JP7467207B2 - 位置合わせ装置、パターン形成装置及び物品の製造方法 - Google Patents

位置合わせ装置、パターン形成装置及び物品の製造方法 Download PDF

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Publication number
JP7467207B2
JP7467207B2 JP2020067783A JP2020067783A JP7467207B2 JP 7467207 B2 JP7467207 B2 JP 7467207B2 JP 2020067783 A JP2020067783 A JP 2020067783A JP 2020067783 A JP2020067783 A JP 2020067783A JP 7467207 B2 JP7467207 B2 JP 7467207B2
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Japan
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substrate
unit
substrate holding
axis
holding unit
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English (en)
Japanese (ja)
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JP2021162821A (ja
JP2021162821A5 (enExample
Inventor
直樹 山口
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020067783A priority Critical patent/JP7467207B2/ja
Priority to TW110108060A priority patent/TW202141171A/zh
Priority to KR1020210033282A priority patent/KR20210124036A/ko
Priority to CN202110346461.4A priority patent/CN113495428A/zh
Publication of JP2021162821A publication Critical patent/JP2021162821A/ja
Publication of JP2021162821A5 publication Critical patent/JP2021162821A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2020067783A 2020-04-03 2020-04-03 位置合わせ装置、パターン形成装置及び物品の製造方法 Active JP7467207B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020067783A JP7467207B2 (ja) 2020-04-03 2020-04-03 位置合わせ装置、パターン形成装置及び物品の製造方法
TW110108060A TW202141171A (zh) 2020-04-03 2021-03-08 位置對準裝置、圖案形成裝置及物品之製造方法
KR1020210033282A KR20210124036A (ko) 2020-04-03 2021-03-15 위치맞춤 장치, 패턴 형성장치, 및 물품의 제조 방법
CN202110346461.4A CN113495428A (zh) 2020-04-03 2021-03-31 位置对准装置、图案形成装置及物品的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020067783A JP7467207B2 (ja) 2020-04-03 2020-04-03 位置合わせ装置、パターン形成装置及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2021162821A JP2021162821A (ja) 2021-10-11
JP2021162821A5 JP2021162821A5 (enExample) 2023-04-05
JP7467207B2 true JP7467207B2 (ja) 2024-04-15

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JP (1) JP7467207B2 (enExample)
KR (1) KR20210124036A (enExample)
CN (1) CN113495428A (enExample)
TW (1) TW202141171A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114153128B (zh) * 2021-12-16 2023-11-24 江苏特纳马智能制造有限公司 一种曝光机玻璃基板表面温度控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
WO2007080779A1 (ja) 2006-01-12 2007-07-19 Nikon Corporation 物体搬送装置、露光装置、物体温調装置、物体搬送方法、及びマイクロデバイスの製造方法
JP2012114219A (ja) 2010-11-24 2012-06-14 Canon Inc 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
JP2020035905A (ja) 2018-08-30 2020-03-05 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239097A (ja) * 2008-03-27 2009-10-15 Nikon Corp 搬送装置、露光装置、及びデバイス製造方法
KR101000219B1 (ko) * 2008-07-31 2010-12-10 주식회사 케이씨텍 원자층 증착 장치
JP2010074037A (ja) * 2008-09-22 2010-04-02 Nuflare Technology Inc サセプタ、半導体製造装置および半導体製造方法
CN105088186B (zh) * 2011-11-23 2018-05-15 中微半导体设备(上海)有限公司 化学气相沉积反应器或外延层生长反应器及其支撑装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
WO2007080779A1 (ja) 2006-01-12 2007-07-19 Nikon Corporation 物体搬送装置、露光装置、物体温調装置、物体搬送方法、及びマイクロデバイスの製造方法
JP2012114219A (ja) 2010-11-24 2012-06-14 Canon Inc 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
JP2020035905A (ja) 2018-08-30 2020-03-05 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

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Publication number Publication date
KR20210124036A (ko) 2021-10-14
CN113495428A (zh) 2021-10-12
JP2021162821A (ja) 2021-10-11
TW202141171A (zh) 2021-11-01

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