TW202229494A - 接著膜、附支撐片的接著膜及構造體 - Google Patents

接著膜、附支撐片的接著膜及構造體 Download PDF

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Publication number
TW202229494A
TW202229494A TW110138677A TW110138677A TW202229494A TW 202229494 A TW202229494 A TW 202229494A TW 110138677 A TW110138677 A TW 110138677A TW 110138677 A TW110138677 A TW 110138677A TW 202229494 A TW202229494 A TW 202229494A
Authority
TW
Taiwan
Prior art keywords
adhesive film
adhesive
film
thermally conductive
conductive filler
Prior art date
Application number
TW110138677A
Other languages
English (en)
Chinese (zh)
Inventor
市川功
吉延毅朗
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202229494A publication Critical patent/TW202229494A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW110138677A 2020-11-04 2021-10-19 接著膜、附支撐片的接著膜及構造體 TW202229494A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184320 2020-11-04
JP2020-184320 2020-11-04

Publications (1)

Publication Number Publication Date
TW202229494A true TW202229494A (zh) 2022-08-01

Family

ID=81457080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110138677A TW202229494A (zh) 2020-11-04 2021-10-19 接著膜、附支撐片的接著膜及構造體

Country Status (5)

Country Link
JP (1) JPWO2022097443A1 (fr)
KR (1) KR20230104114A (fr)
CN (1) CN116323193A (fr)
TW (1) TW202229494A (fr)
WO (1) WO2022097443A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023139588A1 (fr) * 2022-01-23 2023-07-27 B.G. Negev Technologies And Applications Ltd., At Ben-Gurion University Ruban adhésif composite de graphène induit par laser

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4118691B2 (ja) * 2001-05-18 2008-07-16 株式会社日立製作所 熱硬化性樹脂硬化物
JP2012039064A (ja) * 2010-01-29 2012-02-23 Nitto Denko Corp 熱伝導性シート
KR20130086902A (ko) * 2012-01-26 2013-08-05 도레이첨단소재 주식회사 도전성 난연 접착제 및 이를 이용한 전자파 차폐필름
JP2014156531A (ja) * 2013-02-15 2014-08-28 Hitachi Chemical Co Ltd エポキシ樹脂組成物、接着シート及び半導体素子
JP6221490B2 (ja) * 2013-08-09 2017-11-01 東洋インキＳｃホールディングス株式会社 易変形性凝集体とその製造方法、熱伝導性樹脂組成物、熱伝導性部材とその製造方法、および熱伝導性接着シート
JP2015067713A (ja) 2013-09-28 2015-04-13 株式会社日本触媒 放熱シート
JP6340956B2 (ja) * 2014-07-01 2018-06-13 Dic株式会社 熱接着シート及び物品
JP6451451B2 (ja) * 2015-03-30 2019-01-16 東洋インキＳｃホールディングス株式会社 伝導性シートの製造方法
US20190338171A1 (en) * 2016-10-31 2019-11-07 Sumitomo Bakelite Co., Ltd. Thermally conductive paste and electronic device
JP7395933B2 (ja) * 2018-10-17 2023-12-12 東洋紡株式会社 熱伝導性樹脂組成物
CN109868085A (zh) * 2019-02-01 2019-06-11 江苏斯迪克新材料科技股份有限公司 定向高导热超薄单面胶带
CN110982457A (zh) * 2019-10-16 2020-04-10 山东金鼎电子材料有限公司 一种高导热胶黏剂及其制备方法
CN111171782A (zh) * 2020-01-20 2020-05-19 Tcl华星光电技术有限公司 一种粘合胶组合物、粘合胶组合物制程方法及封装结构
CN111363381A (zh) * 2020-04-29 2020-07-03 沈阳航空航天大学 一种表面功能化bn纳米薄片及其制备方法和应用

Also Published As

Publication number Publication date
KR20230104114A (ko) 2023-07-07
JPWO2022097443A1 (fr) 2022-05-12
CN116323193A (zh) 2023-06-23
WO2022097443A1 (fr) 2022-05-12

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