TW202141171A - Position alignment device, pattern forming device and method of manufacturing article wherein the position alignment device includes a substrate holding portion, a substrate temperature regulating part, driving parts and a control part - Google Patents

Position alignment device, pattern forming device and method of manufacturing article wherein the position alignment device includes a substrate holding portion, a substrate temperature regulating part, driving parts and a control part Download PDF

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TW202141171A
TW202141171A TW110108060A TW110108060A TW202141171A TW 202141171 A TW202141171 A TW 202141171A TW 110108060 A TW110108060 A TW 110108060A TW 110108060 A TW110108060 A TW 110108060A TW 202141171 A TW202141171 A TW 202141171A
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substrate
substrate holding
holding portion
position alignment
aforementioned
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TW110108060A
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山口樹
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日商佳能股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Atmospheric Sciences (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention relates to a position alignment device, a pattern forming device and a method of manufacturing an article. The position alignment device can reduce a load during driving and can adjust a temperature of a substrate with a simple structure. The position alignment device (60) according to the present invention includes a substrate holding portion (3) that holds a substrate (1) on a substrate holding surface, a substrate temperature regulating part (8) which regulates the temperature of the substrate (1) via the substrate holding part (3), driving parts (4, 5, 6, 7) configured to move the substrate holding part (3) and a control part configured to control the driving parts (4, 5, 6, 7). The substrate temperature regulating part (8) is configured to regulate the temperature of the substrate (1) when being in contact with a second surface, different from the substrate holding surface, of the substrate holding portion (3).

Description

位置對準裝置、圖案形成裝置及物品之製造方法Position alignment device, pattern forming device and manufacturing method of article

本發明涉及位置對準裝置、圖案形成裝置及物品之製造方法。The invention relates to a position alignment device, a pattern forming device and a method of manufacturing an article.

以往，使曝光裝置中所使用的基板的位置對準裝置具備用於對基板進行調溫的功能，節省從位置對準裝置向調溫裝置搬送基板的搬送時間，由此實現提高處理量。 日本特開2005-311113號公報公開了一種位置對準裝置，具備：轉動手段，其用於保持基板並使基板旋轉；以及調溫手段，其設置在轉動手段的內部，用於與基板接觸來對基板進行調溫。Conventionally, the positioning device of the substrate used in the exposure apparatus is provided with a function for adjusting the temperature of the substrate, and the transfer time of the substrate from the positioning device to the temperature adjustment device is saved, thereby achieving an increase in throughput. Japanese Patent Laid-Open No. 2005-311113 discloses a position alignment device including: a rotating means for holding and rotating the substrate; and a temperature adjusting means provided inside the rotating means for contact with the substrate Adjust the temperature of the substrate.

然而，在日本特開2005-311113號公報公開的位置對準裝置中，調溫手段設置在轉動手段的內部，因而轉動手段增重，由此對於旋轉驅動施加了負載。 此外，需要考慮到轉動手段的旋轉並將調溫用管、控制電纜等配線連接於調溫手段，因而構造複雜化。However, in the positioning device disclosed in Japanese Patent Application Laid-Open No. 2005-311113, the temperature adjusting means is provided inside the rotating means, so the rotating means increases in weight, thereby imposing a load on the rotating drive. In addition, it is necessary to take into account the rotation of the rotating means and to connect wiring such as temperature-adjusting pipes and control cables to the temperature-adjusting means, which complicates the structure.

因而，本發明的目的在於提供能夠降低驅動中的負載並且能夠以簡單的構造對基板進行調溫的位置對準裝置。Therefore, an object of the present invention is to provide a position alignment device that can reduce the load during driving and can adjust the temperature of the substrate with a simple structure.

本發明涉及一種位置對準裝置，其具備：基板保持部，其將基板保持於第一面；基板調溫部，其經由基板保持部對基板進行調溫；驅動部，其使基板保持部移動；以及控制部，其控制驅動部，基板調溫部在與第一面不同的基板保持部的第二面接觸的狀態下對基板進行調溫。The present invention relates to a position alignment device including: a substrate holding portion that holds a substrate on a first surface; a substrate temperature adjusting portion that adjusts the temperature of the substrate via the substrate holding portion; and a driving portion that moves the substrate holding portion And a control section that controls the drive section, and the substrate temperature adjustment section adjusts the temperature of the substrate in a state where the substrate temperature adjustment section is in contact with the second surface of the substrate holding section that is different from the first surface.

以下，基於附圖對本實施方式涉及的位置對準裝置詳細進行說明。另外，為了便於理解本實施方式，以下所示的圖是以與實際情況不同的比例尺繪製的。 另外，在以下的說明中，將與基板保持部3的基板保持面(第一面)垂直的方向作為Z軸，將在與Z軸垂直的平面內彼此正交的兩個方向分別作為X軸和Y軸。Hereinafter, the position alignment device according to this embodiment will be described in detail based on the drawings. In addition, in order to facilitate the understanding of this embodiment, the figures shown below are drawn on a scale different from the actual situation. In addition, in the following description, the direction perpendicular to the substrate holding surface (first surface) of the substrate holding portion 3 is referred to as the Z axis, and two directions orthogonal to each other in a plane perpendicular to the Z axis are referred to as X axes. And Y axis.

近年，為了實現半導體器件中的圖案的進一步精細化，在既定的製造進程中對基板進行調溫。 尤其是在曝光裝置中，在基板位置對準程序之前進行基板調溫程序，由此使基板的溫度分佈均勻，從而能夠提高重合精度。In recent years, in order to achieve further refinement of patterns in semiconductor devices, the substrate temperature has been adjusted in a predetermined manufacturing process. Especially in the exposure apparatus, the substrate temperature adjustment process is performed before the substrate positioning process, so that the temperature distribution of the substrate is uniform, and the accuracy of the registration can be improved.

然而，當在基板位置對準程序之前設置基板調溫程序時，由於需要在將基板搬入用於進行基板調溫程序的裝置之後還將基板搬送到用於進行基板位置對準程序的裝置的時間，因而基板的處理速度降低，生產率下降。 因此，為了抑制生產率下降，提出了使基板位置對準裝置具備對基板進行調溫功能的技術。However, when the substrate temperature adjustment program is set before the substrate alignment program, it is necessary to transfer the substrate to the device for performing the substrate alignment program after the substrate is loaded into the device for performing the substrate temperature adjustment program. Therefore, the processing speed of the substrate is reduced, and the productivity is reduced. Therefore, in order to suppress the decrease in productivity, a technique has been proposed to provide a substrate positioning device with a function of adjusting the temperature of the substrate.

此外，例如當將調溫部件設置在用於使基板旋轉的轉動部件內時轉動部件增重，因而基板的旋轉速度降低，並且會對用於旋轉的驅動裝置施加大的負載。 此外，這導致需要考慮到轉動部件的旋轉並將調溫用管、控制電纜等配線連接於調溫部件，構造複雜化。 因此，本實施方式涉及的位置對準裝置的主要目的在於解決這樣的問題。In addition, for example, when the temperature adjusting member is provided in the rotating member for rotating the substrate, the rotating member increases in weight, so the rotation speed of the substrate decreases, and a large load is applied to the driving device for rotating. In addition, this leads to the need to consider the rotation of the rotating parts and to connect wiring such as temperature control pipes and control cables to the temperature control parts, which complicates the structure. Therefore, the main purpose of the position alignment device according to this embodiment is to solve such a problem.

[第一實施方式] 圖1A及圖1B示出了第一實施方式涉及的位置對準裝置60的示意性剖視圖。 此外，圖1C示出了第一實施方式涉及的位置對準裝置60的局部的示意性立體圖。[First Embodiment] 1A and 1B show schematic cross-sectional views of the position alignment device 60 according to the first embodiment. In addition, FIG. 1C shows a schematic perspective view of a part of the position alignment device 60 according to the first embodiment.

