JPWO2022102573A1 - - Google Patents

Info

Publication number
JPWO2022102573A1
JPWO2022102573A1 JP2022561905A JP2022561905A JPWO2022102573A1 JP WO2022102573 A1 JPWO2022102573 A1 JP WO2022102573A1 JP 2022561905 A JP2022561905 A JP 2022561905A JP 2022561905 A JP2022561905 A JP 2022561905A JP WO2022102573 A1 JPWO2022102573 A1 JP WO2022102573A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022561905A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022102573A1 publication Critical patent/JPWO2022102573A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022561905A 2020-11-10 2021-11-08 Pending JPWO2022102573A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020187267 2020-11-10
PCT/JP2021/040989 WO2022102573A1 (ja) 2020-11-10 2021-11-08 回路接続用接着剤フィルム及びその製造方法、並びに回路接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022102573A1 true JPWO2022102573A1 (https=) 2022-05-19

Family

ID=81601320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561905A Pending JPWO2022102573A1 (https=) 2020-11-10 2021-11-08

Country Status (3)

Country Link
JP (1) JPWO2022102573A1 (https=)
TW (1) TW202224942A (https=)
WO (1) WO2022102573A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240118833A (ko) * 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
JPWO2024042720A1 (https=) * 2022-08-26 2024-02-29

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110110A (ja) * 2011-11-18 2013-06-06 Cheil Industries Inc 仮圧着工程性を改善した異方性導電フィルム及び半導体装置（Ａｎｉｓｏｔｒｏｐｉｃｃｏｎｄｕｃｔｉｖｅｆｉｌｍｗｉｔｈｅａｓｙｐｒｅ−ｂｏｎｄｉｎｇｐｒｏｃｅｓｓａｎｄｔｈｅｓｅｍｉｃｏｎｄｕｃｔｏｒｄｅｖｉｃｅ）
JP2015149127A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2015149125A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
WO2019050012A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP2019214714A (ja) * 2018-06-06 2019-12-19 デクセリアルズ株式会社 フィラー含有フィルム
WO2020184583A1 (ja) * 2019-03-13 2020-09-17 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5192194B2 (ja) * 2007-07-26 2013-05-08 デクセリアルズ株式会社 接着フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110110A (ja) * 2011-11-18 2013-06-06 Cheil Industries Inc 仮圧着工程性を改善した異方性導電フィルム及び半導体装置（Ａｎｉｓｏｔｒｏｐｉｃｃｏｎｄｕｃｔｉｖｅｆｉｌｍｗｉｔｈｅａｓｙｐｒｅ−ｂｏｎｄｉｎｇｐｒｏｃｅｓｓａｎｄｔｈｅｓｅｍｉｃｏｎｄｕｃｔｏｒｄｅｖｉｃｅ）
JP2015149127A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2015149125A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
WO2019050012A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP2019214714A (ja) * 2018-06-06 2019-12-19 デクセリアルズ株式会社 フィラー含有フィルム
WO2020184583A1 (ja) * 2019-03-13 2020-09-17 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット

Also Published As

Publication number Publication date
TW202224942A (zh) 2022-07-01
WO2022102573A1 (ja) 2022-05-19

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