TW202224942A - 電路連接用接著劑薄膜及其製造方法、以及電路連接結構體及其製造方法 - Google Patents

電路連接用接著劑薄膜及其製造方法、以及電路連接結構體及其製造方法 Download PDF

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Publication number
TW202224942A
TW202224942A TW110141611A TW110141611A TW202224942A TW 202224942 A TW202224942 A TW 202224942A TW 110141611 A TW110141611 A TW 110141611A TW 110141611 A TW110141611 A TW 110141611A TW 202224942 A TW202224942 A TW 202224942A
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TW
Taiwan
Prior art keywords
component
adhesive layer
adhesive
circuit connection
adhesive film
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Application number
TW110141611A
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English (en)
Chinese (zh)
Inventor
山崎智陽
市村剛幸
小林亮太
稗島華世
Original Assignee
日商昭和電工材料股份有限公司
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Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202224942A publication Critical patent/TW202224942A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110141611A 2020-11-10 2021-11-09 電路連接用接著劑薄膜及其製造方法、以及電路連接結構體及其製造方法 TW202224942A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-187267 2020-11-10
JP2020187267 2020-11-10

Publications (1)

Publication Number Publication Date
TW202224942A true TW202224942A (zh) 2022-07-01

Family

ID=81601320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141611A TW202224942A (zh) 2020-11-10 2021-11-09 電路連接用接著劑薄膜及其製造方法、以及電路連接結構體及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2022102573A1 (https=)
TW (1) TW202224942A (https=)
WO (1) WO2022102573A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240118833A (ko) * 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
JPWO2024042720A1 (https=) * 2022-08-26 2024-02-29

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5192194B2 (ja) * 2007-07-26 2013-05-08 デクセリアルズ株式会社 接着フィルム
KR101479658B1 (ko) * 2011-11-18 2015-01-06 제일모직 주식회사 가압착 공정성이 개선된 이방성 도전 필름
JP6269114B2 (ja) * 2014-02-04 2018-01-31 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6409281B2 (ja) * 2014-02-04 2018-10-24 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR102569980B1 (ko) * 2017-09-11 2023-08-24 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
CN112292430A (zh) * 2018-06-06 2021-01-29 迪睿合株式会社 含有填料的膜
KR102832635B1 (ko) * 2019-03-13 2025-07-09 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그 제조 방법, 회로 접속 구조체의 제조 방법, 및, 접착제 필름 수용 세트

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JPWO2022102573A1 (https=) 2022-05-19
WO2022102573A1 (ja) 2022-05-19

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