本實施方式涉及的位置對準裝置60具備檢測部2、基板保持部3、X軸驅動部4、Y軸驅動部5、θ軸驅動部6、Z軸驅動部7、基板調溫部8以及殼體9。 此外，本實施方式涉及的位置對準裝置60還具備未圖示的控制部，該控制部控制X軸驅動部4、Y軸驅動部5、θ軸驅動部6以及Z軸驅動部7的驅動。The positioning device 60 according to this embodiment includes a detection unit 2, a substrate holding unit 3, an X-axis drive unit 4, a Y-axis drive unit 5, a θ-axis drive unit 6, a Z-axis drive unit 7, a substrate temperature control unit 8, and壳9。 9. In addition, the position alignment device 60 according to the present embodiment further includes a control unit (not shown) that controls the driving of the X-axis drive unit 4, the Y-axis drive unit 5, the θ-axis drive unit 6, and the Z-axis drive unit 7. .

如圖1A及圖1B所示，在本實施方式涉及的位置對準裝置60中，Y軸驅動部5載置於X軸驅動部4上，並且Z軸驅動部7載置於Y軸驅動部5上。並且，θ軸驅動部6以能夠在Z軸方向上移動的方式被保持於Z軸驅動部7的側面。 並且，基板調溫部8載置於殼體9上，作為驅動部的X軸驅動部4、Y軸驅動部5、θ軸驅動部6及Z軸驅動部7配置於殼體9內。As shown in FIGS. 1A and 1B, in the positioning device 60 according to the present embodiment, the Y-axis drive section 5 is placed on the X-axis drive section 4, and the Z-axis drive section 7 is placed on the Y-axis drive section. 5 on. In addition, the θ-axis drive unit 6 is held on the side surface of the Z-axis drive unit 7 so as to be movable in the Z-axis direction. In addition, the substrate temperature control unit 8 is placed on the casing 9, and the X-axis drive unit 4, the Y-axis drive unit 5, the θ-axis drive unit 6 and the Z-axis drive unit 7 as drive units are arranged in the casing 9.

此外，基板保持部3載置於基板調溫部8上，並且θ軸驅動部6的軸部6a以頂端部與基板保持部3的底面抵接的方式穿通基板調溫部8的貫通孔並延伸。In addition, the substrate holding portion 3 is placed on the substrate temperature regulating portion 8, and the shaft portion 6a of the θ-axis driving portion 6 penetrates through the through hole of the substrate temperature regulating portion 8 so that the top end is in contact with the bottom surface of the substrate holding portion 3. extend.

並且，在對基板1進行位置對準時，基板1載置於基板保持部3上。 即，在本實施方式涉及的位置對準裝置60中，基板1與基板調溫部8不直接接觸。 換言之，在本實施方式涉及的位置對準裝置60中，基板調溫部8在與基板保持部3的基板保持面(第一面)不同的基板保持部3的第二面接觸的狀態下對基板1進行調溫。 另外，在本實施方式涉及的位置對準裝置60中，θ軸驅動部6的軸部6a的直徑與基板調溫部8的貫通孔的直徑大致相同，即θ軸驅動部6的軸部6a與基板調溫部8也抵接。In addition, when the substrate 1 is aligned, the substrate 1 is placed on the substrate holding portion 3. In other words, in the positioning device 60 according to the present embodiment, the substrate 1 and the substrate temperature control unit 8 are not in direct contact. In other words, in the positioning device 60 according to the present embodiment, the substrate temperature adjustment section 8 is in contact with the second surface of the substrate holding section 3, which is different from the substrate holding surface (first surface) of the substrate holding section 3. The temperature of the substrate 1 is adjusted. In addition, in the positioning device 60 according to the present embodiment, the diameter of the shaft portion 6a of the θ-axis driving portion 6 is approximately the same as the diameter of the through hole of the substrate temperature adjustment portion 8, that is, the shaft portion 6a of the θ-axis driving portion 6 It is also in contact with the substrate temperature control unit 8.

作為檢測部2，能夠使用例如能夠通過獲取圖像信號來計測基板1的位置的CCD(Charge Coupled Device：電荷耦合器件)。 並且如圖1C所示，在本實施方式涉及的位置對準裝置60中，在基板1的周圍相互隔開120度間隔地配置三個檢測部2。 由此，能夠同時計測基板1的外周以及基準點(在基板1是晶圓的情況下，為切槽或定向平面)，能夠提高計測準確度並且減少計測時間。As the detection unit 2, for example, a CCD (Charge Coupled Device) capable of measuring the position of the substrate 1 by acquiring an image signal can be used. In addition, as shown in FIG. 1C, in the positioning device 60 according to the present embodiment, three detection units 2 are arranged around the substrate 1 at intervals of 120 degrees. Thereby, the outer periphery of the substrate 1 and the reference point (when the substrate 1 is a wafer, a notch or an orientation plane) can be measured at the same time, the measurement accuracy can be improved and the measurement time can be reduced.

另外，檢測部2不限於三個，優選在基板1的外周部配置多個檢測部2而成的結構。 此外，在本實施方式涉及的位置對準裝置60中，採用CCD來作為檢測部2，但不限於此，作為能夠計測基板1的位置的構造，也可以使用能夠拍攝基板1整體的照相機等，計測基板1上的既定的標記。 或者，也可以是，在基板1的邊緣部的多個部位處，配置光學式的位置感測器來替代CCD，由此同時計測基板1的邊緣部的多個部位的位置。In addition, the detection unit 2 is not limited to three, and a configuration in which a plurality of detection units 2 are arranged on the outer peripheral portion of the substrate 1 is preferable. In addition, in the position alignment device 60 according to the present embodiment, a CCD is used as the detection unit 2, but it is not limited to this. As a structure capable of measuring the position of the substrate 1, a camera or the like that can image the entire substrate 1 may be used. The predetermined mark on the substrate 1 is measured. Alternatively, instead of CCDs, optical position sensors may be arranged at multiple locations on the edge of the substrate 1 to measure the positions of multiple locations on the edge of the substrate 1 at the same time.

基板保持部3具備在對基板1進行位置對準時用於保持基板1的構造，在本實施方式涉及的位置對準裝置60中，採用能夠以簡單的構造來提高基板保持部3與基板1之間的密接性的真空吸附方式。 另外，基板保持部3所採用的基板保持方法不限於此，也可以採用靜電吸附方式、機械性地保持基板1的邊緣部的方法。The substrate holding portion 3 is provided with a structure for holding the substrate 1 when the substrate 1 is aligned. The positioning device 60 according to the present embodiment adopts a simple structure to increase the gap between the substrate holding portion 3 and the substrate 1. Vacuum adsorption method for close adhesion between. In addition, the substrate holding method adopted by the substrate holding portion 3 is not limited to this, and an electrostatic adsorption method or a method of mechanically holding the edge portion of the substrate 1 may be adopted.

此外，作為基板保持部3的材質，能夠採用熱傳導性優異並且比剛性高的例如SiC等陶瓷。 但不限於此，作為基板保持部3的材質，也能夠採用其它熱傳導性優異的金屬，或者也可以對基板保持部3整體塗佈(例如，鑽石塗佈等)用於提高熱傳導性的素材。 此外，在本實施方式涉及的位置對準裝置60中，為了簡化構造且定位功能與調溫功能的同時成立，優選為使用上述那樣的陶瓷。In addition, as the material of the substrate holding portion 3, ceramics such as SiC, which is excellent in thermal conductivity and higher than rigidity, can be used. However, it is not limited to this. As the material of the substrate holding portion 3, other metals having excellent thermal conductivity may be used, or the entire substrate holding portion 3 may be coated (for example, diamond coating, etc.) with materials for improving thermal conductivity. In addition, in the positioning device 60 according to the present embodiment, in order to simplify the structure and achieve the positioning function and the temperature adjustment function at the same time, it is preferable to use the above-mentioned ceramics.

