TW202233023A - 電漿處理裝置與其製造方法及電漿處理方法 - Google Patents
電漿處理裝置與其製造方法及電漿處理方法 Download PDFInfo
- Publication number
- TW202233023A TW202233023A TW110140519A TW110140519A TW202233023A TW 202233023 A TW202233023 A TW 202233023A TW 110140519 A TW110140519 A TW 110140519A TW 110140519 A TW110140519 A TW 110140519A TW 202233023 A TW202233023 A TW 202233023A
- Authority
- TW
- Taiwan
- Prior art keywords
- ground potential
- plasma
- plasma processing
- fastening
- metal
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020189547A JP2022078684A (ja) | 2020-11-13 | 2020-11-13 | プラズマ処理装置とその製造方法、及びプラズマ処理方法 |
JP2020-189547 | 2020-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202233023A true TW202233023A (zh) | 2022-08-16 |
Family
ID=81492916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110140519A TW202233023A (zh) | 2020-11-13 | 2021-11-01 | 電漿處理裝置與其製造方法及電漿處理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2022078684A (ko) |
KR (1) | KR102638030B1 (ko) |
CN (1) | CN114496701A (ko) |
TW (1) | TW202233023A (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5217569B2 (ja) * | 2008-03-31 | 2013-06-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP6423706B2 (ja) * | 2014-12-16 | 2018-11-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP6548484B2 (ja) | 2015-07-01 | 2019-07-24 | 東京エレクトロン株式会社 | プラズマ処理装置およびそれに用いる排気構造 |
-
2020
- 2020-11-13 JP JP2020189547A patent/JP2022078684A/ja active Pending
-
2021
- 2021-11-01 TW TW110140519A patent/TW202233023A/zh unknown
- 2021-11-03 CN CN202111292961.0A patent/CN114496701A/zh active Pending
- 2021-11-05 KR KR1020210151608A patent/KR102638030B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20220065683A (ko) | 2022-05-20 |
CN114496701A (zh) | 2022-05-13 |
KR102638030B1 (ko) | 2024-02-16 |
JP2022078684A (ja) | 2022-05-25 |
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