prior art date
Application number
TW111103564A
Other languages
English (en)
Chinese (zh)
Inventor
廣瀬和生
松澤佑樹
塩野一郎
Original Assignee
日商三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱綜合材料股份有限公司 filed Critical 日商三菱綜合材料股份有限公司
Publication of TW202245163A publication Critical patent/TW202245163A/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B31/00Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
    • B65B31/02Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/02Wrappers or flexible covers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Packages (AREA)
  • Vacuum Packaging (AREA)
  • Wrappers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
TW111103564A 2021-02-02 2022-01-27 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 TW202245163A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-014909 2021-02-02
JP2021014909A JP2022118410A (ja) 2021-02-02 2021-02-02 鏡面加工体の梱包体及び鏡面加工体の梱包体の梱包方法

Publications (1)

Publication Number Publication Date
TW202245163A true TW202245163A (zh) 2022-11-16

Family

ID=82741526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111103564A TW202245163A (zh) 2021-02-02 2022-01-27 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法

Country Status (3)

Country Link
JP (1) JP2022118410A (ja)
TW (1) TW202245163A (ja)
WO (1) WO2022168718A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015161026A (ja) * 2014-02-28 2015-09-07 本田技研工業株式会社 Na含有スパッタリングターゲットの包装方法
JP6391324B2 (ja) * 2014-06-30 2018-09-19 アキレス株式会社 ウエハ保護フィルム
CN204223506U (zh) * 2014-11-05 2015-03-25 有研亿金新材料有限公司 一种大尺寸靶材的包装
TWI634051B (zh) * 2016-02-22 2018-09-01 Jx金屬股份有限公司 高純度錫真空包裝品、將高純度錫真空包裝之方法及高純度錫真空包裝品之製造方法
JP6885981B2 (ja) * 2019-03-29 2021-06-16 Jx金属株式会社 スパッタリングターゲットの梱包物の作製方法及び輸送方法

Also Published As

Publication number Publication date
WO2022168718A1 (ja) 2022-08-11
JP2022118410A (ja) 2022-08-15

Similar Documents

Publication Publication Date Title
US9136338B2 (en) Sputtering target, method for forming amorphous oxide thin film using the same, and method for manufacturing thin film transistor
ES2858513T3 (es) Película de mezcla de alcohol polivinílico hidrosoluble, métodos relacionados y artículos relacionados
US10450119B2 (en) Films including a water-soluble layer and a vapor-deposited inorganic coating
EP1748481A1 (en) Wafer storage container
TWI748265B (zh) 濺射靶的包裝物的製作方法及運輸方法
TW202245163A (zh) 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法
JPWO2013154089A1 (ja) ガラス板の梱包方法および梱包体
JP2007008149A (ja) スパウト付きパウチ
TWI815135B (zh) 開合式遮蔽構件及具有開合式遮蔽構件的薄膜沉積機台
JP2003237833A (ja) ガラス基板包装体
JP6850786B2 (ja) 高純度錫の真空梱包方法および真空梱包された高純度錫
JP7097770B2 (ja) 包装袋
JPWO2005026015A1 (ja) スペーサーシート及びそれを用いる板状物の輸送方法
JP7136151B2 (ja) 反射防止膜付き合成石英ガラス基板、窓材、光学素子パッケージ用リッド、光学素子パッケージおよび光照射装置
JPWO2013154091A1 (ja) ガラス板用合紙の評価方法
TWM619996U (zh) 開合式遮蔽構件及具有開合式遮蔽構件的沉積機台
EP3122917A1 (en) Antistatic coatings for plastic vessels
KR100743791B1 (ko) 웨이퍼수납용기 및 그 먼지발생방지방법 및 웨이퍼의수납방법
KR20020005940A (ko) 표면 열화를 방지하는 웨이퍼 패킹 방법
US20200180840A1 (en) Vacuum-packaged product of high-purity metal and method for producing vacuum-packaged product
EP1122187A1 (en) Packaging material for molding material and part for semiconductor equipment, method of packaging by using the same and packaged molding material and part for semiconductor equipment
JP7369334B2 (ja) パウチ
Bertness et al. Storage conditions for high-accuracy composition standards of AlGaAs
KR19990080728A (ko) 웨이퍼용 포장팩
JP2004179312A (ja) 密閉容器の取り扱い方法及びクリーン手袋