X軸驅動部4、Y軸驅動部5、θ軸驅動部6以及Z軸驅動部7分別基於檢測部2檢測出的基板1的位置資訊，來使載置有基板1的基板保持部3在X軸方向、Y軸方向、θ軸方向以及Z軸方向上移動。 這樣，通過對四個軸向分別設置獨立的驅動部，能夠正確且迅速地對基板1進行位置控制。The X-axis drive section 4, Y-axis drive section 5, θ-axis drive section 6, and Z-axis drive section 7 respectively position the substrate holding section 3 on which the substrate 1 is placed based on the position information of the substrate 1 detected by the detection section 2. Move in the X-axis direction, Y-axis direction, θ-axis direction, and Z-axis direction. In this way, by providing independent driving parts for each of the four axial directions, the position of the substrate 1 can be accurately and quickly controlled.

基板調溫部8具備能夠將基板1調整為既定溫度的機構，在本實施方式涉及的位置對準裝置60中，使既定溫度的水、防凍液等流體流入基板調溫部8。 由此，能夠一邊監視設置於基板調溫部8的未圖示的溫度計測部，一邊通過與基板保持部3的熱接觸來將基板1調溫為既定溫度。即，基板調溫部8能夠在同與基板保持部3的基板保持面相反的底面接觸的狀態下，將基板1調溫為既定溫度。此外，基板調溫部8接觸的面不僅限於與基板保持面相反的底面。例如，也可以是基板保持部3的側面，如果是基板保持部3的與基板保持面不同的面(第二面)即可。 此外，調節基板1的溫度的方法不限於使流體流入基板調溫部8的方法，也可以通過對基板調溫部8設置帕耳帖元件等熱電元件並且進行電動作，來調節基板1的溫度。The substrate temperature adjustment unit 8 includes a mechanism capable of adjusting the substrate 1 to a predetermined temperature. In the positioning device 60 according to the present embodiment, fluids such as water and antifreeze at a predetermined temperature are allowed to flow into the substrate temperature adjustment unit 8. Thereby, it is possible to adjust the temperature of the substrate 1 to a predetermined temperature by thermal contact with the substrate holding portion 3 while monitoring the temperature measurement unit (not shown) provided in the substrate temperature adjustment portion 8. In other words, the substrate temperature adjustment section 8 can adjust the temperature of the substrate 1 to a predetermined temperature in a state in which it is in contact with the bottom surface opposite to the substrate holding surface of the substrate holding section 3. In addition, the surface that the substrate temperature control portion 8 contacts is not limited to the bottom surface opposite to the substrate holding surface. For example, it may be the side surface of the substrate holding portion 3, if it is a surface (second surface) of the substrate holding portion 3 that is different from the substrate holding surface. In addition, the method of adjusting the temperature of the substrate 1 is not limited to the method of making the fluid flow into the substrate temperature regulating portion 8. The temperature of the substrate 1 can be adjusted by providing a thermoelectric element such as a Peltier element in the substrate temperature regulating portion 8 and performing electrical operations. .

此外，優選配置為，基板調溫部8以充分大的面積來與基板保持部3接觸。 此外，更優選為，基板調溫部8以比要進行調溫的基板1大的面積來與基板保持部3接觸。 因此，在本實施方式涉及的位置對準裝置60中，以使基板調溫部8與載置有基板1的基板保持部3的底面接觸的方式配置基板調溫部8，其接觸面積與基板保持部3的底面積大致相同，並且比基板1的面積大。Moreover, it is preferable to arrange so that the substrate temperature adjustment part 8 may contact the substrate holding part 3 with a sufficiently large area. In addition, it is more preferable that the substrate temperature adjustment portion 8 comes into contact with the substrate holding portion 3 with a larger area than the substrate 1 to be subjected to temperature adjustment. Therefore, in the positioning device 60 according to the present embodiment, the substrate temperature adjustment portion 8 is arranged such that the substrate temperature adjustment portion 8 is in contact with the bottom surface of the substrate holding portion 3 on which the substrate 1 is placed, and the contact area of the substrate temperature adjustment portion 8 is the same as that of the substrate. The bottom area of the holding portion 3 is approximately the same and is larger than the area of the substrate 1.

由此，能夠由基板調溫部8對底面整體接觸於基板保持部3的基板1進行均勻地調溫，能夠抑制基板1的調溫不均勻。Thereby, the substrate 1 whose entire bottom surface is in contact with the substrate holding portion 3 can be uniformly adjusted in temperature by the substrate temperature adjustment portion 8, and it is possible to suppress unevenness in temperature adjustment of the substrate 1.

此外，基板保持部3與基板調溫部8之間的接觸會對於基板1的調溫性能造成大的影響。 因此，優選為，使基板保持部3與基板調溫部8相互物理地緊固，使兩者的界面的摩擦係數盡可能小，使兩者相互真空吸附等，由此使有效接觸面積盡可能大。 此外，基板調溫部8的對於基板保持部3的接觸部、即基板調溫部8的上表面的材質優選例如以銅為代表的金屬、熱傳導性高的陶瓷(例如SiC)等熱導率高的材料。In addition, the contact between the substrate holding portion 3 and the substrate temperature adjustment portion 8 will have a large influence on the temperature adjustment performance of the substrate 1. Therefore, it is preferable to physically fasten the substrate holding portion 3 and the substrate temperature regulating portion 8 to each other, to make the friction coefficient of the interface between the two as small as possible, and to vacuum suck the two to each other, thereby making the effective contact area as large as possible. big. In addition, the material of the upper surface of the substrate temperature control portion 8 that is in contact with the substrate holding portion 3, that is, the upper surface of the substrate temperature control portion 8, is preferably, for example, a metal represented by copper, or a high thermal conductivity ceramic (for example, SiC). High material.

然後，對本實施方式涉及的位置對準裝置60的動作進行說明。Next, the operation of the positioning device 60 according to this embodiment will be described.

首先，如圖1A所示，當基板1被搬入到位置對準裝置60時，基板1載置於基板保持部3上。 並且當基板1載置於基板保持部3上時，首先使Z軸驅動部7驅動由此使θ軸驅動部6上升。 由此，如圖1B所示，基板保持部3及其載置的基板1上升，基板保持部3從基板調溫部8離開。First, as shown in FIG. 1A, when the substrate 1 is carried into the positioning device 60, the substrate 1 is placed on the substrate holding portion 3. When the substrate 1 is placed on the substrate holding portion 3, first, the Z-axis drive portion 7 is driven, and the θ-axis drive portion 6 is raised. As a result, as shown in FIG. 1B, the substrate holding portion 3 and the substrate 1 on which it is placed rise, and the substrate holding portion 3 is separated from the substrate temperature control portion 8.

並且，以使在基板1形成的切槽1a位於既定的檢測部2的檢測範圍內的既定位置的方式對θ軸驅動部6進行驅動，由此使基板保持部3及其載置的基板1在繞Z軸的旋轉方向、即θ軸方向旋轉。之後，剩餘的兩個檢測部2檢測基板1的邊緣(緣部)。 這樣，基於三個檢測部2檢測到的基板1的各位置，確定配置在位置對準裝置60上時的基板1在X軸、Y軸及θ軸上的位置。Then, the θ-axis driving section 6 is driven so that the notch 1a formed in the substrate 1 is located at a predetermined position within the detection range of the predetermined detection section 2, thereby enabling the substrate holding section 3 and the substrate 1 on which it is placed. Rotate in the direction of rotation around the Z axis, that is, the θ axis direction. After that, the remaining two detection units 2 detect the edges (edges) of the substrate 1. In this way, based on the positions of the substrate 1 detected by the three detection units 2, the positions of the substrate 1 on the X-axis, Y-axis, and θ-axis when placed on the positioning device 60 are determined.

然後，基於上述那樣確定的位置，如以下那樣對基板1進行位置對準。 首先，為了對基板1進行θ軸上的位置對準，基於如上述那樣確定的基板1在θ軸上的位置，以使基板1移動到θ軸上的既定位置的方式，來使θ軸驅動部6驅動。 由此，使基板保持部3及其載置的基板1在θ軸方向旋轉。Then, based on the position determined as described above, the substrate 1 is aligned as follows. First, in order to position the substrate 1 on the θ axis, based on the position of the substrate 1 on the θ axis determined as described above, the θ axis is driven to move the substrate 1 to a predetermined position on the θ axis. Section 6 is driven. As a result, the substrate holding portion 3 and the substrate 1 on which it is placed are rotated in the θ-axis direction.

