TW202233023A - 電漿處理裝置與其製造方法及電漿處理方法 - Google Patents

電漿處理裝置與其製造方法及電漿處理方法 Download PDF

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Publication number
TW202233023A
TW202233023A TW110140519A TW110140519A TW202233023A TW 202233023 A TW202233023 A TW 202233023A TW 110140519 A TW110140519 A TW 110140519A TW 110140519 A TW110140519 A TW 110140519A TW 202233023 A TW202233023 A TW 202233023A
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TW
Taiwan
Prior art keywords
ground potential
plasma
plasma processing
fastening
metal
Prior art date
Application number
TW110140519A
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English (en)
Chinese (zh)
Inventor
本浩貴
佐藤亮
笠原稔大
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202233023A publication Critical patent/TW202233023A/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32477Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816Pressure
    • H01J37/32834Exhausting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332Coating
    • H01J2237/3321CVD [Chemical Vapor Deposition]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334Etching

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
TW110140519A 2020-11-13 2021-11-01 電漿處理裝置與其製造方法及電漿處理方法 TW202233023A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020189547A JP2022078684A (ja) 2020-11-13 2020-11-13 プラズマ処理装置とその製造方法、及びプラズマ処理方法
JP2020-189547 2020-11-13

Publications (1)

Publication Number Publication Date
TW202233023A true TW202233023A (zh) 2022-08-16

Family

ID=81492916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140519A TW202233023A (zh) 2020-11-13 2021-11-01 電漿處理裝置與其製造方法及電漿處理方法

Country Status (4)

Country Link
JP (1) JP2022078684A (ko)
KR (1) KR102638030B1 (ko)
CN (1) CN114496701A (ko)
TW (1) TW202233023A (ko)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217569B2 (ja) * 2008-03-31 2013-06-19 東京エレクトロン株式会社 プラズマ処理装置
JP6423706B2 (ja) * 2014-12-16 2018-11-14 東京エレクトロン株式会社 プラズマ処理装置
JP6548484B2 (ja) 2015-07-01 2019-07-24 東京エレクトロン株式会社 プラズマ処理装置およびそれに用いる排気構造

Also Published As

Publication number Publication date
KR20220065683A (ko) 2022-05-20
CN114496701A (zh) 2022-05-13
KR102638030B1 (ko) 2024-02-16
JP2022078684A (ja) 2022-05-25

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