JPWO2024042720A1 - - Google Patents
Info
- Publication number
- JPWO2024042720A1 JPWO2024042720A1 JP2024542565A JP2024542565A JPWO2024042720A1 JP WO2024042720 A1 JPWO2024042720 A1 JP WO2024042720A1 JP 2024542565 A JP2024542565 A JP 2024542565A JP 2024542565 A JP2024542565 A JP 2024542565A JP WO2024042720 A1 JPWO2024042720 A1 JP WO2024042720A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/032258 WO2024042720A1 (ja) | 2022-08-26 | 2022-08-26 | 回路接続用接着剤フィルム及び接続構造体、並びに、それらの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024042720A1 true JPWO2024042720A1 (https=) | 2024-02-29 |
Family
ID=90012903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024542565A Pending JPWO2024042720A1 (https=) | 2022-08-26 | 2022-08-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024042720A1 (https=) |
| KR (1) | KR20250054076A (https=) |
| CN (1) | CN119790117A (https=) |
| WO (1) | WO2024042720A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026004922A1 (ja) * | 2024-06-25 | 2026-01-02 | 株式会社レゾナック | 複合シートの製造方法、複合シート、接合方法、及び接合体 |
| CN120295255B (zh) * | 2025-04-11 | 2026-01-30 | 宣城乾清电子科技有限公司 | 高效埋线机与压机一体化生产线的智能调度方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100537689C (zh) | 2003-12-04 | 2009-09-09 | 旭化成电子材料株式会社 | 各向异性的导电粘合片材及连接结构体 |
| CN108475558B (zh) * | 2016-02-15 | 2021-11-09 | 迪睿合株式会社 | 各向异性导电膜、其制造方法和连接结构体 |
| CN116003858A (zh) * | 2016-09-13 | 2023-04-25 | 迪睿合株式会社 | 含填料膜 |
| JPWO2022102573A1 (https=) * | 2020-11-10 | 2022-05-19 | ||
| WO2022102672A1 (ja) * | 2020-11-12 | 2022-05-19 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤フィルム及びその製造方法、並びに、接続構造体及びその製造方法 |
-
2022
- 2022-08-26 JP JP2024542565A patent/JPWO2024042720A1/ja active Pending
- 2022-08-26 KR KR1020257008643A patent/KR20250054076A/ko active Pending
- 2022-08-26 WO PCT/JP2022/032258 patent/WO2024042720A1/ja not_active Ceased
- 2022-08-26 CN CN202280099487.6A patent/CN119790117A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024042720A1 (ja) | 2024-02-29 |
| KR20250054076A (ko) | 2025-04-22 |
| CN119790117A (zh) | 2025-04-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250605 |