之後，以使θ軸驅動部6下降的方式來使Z軸驅動部7驅動，由此如圖1A所示，基板保持部3及其載置的基板1下降，基板保持部3與基板調溫部8相互接觸。 並且，為了對基板1進行X軸及Y軸上的位置對準，基於如上述那樣確定的基板1在X軸及Y軸上的位置，以使基板1移動到X軸及Y軸各自上的既定位置的方式，來使X軸驅動部4及Y軸驅動部5驅動。 由此，Z軸驅動部7及其保持的θ軸驅動部6在X軸方向及Y軸方向分別移動，基板調溫部8、基板保持部3以及基板1在X軸方向及Y軸方向分別移動。After that, the Z-axis drive section 7 is driven to lower the θ-axis drive section 6 so that the substrate holding section 3 and the substrate 1 on which it is placed are lowered as shown in FIG. The parts 8 are in contact with each other. In addition, in order to align the X-axis and Y-axis positions of the substrate 1, based on the positions of the substrate 1 on the X-axis and Y-axis determined as described above, the substrate 1 is moved to the X-axis and Y-axis respectively. The X-axis drive unit 4 and the Y-axis drive unit 5 are driven by a predetermined position method. As a result, the Z-axis drive unit 7 and the θ-axis drive unit 6 held by it move in the X-axis direction and the Y-axis direction, respectively, and the substrate temperature control unit 8, the substrate holding portion 3, and the substrate 1 move in the X-axis direction and the Y-axis direction, respectively. move.

另外，在本實施方式涉及的位置對準裝置60中，如上述那樣在對基板1進行X軸及Y軸上的位置對準時，使基板保持部3與基板調溫部8接觸，由此能夠通過與基板保持部3的熱接觸來由基板調溫部8將基板1調溫為既定溫度。In addition, in the positioning device 60 according to this embodiment, when the substrate 1 is aligned on the X-axis and Y-axis as described above, the substrate holding portion 3 is brought into contact with the substrate temperature control portion 8, thereby enabling The substrate temperature adjustment unit 8 adjusts the temperature of the substrate 1 to a predetermined temperature by thermal contact with the substrate holding portion 3.

此外，當如上述那樣對基板1進行X軸及Y軸上的位置對準時，基板1有可能在θ軸方向僅微小量地移動。 因此，在基板1的位置對準中要求更高的精度的情況下，再次使Z軸驅動部7驅動由此使基板保持部3及被載置的基板1上升之後，對基板1進行θ軸上的位置對準。 另外，此時，θ軸方向的移動為微小量，因此也可以是，不使Z軸驅動部7驅動，而使基板保持部3與基板調溫部8相互繼續保持接觸，對基板1進行θ軸上的位置對準。In addition, when the substrate 1 is aligned on the X-axis and Y-axis as described above, the substrate 1 may move only a small amount in the θ-axis direction. Therefore, when higher accuracy is required for the positional alignment of the substrate 1, the Z-axis drive unit 7 is driven again to raise the substrate holding portion 3 and the mounted substrate 1, and then the substrate 1 is subjected to the theta axis. Alignment on the position. In addition, at this time, the movement in the θ-axis direction is a small amount. Therefore, the Z-axis driving unit 7 may not be driven, and the substrate holding portion 3 and the substrate temperature regulating portion 8 may be kept in contact with each other to perform θ on the substrate 1. The position on the shaft is aligned.

此外，在進行θ軸上的位置對準的情況下，基板保持部3從基板調溫部8離開，因此基板保持部3與基板調溫部8之間的熱接觸減弱。 然而，通過使相互之間的餘隙充分減小，能夠利用鄰近效應來充分抑制基板1的調溫效果下降。In addition, when the positional alignment on the θ axis is performed, the substrate holding portion 3 is separated from the substrate temperature adjusting portion 8, and therefore, the thermal contact between the substrate holding portion 3 and the substrate temperature adjusting portion 8 is weakened. However, by sufficiently reducing the mutual clearance, the proximity effect can be used to sufficiently suppress the decrease in the temperature adjustment effect of the substrate 1.

如以上那樣，在本實施方式涉及的位置對準裝置60中，Z軸驅動部7使基板保持部3在與基板保持部3的基板保持面垂直的Z軸方向移動，使得基板保持部3成為不載置於基板調溫部8上的狀態(第二狀態)。 然後，在基板保持部3不載置於基板調溫部8上的狀態下，θ軸驅動部6使基板保持部3繞Z軸方向旋轉。As described above, in the positioning device 60 according to this embodiment, the Z-axis drive section 7 moves the substrate holding section 3 in the Z-axis direction perpendicular to the substrate holding surface of the substrate holding section 3 so that the substrate holding section 3 becomes The state not placed on the substrate temperature control unit 8 (second state). Then, in a state where the substrate holding portion 3 is not placed on the substrate temperature adjustment portion 8, the θ-axis driving portion 6 rotates the substrate holding portion 3 in the Z-axis direction.

之後，Z軸驅動部7使基板保持部3在Z軸方向移動，使得基板保持部3成為載置於基板調溫部8上的狀態(第一狀態)。 並且，在基板保持部3載置於基板調溫部8上的狀態下，X軸驅動部4以及Y軸驅動部5分別使基板保持部3以及基板調溫部8在與基板保持部3的基板保持面平行的X軸方向以及Y軸方向移動。After that, the Z-axis drive section 7 moves the substrate holding section 3 in the Z-axis direction so that the substrate holding section 3 is placed on the substrate temperature control section 8 (first state). In addition, in a state where the substrate holding portion 3 is placed on the substrate temperature adjustment portion 8, the X-axis drive portion 4 and the Y-axis drive portion 5 respectively place the substrate holding portion 3 and the substrate temperature adjustment portion 8 in contact with the substrate holding portion 3. The substrate holding surface moves parallel to the X-axis direction and the Y-axis direction.

另外，在由未圖示的搬送裝置將基板1搬送向本實施方式涉及的位置對準裝置60的情況下，在搬送裝置保持基板1的上表面的情況下，上述結構是充分的。 然而，在搬送裝置保持基板1的下表面的情況下，為了支撐搬送，需要對基板調溫部8另外設置銷等。In addition, when the substrate 1 is transferred to the positioning device 60 according to the present embodiment by a transfer device not shown, the above-mentioned structure is sufficient when the transfer device holds the upper surface of the substrate 1. However, when the conveying device holds the lower surface of the substrate 1, in order to support the conveyance, it is necessary to separately provide a pin or the like to the substrate temperature control unit 8.

此外，由在本實施方式涉及的位置對準裝置60設置的未圖示的控制部進行的位置對準動作中對基板1在X軸、Y軸及θ軸上的當前位置的計測以及用於向既定位置的移動的各驅動部的驅動時序、順序不限於上述結構。In addition, the current position of the substrate 1 on the X-axis, Y-axis, and θ-axis is measured and used in the positioning operation performed by the control unit (not shown) provided in the positioning device 60 according to the present embodiment. The drive timing and order of each drive unit for movement to a predetermined position are not limited to the above-mentioned configuration.

如以上那樣，在本實施方式涉及的位置對準裝置60中，基板1與基板調溫部8相互不直接接觸，基板調溫部8同基板保持部3的與基板保持面不同的面接觸，經由基板保持部3來進行基板調溫部8對基板1的調溫。 並且，在由θ軸驅動部6對基板1進行θ軸上的位置對準時，基板保持部3與基板調溫部8相互分離，基板調溫部8不旋轉，基板保持部3及其載置的基板1旋轉。As described above, in the positioning device 60 according to the present embodiment, the substrate 1 and the substrate temperature adjustment portion 8 are not in direct contact with each other, and the substrate temperature adjustment portion 8 is in contact with a surface of the substrate holding portion 3 that is different from the substrate holding surface. The temperature adjustment of the substrate 1 by the substrate temperature adjustment section 8 is performed via the substrate holding section 3. In addition, when the substrate 1 is aligned on the θ axis by the θ-axis drive unit 6, the substrate holding portion 3 and the substrate temperature adjustment portion 8 are separated from each other, the substrate temperature adjustment portion 8 does not rotate, and the substrate holding portion 3 and its placement The substrate 1 rotates.

