TW202245163A - 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 - Google Patents
鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 Download PDFInfo
- Publication number
- TW202245163A TW202245163A TW111103564A TW111103564A TW202245163A TW 202245163 A TW202245163 A TW 202245163A TW 111103564 A TW111103564 A TW 111103564A TW 111103564 A TW111103564 A TW 111103564A TW 202245163 A TW202245163 A TW 202245163A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/02—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Packages (AREA)
- Vacuum Packaging (AREA)
- Wrappers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-014909 | 2021-02-02 | ||
JP2021014909A JP2022118410A (ja) | 2021-02-02 | 2021-02-02 | 鏡面加工体の梱包体及び鏡面加工体の梱包体の梱包方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202245163A true TW202245163A (zh) | 2022-11-16 |
Family
ID=82741526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111103564A TW202245163A (zh) | 2021-02-02 | 2022-01-27 | 鏡面加工體的包裝體及鏡面加工體的包裝體的包裝方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2022118410A (ja) |
TW (1) | TW202245163A (ja) |
WO (1) | WO2022168718A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015161026A (ja) * | 2014-02-28 | 2015-09-07 | 本田技研工業株式会社 | Na含有スパッタリングターゲットの包装方法 |
JP6391324B2 (ja) * | 2014-06-30 | 2018-09-19 | アキレス株式会社 | ウエハ保護フィルム |
CN204223506U (zh) * | 2014-11-05 | 2015-03-25 | 有研亿金新材料有限公司 | 一种大尺寸靶材的包装 |
TWI634051B (zh) * | 2016-02-22 | 2018-09-01 | Jx金屬股份有限公司 | 高純度錫真空包裝品、將高純度錫真空包裝之方法及高純度錫真空包裝品之製造方法 |
JP6885981B2 (ja) * | 2019-03-29 | 2021-06-16 | Jx金属株式会社 | スパッタリングターゲットの梱包物の作製方法及び輸送方法 |
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2021
- 2021-02-02 JP JP2021014909A patent/JP2022118410A/ja active Pending
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2022
- 2022-01-27 TW TW111103564A patent/TW202245163A/zh unknown
- 2022-01-27 WO PCT/JP2022/003011 patent/WO2022168718A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022168718A1 (ja) | 2022-08-11 |
JP2022118410A (ja) | 2022-08-15 |
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