TW202141171A - 位置對準裝置、圖案形成裝置及物品之製造方法 - Google Patents

位置對準裝置、圖案形成裝置及物品之製造方法 Download PDF

Info

Publication number
TW202141171A
TW202141171A TW110108060A TW110108060A TW202141171A TW 202141171 A TW202141171 A TW 202141171A TW 110108060 A TW110108060 A TW 110108060A TW 110108060 A TW110108060 A TW 110108060A TW 202141171 A TW202141171 A TW 202141171A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate holding
holding portion
position alignment
aforementioned
Prior art date
Application number
TW110108060A
Other languages
English (en)
Chinese (zh)
Inventor
山口樹
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202141171A publication Critical patent/TW202141171A/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW110108060A 2020-04-03 2021-03-08 位置對準裝置、圖案形成裝置及物品之製造方法 TW202141171A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-067783 2020-04-03
JP2020067783A JP7467207B2 (ja) 2020-04-03 2020-04-03 位置合わせ装置、パターン形成装置及び物品の製造方法

Publications (1)

Publication Number Publication Date
TW202141171A true TW202141171A (zh) 2021-11-01

Family

ID=77997675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108060A TW202141171A (zh) 2020-04-03 2021-03-08 位置對準裝置、圖案形成裝置及物品之製造方法

Country Status (4)

Country Link
JP (1) JP7467207B2 (enExample)
KR (1) KR20210124036A (enExample)
CN (1) CN113495428A (enExample)
TW (1) TW202141171A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114153128B (zh) * 2021-12-16 2023-11-24 江苏特纳马智能制造有限公司 一种曝光机玻璃基板表面温度控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
JPWO2007080779A1 (ja) * 2006-01-12 2009-06-11 株式会社ニコン 物体搬送装置、露光装置、物体温調装置、物体搬送方法、及びマイクロデバイスの製造方法
JP2009239097A (ja) * 2008-03-27 2009-10-15 Nikon Corp 搬送装置、露光装置、及びデバイス製造方法
KR101000219B1 (ko) * 2008-07-31 2010-12-10 주식회사 케이씨텍 원자층 증착 장치
JP2010074037A (ja) * 2008-09-22 2010-04-02 Nuflare Technology Inc サセプタ、半導体製造装置および半導体製造方法
JP2012114219A (ja) 2010-11-24 2012-06-14 Canon Inc 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
CN105088186B (zh) * 2011-11-23 2018-05-15 中微半导体设备(上海)有限公司 化学气相沉积反应器或外延层生长反应器及其支撑装置
JP6627936B1 (ja) 2018-08-30 2020-01-08 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

Also Published As

Publication number Publication date
CN113495428A (zh) 2021-10-12
JP7467207B2 (ja) 2024-04-15
JP2021162821A (ja) 2021-10-11
KR20210124036A (ko) 2021-10-14

Similar Documents

Publication Publication Date Title
KR100804006B1 (ko) 웨이퍼 척
TWI714048B (zh) 基材載體、圖案化數個基材的方法、及處理系統
CN103531511B (zh) 吸盘及使用该吸盘的承片台和硅片吸附方法
US10319623B2 (en) Conveyance hand, conveyance apparatus, lithography apparatus, manufacturing method of article, and holding mechanism
US8468690B2 (en) Holding member for use in test and method for manufacturing same
US10651075B2 (en) Wafer table with dynamic support pins
TWI604278B (zh) 曝光裝置和製造設備的方法
JP2003218186A (ja) 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置
TW202109177A (zh) 基板固持器、微影設備及方法
CN105518844A (zh) 用于使晶片对准和居中的装置和方法
JP2003258071A (ja) 基板保持装置及び露光装置
TW202141171A (zh) 位置對準裝置、圖案形成裝置及物品之製造方法
JP2015018927A (ja) 基板保持方法及び装置、並びに露光方法及び装置
JP2009239097A (ja) 搬送装置、露光装置、及びデバイス製造方法
JP2750554B2 (ja) 真空吸着装置
KR101291516B1 (ko) 위치 수정 장치, 진공 처리 장치, 및 위치 수정 방법
JP3604985B2 (ja) パターン転写装置
JP2014138078A (ja) 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法
JP4026904B2 (ja) 基板搬送装置および露光装置
JP2001274078A (ja) 温調装置、デバイス製造装置およびデバイス製造方法
JPH10247681A (ja) 位置ずれ検出方法及び装置、位置決め装置並びに露光装置
CN116266542A (zh) 半导体制造装置及其制造方法
JP2004165439A (ja) ステージ装置
JP2012114219A (ja) 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
JPH0831719A (ja) 半導体基板用吸着ホルダー及び投影露光装置