由此，能夠減少θ軸驅動部6上的旋轉體(即基板保持部3及其載置的基板1)的重量，增加旋轉體的旋轉速度，由此能夠提高處理量。 此外，通過減少θ軸驅動部6上的旋轉體的重量，能夠減少對各驅動部的負載。As a result, the weight of the rotating body on the θ-axis driving unit 6 (that is, the substrate holding portion 3 and the substrate 1 on which it is placed) can be reduced, and the rotation speed of the rotating body can be increased, thereby increasing the throughput. In addition, by reducing the weight of the rotating body on the θ-axis drive unit 6, the load on each drive unit can be reduced.

此外，在對基板1進行θ軸上的位置對準時使基板調溫部8不旋轉，由此能夠以簡單的結構來設置連接於基板調溫部8的調溫用管、控制電纜等配線8a。In addition, when the substrate 1 is aligned on the θ-axis, the substrate temperature control section 8 is not rotated, thereby enabling the installation of wiring 8a such as temperature control pipes and control cables connected to the substrate temperature control section 8 with a simple structure. .

[第二實施方式] 圖2示出了第二實施方式涉及的位置對準裝置70的示意性剖視圖。 另外，除基板保持部3的結構不同之外，本實施方式涉及的位置對準裝置70與第一實施方式涉及的位置對準裝置60結構相同，因此對相同的構件賦予相同的圖式標記，並省略說明。[Second Embodiment] FIG. 2 shows a schematic cross-sectional view of the position alignment device 70 according to the second embodiment. In addition, the positioning device 70 according to the present embodiment has the same structure as the positioning device 60 according to the first embodiment except for the difference in the structure of the substrate holding portion 3, and therefore the same drawing symbols are assigned to the same members. And the description is omitted.

如圖2所示，在本實施方式涉及的位置對準裝置70設置的基板保持部3由第一基板保持部3a以及第二基板保持部3b構成。 並且，以使軸部6a的頂端部與第一基板保持部3a的底面抵接的方式，θ軸驅動部6的軸部6a穿通基板調溫部8的貫通孔並延伸。As shown in FIG. 2, the board|substrate holding part 3 provided in the positioning apparatus 70 concerning this embodiment is comprised by the 1st board|substrate holding part 3a and the 2nd board|substrate holding part 3b. In addition, the shaft portion 6a of the θ-axis driving portion 6 penetrates the through hole of the substrate temperature control portion 8 and extends so that the tip portion of the shaft portion 6a abuts the bottom surface of the first substrate holding portion 3a.

即，在本實施方式涉及的位置對準裝置70中，位於基板保持部3的中心部位置的第一基板保持部3a被分割成能夠在Z軸方向移動。 並且，通過使Z軸驅動部7驅動來使θ軸驅動部6上升，如圖2所示，第一基板保持部3a以及所載置的基板1上升，第一基板保持部3a從基板調溫部8離開。That is, in the positioning device 70 according to the present embodiment, the first substrate holding portion 3a positioned at the center portion of the substrate holding portion 3 is divided so as to be movable in the Z-axis direction. Furthermore, by driving the Z-axis driving section 7 to raise the θ-axis driving section 6, as shown in FIG. Section 8 leaves.

這樣，在本實施方式涉及的位置對準裝置70中，在對基板1進行θ軸上的位置對準時，伴著θ軸驅動部6的上升，第一基板保持部3a以及所載置的基板1也上升。 由此，與第一實施方式涉及的位置對準裝置60相比，進一步減少θ軸驅動部6上的旋轉體(第一基板保持部3a及被載置的基板1)的重量，由此能夠增加旋轉體的旋轉速度，進一步提高處理量。 此外，通過進一步減少θ軸驅動部6上的旋轉體的重量，能夠進一步減少對各驅動部的負載。In this way, in the positioning device 70 according to the present embodiment, when the substrate 1 is aligned on the θ-axis, the first substrate holding portion 3a and the placed substrate will be lifted by the θ-axis drive unit 6 1 also rises. As a result, the weight of the rotating body (the first substrate holding portion 3a and the mounted substrate 1) on the θ-axis driving portion 6 can be further reduced compared with the positional alignment device 60 according to the first embodiment. Increase the rotation speed of the rotating body to further increase the processing capacity. In addition, by further reducing the weight of the rotating body on the θ-axis drive unit 6, the load on each drive unit can be further reduced.

此外，在本實施方式涉及的位置對準裝置70中，通過使Z軸驅動部7驅動，能夠經由θ軸驅動部6使第一基板保持部3a在Z軸方向移動。 由此，在將搬送到位置對準裝置70的基板1載置於基板保持部3上時，能夠由第一基板保持部3a承接基板1，不另外設置用於承接基板1的銷等，能夠削減成本。In addition, in the positioning device 70 according to the present embodiment, by driving the Z-axis drive unit 7, the first substrate holding portion 3 a can be moved in the Z-axis direction via the θ-axis drive unit 6. Thus, when the substrate 1 conveyed to the positioning device 70 is placed on the substrate holding portion 3, the substrate 1 can be received by the first substrate holding portion 3a, and no pins or the like for receiving the substrate 1 can be separately provided. Cut costs.

此外，在本實施方式涉及的位置對準裝置70中，在對基板1進行X軸、Y軸及θ軸的位置對準中，第二基板保持部3b繼續保持與基板調溫部8接觸。 因此，與第一實施方式涉及的位置對準裝置60相比，能夠使基板1的調溫性能更加良好。In addition, in the positioning device 70 according to the present embodiment, the second substrate holding portion 3 b continues to maintain contact with the substrate temperature adjustment portion 8 during the alignment of the X axis, Y axis, and θ axis of the substrate 1. Therefore, compared with the position alignment device 60 according to the first embodiment, the temperature adjustment performance of the substrate 1 can be made better.

如以上那樣，在本實施方式涉及的位置對準裝置70中，基板保持部3被分割為多個基板保持部、即第一基板保持部3a以及第二基板保持部3b。 並且，Z軸驅動部7使第一基板保持部3a在Z軸方向移動，使得成為如下狀態(第二狀態)：基板1載置於多個基板保持部中的部分基板保持部、即第一基板保持部3a上，並且第一基板保持部3a不載置於基板調溫部8上。 然後，在基板1載置於第一基板保持部3a上並且第一基板保持部3a不載置於基板調溫部8上的狀態下，θ軸驅動部6使第一基板保持部3a繞Z軸方向旋轉。 之後，Z軸驅動部7使第一基板保持部3a在Z軸方向移動，使得成為如下狀態(第一狀態)：該狀態為基板1載置於第一基板保持部3a以及第二基板保持部3b上，並且第一基板保持部3a以及第二基板保持部3b載置於基板調溫部8上。 並且，在那樣的第一狀態下，X軸驅動部4以及Y軸驅動部5分別使基板保持部3以及基板調溫部8在X軸方向以及Y軸方向移動。As described above, in the positioning device 70 according to this embodiment, the substrate holding portion 3 is divided into a plurality of substrate holding portions, that is, the first substrate holding portion 3a and the second substrate holding portion 3b. In addition, the Z-axis drive unit 7 moves the first substrate holding portion 3a in the Z-axis direction so as to be in a state (second state) in which the substrate 1 is placed on a portion of the substrate holding portion among the plurality of substrate holding portions, that is, the first On the substrate holding portion 3a, and the first substrate holding portion 3a is not placed on the substrate temperature regulating portion 8. Then, in a state where the substrate 1 is placed on the first substrate holding portion 3a and the first substrate holding portion 3a is not placed on the substrate temperature adjustment portion 8, the θ-axis driving portion 6 makes the first substrate holding portion 3a go around Z Axis direction rotation. After that, the Z-axis drive unit 7 moves the first substrate holding portion 3a in the Z-axis direction to a state (first state) in which the substrate 1 is placed on the first substrate holding portion 3a and the second substrate holding portion 3b, and the first substrate holding portion 3a and the second substrate holding portion 3b are placed on the substrate temperature control portion 8. In such a first state, the X-axis drive unit 4 and the Y-axis drive unit 5 move the substrate holding unit 3 and the substrate temperature control unit 8 in the X-axis direction and the Y-axis direction, respectively.

