TW202205454A - 元件密封方法、元件密封裝置及半導體製品的製造方法 - Google Patents

元件密封方法、元件密封裝置及半導體製品的製造方法 Download PDF

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Publication number
TW202205454A
TW202205454A TW110108451A TW110108451A TW202205454A TW 202205454 A TW202205454 A TW 202205454A TW 110108451 A TW110108451 A TW 110108451A TW 110108451 A TW110108451 A TW 110108451A TW 202205454 A TW202205454 A TW 202205454A
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TW
Taiwan
Prior art keywords
sealing
sheet
sealing material
plate
substrate
Prior art date
Application number
TW110108451A
Other languages
English (en)
Chinese (zh)
Inventor
秋月伸也
山本雅之
長谷幸敏
村山聰洋
Original Assignee
日商日東電工股份有限公司
日商日東精機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日東電工股份有限公司, 日商日東精機股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202205454A publication Critical patent/TW202205454A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
TW110108451A 2020-03-30 2021-03-10 元件密封方法、元件密封裝置及半導體製品的製造方法 TW202205454A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-060317 2020-03-30
JP2020060317 2020-03-30
JP2021-015586 2021-02-03
JP2021015586A JP2021163959A (ja) 2020-03-30 2021-02-03 デバイス封止方法、デバイス封止装置、および半導体製品の製造方法

Publications (1)

Publication Number Publication Date
TW202205454A true TW202205454A (zh) 2022-02-01

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ID=78003733

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108451A TW202205454A (zh) 2020-03-30 2021-03-10 元件密封方法、元件密封裝置及半導體製品的製造方法

Country Status (3)

Country Link
JP (1) JP2021163959A (ko)
KR (1) KR20210122131A (ko)
TW (1) TW202205454A (ko)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506680B2 (ja) 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法

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Publication number Publication date
KR20210122131A (ko) 2021-10-08
JP2021163959A (ja) 2021-10-11

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