另外，在本實施方式涉及的位置對準裝置70中，基板保持部3被分割成的數量、分割後的部分的形狀不限於上述情況。 此外，第一基板保持部3a以及第二基板保持部3b不需要為相互相同的材質，也可以由相互不同的材質形成。 例如，旋轉的第一基板保持部3a能夠由輕量的陶瓷形成，另一方面不旋轉的第二基板保持部3b能夠由熱導性高的銅形成。In addition, in the positioning device 70 according to the present embodiment, the number of divided substrate holding portions 3 and the shape of the divided portions are not limited to those described above. In addition, the first substrate holding portion 3a and the second substrate holding portion 3b do not need to be made of the same material, and may be formed of different materials. For example, the rotating first substrate holding portion 3a can be formed of lightweight ceramics, and on the other hand, the non-rotating second substrate holding portion 3b can be formed of copper with high thermal conductivity.

此外，在本實施方式涉及的位置對準裝置70中，在對基板1進行X軸、Y軸及θ軸的位置對準中，可以是在Z軸方向不移動的第二基板保持部3b與基板調溫部8為彼此一體的構造。 此外，在基板保持部3中使用真空吸附方式來保持基板1時，第一基板保持部3a以及第二基板保持部3b的真空源不需要相互相同。 即，可以通過設置相互不同的真空源來分別獨立地控制第一基板保持部3a以及第二基板保持部3b對基板1的保持。In addition, in the positioning device 70 according to the present embodiment, in the positioning of the substrate 1 on the X-axis, Y-axis, and θ-axis, the second substrate holding portion 3b that does not move in the Z-axis direction may be combined with The substrate temperature control unit 8 has a structure that is integrated with each other. In addition, when the substrate 1 is held by the vacuum suction method in the substrate holding portion 3, the vacuum sources of the first substrate holding portion 3a and the second substrate holding portion 3b do not need to be the same. That is, the holding of the substrate 1 by the first substrate holding portion 3a and the second substrate holding portion 3b can be independently controlled by providing mutually different vacuum sources.

如以上那樣，在本實施方式涉及的位置對準裝置70中，基板1與基板調溫部8相互不直接接觸，基板調溫部8同基板保持部3的與基板保持面不同的面接觸，由此經由基板保持部3進行基板調溫部8對基板1的調溫。 並且，在由θ軸驅動部6對基板1進行θ軸上的位置對準時，基板調溫部8及第二基板保持部3b不旋轉，第一基板保持部3a及其載置的基板1旋轉。As described above, in the positioning device 70 according to the present embodiment, the substrate 1 and the substrate temperature adjustment portion 8 are not in direct contact with each other, and the substrate temperature adjustment portion 8 is in contact with a surface of the substrate holding portion 3 that is different from the substrate holding surface. As a result, the temperature adjustment of the substrate 1 by the substrate temperature adjustment unit 8 is performed via the substrate holding portion 3. In addition, when the substrate 1 is aligned on the θ-axis by the θ-axis drive unit 6, the substrate temperature adjustment unit 8 and the second substrate holding portion 3b do not rotate, and the first substrate holding portion 3a and the substrate 1 on which it is placed rotate .

由此，能夠進一步減少θ軸驅動部6上的旋轉體(即，第一基板保持部3a及其載置的基板1)的重量，增加旋轉體的旋轉速度，由此能夠進一步提高處理量。 此外，進一步減少θ軸驅動部6上的旋轉體的重量，由此能夠進一步減少對各驅動部的負載。As a result, the weight of the rotating body on the θ-axis driving portion 6 (that is, the first substrate holding portion 3a and the substrate 1 on which it is placed) can be further reduced, the rotation speed of the rotating body can be increased, and the throughput can be further improved. In addition, the weight of the rotating body on the θ-axis drive unit 6 can be further reduced, so that the load on each drive unit can be further reduced.

此外，在對基板1進行θ軸上的位置對準時，使基板調溫部8不旋轉，由此能夠以簡單的構造來設置連接於基板調溫部8的調溫用管、控制電纜等配線8a。In addition, when the substrate 1 is aligned on the θ-axis, the substrate temperature adjustment section 8 is not rotated, so that wirings such as temperature adjustment tubes and control cables connected to the substrate temperature adjustment section 8 can be installed with a simple structure. 8a.

此外，在將搬送到位置對準裝置70的基板1載置於基板保持部3上時，能夠由第一基板保持部3a來承接基板1，不需要另外設置用於承接基板1的銷等，能夠削減成本。 此外，在對基板1進行X軸、Y軸及θ軸上的位置對準中，第二基板保持部3b繼續保持與基板調溫部8接觸，因此能夠使基板1的調溫性能更加良好。In addition, when the substrate 1 conveyed to the positioning device 70 is placed on the substrate holding portion 3, the substrate 1 can be received by the first substrate holding portion 3a, and there is no need to separately provide pins or the like for receiving the substrate 1. Can cut costs. In addition, when the substrate 1 is aligned on the X-axis, Y-axis, and θ-axis, the second substrate holding portion 3b continues to be in contact with the substrate temperature adjustment portion 8, so that the temperature adjustment performance of the substrate 1 can be improved.

[第三實施方式] 圖3A示出了第三實施方式涉及的位置對準裝置80的示意性剖視圖。此外，圖3B示出了第三實施方式的變形例涉及的位置對準裝置80的示意性剖視圖。 另外，除基板保持部3的結構不同之外，本實施方式涉及的位置對準裝置80與第一實施方式涉及的位置對準裝置60結構相同，因此對相同構件賦予相同的圖式標記，並省略說明。[Third Embodiment] FIG. 3A shows a schematic cross-sectional view of the position alignment device 80 according to the third embodiment. In addition, FIG. 3B shows a schematic cross-sectional view of a position alignment device 80 according to a modification of the third embodiment. In addition, except for the difference in the structure of the substrate holding portion 3, the positioning device 80 according to this embodiment has the same structure as the positioning device 60 according to the first embodiment, and therefore the same drawing symbols are assigned to the same components, and The description is omitted.

如圖3A所示，設置在本實施方式涉及的位置對準裝置80的基板保持部3由第一基板保持部3a和第二基板保持部3b構成。 並且，以使軸部6a的頂端部與第一基板保持部3a的底面抵接的方式，θ軸驅動部6的軸部6a穿通基板調溫部8的貫通孔並延伸。As shown in FIG. 3A, the board|substrate holding part 3 provided in the positioning apparatus 80 concerning this embodiment is comprised by the 1st board|substrate holding part 3a and the 2nd board|substrate holding part 3b. In addition, the shaft portion 6a of the θ-axis driving portion 6 penetrates the through hole of the substrate temperature control portion 8 and extends so that the tip portion of the shaft portion 6a abuts the bottom surface of the first substrate holding portion 3a.

即，在本實施方式涉及的位置對準裝置80中，定位於基板保持部3的中心部的第一基板保持部3a被分割成能夠在Z軸方向移動。 並且，當使Z軸驅動部7驅動由此來使θ軸驅動部6上升時，第一基板保持部3a及所載置的基板1上升，第一基板保持部3a從基板調溫部8離開。That is, in the positioning device 80 according to the present embodiment, the first substrate holding portion 3a positioned at the center of the substrate holding portion 3 is divided so as to be movable in the Z-axis direction. When the Z-axis drive unit 7 is driven to thereby raise the θ-axis drive unit 6, the first substrate holding portion 3a and the placed substrate 1 rise, and the first substrate holding portion 3a is separated from the substrate temperature control portion 8. .

此外，在本實施方式涉及的位置對準裝置80中，如圖3A所示，第一基板保持部3a的厚度(Z軸方向的大小)大於第二基板保持部3b的厚度。 換言之，在本實施方式涉及的位置對準裝置80中，多個基板保持部中的部分基板保持部即第一基板保持部3a的厚度與其餘的基板保持部即第二基板保持部3b的厚度不同。In addition, in the positioning device 80 according to the present embodiment, as shown in FIG. 3A, the thickness (size in the Z-axis direction) of the first substrate holding portion 3a is larger than the thickness of the second substrate holding portion 3b. In other words, in the positioning device 80 according to the present embodiment, the thickness of the first substrate holding portion 3a, which is part of the substrate holding portion, and the thickness of the second substrate holding portion 3b, which is the remaining substrate holding portion different.

由此，在基板1為圖3A所示的凸形、即越向外側則越向下方偏位的情況下，第一基板保持部3a及第二基板保持部3b能夠分別良好地保持基板1。 因此，在本實施方式涉及的位置對準裝置80中，能夠對凸形的基板1進行良好的調溫。As a result, when the substrate 1 has a convex shape as shown in FIG. 3A, that is, the position is shifted downward as it goes outward, the first substrate holding portion 3a and the second substrate holding portion 3b can each hold the substrate 1 well. Therefore, in the positioning device 80 according to the present embodiment, the convex substrate 1 can be well adjusted in temperature.

另外，使第一基板保持部3a與第二基板保持部3b的厚度相互相同，採用在對凸形的基板1進行位置對準時使第一基板保持部3a上升的結構，由此能夠對凸形及平坦形的各種基板1進行位置對準。 此時，考慮到基板1的保持、調溫的程度來確定在對凸形的基板1進行位置對準時的第一基板保持部3a的上升位置即可。In addition, the thickness of the first substrate holding portion 3a and the second substrate holding portion 3b are the same, and the first substrate holding portion 3a is raised when the convex substrate 1 is aligned. And various flat substrates 1 are aligned. At this time, it is sufficient to determine the rising position of the first substrate holding portion 3a when the convex substrate 1 is aligned in consideration of the degree of holding and temperature adjustment of the substrate 1.

此外，在這樣的結構中，在為了對凸形的基板1進行位置對準而使第一基板保持部3a上升時，第一基板保持部3a從基板調溫部8離開，因此減少了第一基板保持部3a與基板調溫部8之間的熱接觸。 然而，第一基板保持部3a與第二基板保持部3b依然相互熱接觸。因此，第一基板保持部3a與第二基板保持部3b在徑向上的鄰近由此能夠維持第一基板保持部3a的調溫性能。In addition, in such a structure, when the first substrate holding portion 3a is raised in order to align the convex substrate 1, the first substrate holding portion 3a is separated from the substrate temperature adjustment portion 8, thereby reducing the number of first substrate holding portions 3a. Thermal contact between the substrate holding portion 3a and the substrate temperature regulating portion 8. However, the first substrate holding portion 3a and the second substrate holding portion 3b are still in thermal contact with each other. Therefore, the proximity of the first substrate holding portion 3a and the second substrate holding portion 3b in the radial direction can thereby maintain the temperature adjustment performance of the first substrate holding portion 3a.

另一方面，在基板1為凹形、即越向外側則越向上方偏位的情況下，如圖3B所示，將第一基板保持部3a的厚度設計為小於第二基板保持部3b即可。 此外，在圖3B所示的本實施方式的變形例涉及的位置對準裝置80中，根據期望來使第一基板保持部3a上下移動，由此能夠將平坦形、凸形及凹形中的任意的基板1良好地保持。On the other hand, in the case where the substrate 1 is concave, that is, the more it goes outward, the more it shifts upward, as shown in FIG. 3B, the thickness of the first substrate holding portion 3a is designed to be smaller than that of the second substrate holding portion 3b. Can. In addition, in the positioning device 80 according to the modification of the present embodiment shown in FIG. 3B, the first substrate holding portion 3a is moved up and down as desired, so that the flat, convex, and concave shapes can be Any substrate 1 is held well.

另外，在本實施方式涉及的位置對準裝置80中，基板保持部3被分割成的數量、分割後的部分的形狀不限於上述情況。 此外，第一基板保持部3a及第二基板保持部3b相對於基板1的接觸面、即上表面不需要分別為平面形狀，可以根據期望分別設計為曲面形狀。In addition, in the positioning device 80 according to the present embodiment, the number of divided substrate holding portions 3 and the shape of the divided portions are not limited to the above-mentioned ones. In addition, the contact surface of the first substrate holding portion 3a and the second substrate holding portion 3b with respect to the substrate 1, that is, the upper surface does not need to be in a flat shape, and may be designed in a curved shape as desired.

如以上那樣，在本實施方式涉及的位置對準裝置80中，基板1與基板調溫部8相互不直接接觸，基板調溫部8同基板保持部3的與基板保持面不同的面接觸，由此經由基板保持部3進行基板調溫部8對基板1的調溫。 並且，在由θ軸驅動部6對基板1進行θ軸上的位置對準時，基板調溫部8以及第二基板保持部3b不旋轉，第一基板保持部3a及其載置的基板1旋轉。As described above, in the positioning device 80 according to the present embodiment, the substrate 1 and the substrate temperature adjustment portion 8 are not in direct contact with each other, and the substrate temperature adjustment portion 8 is in contact with a surface of the substrate holding portion 3 that is different from the substrate holding surface. As a result, the temperature adjustment of the substrate 1 by the substrate temperature adjustment unit 8 is performed via the substrate holding portion 3. In addition, when the substrate 1 is aligned on the θ-axis by the θ-axis drive unit 6, the substrate temperature adjustment unit 8 and the second substrate holding portion 3b do not rotate, and the first substrate holding portion 3a and the substrate 1 on which it is placed rotate .

由此，能夠進一步減少θ軸驅動部6上的旋轉體的重量，增加旋轉體的旋轉速度，由此能夠進一步提高處理量。 此外，通過進一步減少θ軸驅動部6上的旋轉體的重量，還能夠進一步減少對各驅動部的負載。As a result, the weight of the rotating body on the θ-axis drive unit 6 can be further reduced, and the rotation speed of the rotating body can be increased, thereby further increasing the processing throughput. In addition, by further reducing the weight of the rotating body on the θ-axis drive unit 6, the load on each drive unit can be further reduced.

此外，在對基板1進行θ軸上的位置對準時，使基板調溫部8不旋轉，由此能夠以簡單的結構設置連接於基板調溫部8的調溫用管、控制電纜等配線8a。In addition, when the substrate 1 is aligned on the θ-axis, the substrate temperature adjustment section 8 is not rotated, and thus wiring 8a such as a temperature adjustment tube and a control cable connected to the substrate temperature adjustment section 8 can be installed with a simple structure. .

此外，調整第一基板保持部3a相對於第二基板保持部3b的厚度，由此能夠不限於平坦形，還能夠對凸形、凹形的基板1良好地進行保持和調溫。In addition, by adjusting the thickness of the first substrate holding portion 3a relative to the second substrate holding portion 3b, it is possible not to be limited to a flat shape, and it is possible to hold and adjust the temperature of the convex and concave substrate 1 well.

[第四實施方式] 圖4示出了第四實施方式涉及的位置對準裝置90的示意性剖視圖。 另外，除基板保持部3的結構不同之外，本實施方式涉及的位置對準裝置90與第一實施方式涉及的位置對準裝置60結構相同，因此對相同的構件賦予相同的圖式標記，並省略說明。[Fourth Embodiment] FIG. 4 shows a schematic cross-sectional view of the position alignment device 90 according to the fourth embodiment. In addition, the positioning device 90 according to this embodiment has the same structure as the positioning device 60 according to the first embodiment except for the difference in the structure of the substrate holding portion 3, so the same components are given the same drawing symbols. And the description is omitted.

如圖4所示，在本實施方式涉及的位置對準裝置90中，在基板保持部3內設置有溫度計測部10。 由此，通過溫度計測部10進行的溫度計測來使基板1的調溫控制最優化，由此能夠提高基板1的調溫中的處理量。As shown in FIG. 4, in the positioning device 90 according to the present embodiment, a temperature measuring unit 10 is provided in the substrate holding unit 3. Thereby, by optimizing the temperature adjustment control of the substrate 1 by the temperature measurement performed by the temperature measurement unit 10, the throughput in the temperature adjustment of the substrate 1 can be improved.

在本實施方式這樣的位置對準裝置中，一般而言對基板1進行位置對準的時間比對基板1進行調溫的時間長。 然而，當通過對位置對準構造的構成進行改良來使位置對準時間縮短得比調溫時間短時，如果不縮短調溫時間則無法提高處理量。 在這樣的情況下，使用本實施方式涉及的位置對準裝置90那樣的結構能夠使基板1的調溫最優化，因此能夠提高處理量。In the positioning device like this embodiment, generally, the time for positioning the substrate 1 is longer than the time for adjusting the temperature of the substrate 1. However, when the positioning time is shortened shorter than the temperature adjustment time by improving the configuration of the positioning structure, the throughput cannot be increased unless the temperature adjustment time is shortened. In such a case, it is possible to optimize the temperature adjustment of the substrate 1 by using a structure like the positioning device 90 according to the present embodiment, and therefore it is possible to increase the throughput.

此外，在市場等的期望中，在要求更高精度的調溫性能的情況下，也可以基於溫度計測部10的計測結果來調整位置對準時間。 另外，作為溫度計測部10，例如能夠使用電阻溫度檢測器、熱敏電阻等溫度計，優選設置在基板1的附近等能夠計測代表性的溫度的部位。In addition, in the expectation of the market or the like, when a higher precision temperature adjustment performance is required, the positioning time may be adjusted based on the measurement result of the temperature measurement unit 10. In addition, as the temperature measurement unit 10, for example, a thermometer such as a resistance temperature detector or a thermistor can be used, and it is preferably installed in a location where a representative temperature can be measured, such as the vicinity of the substrate 1.

如以上那樣，在本實施方式涉及的位置對準裝置90中，基板1與基板調溫部8相互不直接接觸，基板調溫部8同基板保持部3的與基板保持面不同的面接觸，由此經由基板保持部3進行基板調溫部8對基板1的調溫。 並且，在由θ軸驅動部6對基板1進行θ軸上的位置對準時，基板調溫部8不旋轉，基板保持部3及其載置的基板1旋轉。As described above, in the positioning device 90 according to the present embodiment, the substrate 1 and the substrate temperature adjustment portion 8 are not in direct contact with each other, and the substrate temperature adjustment portion 8 is in contact with a surface of the substrate holding portion 3 that is different from the substrate holding surface. As a result, the temperature adjustment of the substrate 1 by the substrate temperature adjustment unit 8 is performed via the substrate holding portion 3. In addition, when the substrate 1 is aligned on the θ-axis by the θ-axis drive unit 6, the substrate temperature adjustment unit 8 does not rotate, and the substrate holding unit 3 and the substrate 1 on which it is placed rotate.

由此，能夠減少θ軸驅動部6上的旋轉體(即基板保持部3及其載置的基板1)的重量，增加旋轉體的旋轉速度，由此能夠提高處理量。 此外，通過減少θ軸驅動部6上的旋轉體的重量，還能夠減少對各驅動部的負載。As a result, the weight of the rotating body on the θ-axis driving unit 6 (that is, the substrate holding portion 3 and the substrate 1 on which it is placed) can be reduced, and the rotation speed of the rotating body can be increased, thereby increasing the throughput. In addition, by reducing the weight of the rotating body on the θ-axis drive unit 6, the load on each drive unit can also be reduced.

此外，在對基板1進行θ軸上的位置對準時使基板調溫部8不旋轉，由此能夠以簡單的構造來設置連接於基板調溫部8的調溫用管、控制電纜等配線8a。 此外，基板1的底面整體與基板保持部3接觸，因而能夠由基板調溫部8對基板1進行均勻地調溫。 此外，通過在基板保持部3內設置溫度計測部10，能夠提高基板1的調溫中的處理量。In addition, when the substrate 1 is aligned on the θ-axis, the substrate temperature adjustment section 8 is not rotated, so that wiring 8a such as a temperature adjustment tube and a control cable connected to the substrate temperature adjustment section 8 can be installed with a simple structure. . In addition, the entire bottom surface of the substrate 1 is in contact with the substrate holding portion 3, so that the substrate 1 can be uniformly adjusted in temperature by the substrate temperature adjustment portion 8. In addition, by providing the temperature measurement unit 10 in the substrate holding portion 3, the throughput in temperature adjustment of the substrate 1 can be improved.

以上，對優選實施方式進行了說明，但不限於這些實施方式，可以在其主旨的範圍內進行各種變形及變更。The preferred embodiments have been described above, but they are not limited to these embodiments, and various modifications and changes can be made within the scope of the gist.

根據本發明，能夠提供如下的位置對準裝置，其能夠減少驅動中的負載，並且能夠以簡單的構造對基板進行調溫。According to the present invention, it is possible to provide a position alignment device that can reduce the load during driving and can adjust the temperature of the substrate with a simple structure.

[曝光裝置] 圖5示出了具備第一至第四實施方式中的任意實施方式涉及的位置對準裝置95的曝光裝置50的示意圖。[Exposure Device] FIG. 5 shows a schematic diagram of an exposure apparatus 50 provided with a positioning apparatus 95 according to any of the first to fourth embodiments.

如圖5所示，曝光裝置50具備：光源51；以及照明光學系統52，其將從光源51射出的曝光光引導至載置在未圖示的原版台上的原版53。 此外，曝光裝置50具備投影光學系統54，該投影光學系統54將通過了原版53的曝光光引導至載置在晶圓台20上的基板1。As shown in FIG. 5, the exposure device 50 includes a light source 51 and an illumination optical system 52 that guides the exposure light emitted from the light source 51 to the original plate 53 placed on an original plate table not shown. In addition, the exposure device 50 includes a projection optical system 54 that guides the exposure light that has passed through the original plate 53 to the substrate 1 placed on the wafer table 20.

此外，曝光裝置50具備位置對準裝置95，該位置對準裝置95對基板1進行位置對準，將位置對準了的基板1交接至晶圓台20。 另外，位置對準裝置95例如配置在用於承接搬入到曝光裝置50內的基板1的未圖示的交接站。In addition, the exposure apparatus 50 includes a positioning device 95 that aligns the substrate 1 and transfers the aligned substrate 1 to the wafer stage 20. In addition, the positioning device 95 is arranged, for example, in a delivery station (not shown) for receiving the substrate 1 carried in the exposure device 50.

根據上述結構，曝光裝置50中，由位置對準裝置95對基板1進行位置對準(預對準)，之後，由晶圓台20對曝光時的基板1進行定位。並且，對基板1進行曝光，將形成(繪製)於原版53的圖案轉印到基板1上。According to the above configuration, in the exposure apparatus 50, the position alignment device 95 aligns the substrate 1 (pre-alignment), and then the wafer stage 20 positions the substrate 1 during exposure. Then, the substrate 1 is exposed to light, and the pattern formed (drawn) on the original plate 53 is transferred to the substrate 1.

另外，本實施方式涉及的位置對準裝置95不限於用於包括曝光裝置50的光刻裝置，也能夠用於光學壓印裝置、電子束描繪裝置等在基板上形成圖案的圖案形成裝置中的基板的位置對準。 此外，也能夠將位置對準裝置95的結構設置於晶圓台20，來進行本實施方式涉及的基板1的位置對準。In addition, the position alignment device 95 according to this embodiment is not limited to being used in a photolithography device including the exposure device 50, and can also be used in a pattern forming device that forms a pattern on a substrate, such as an optical imprint device and an electron beam drawing device. The position of the substrate is aligned. In addition, it is also possible to install the configuration of the positioning device 95 on the wafer stage 20 to perform the positioning of the substrate 1 according to the present embodiment.

[物品之製造方法] 然後，對使用具備第一至第四實施方式中的任意實施方式涉及的位置對準裝置的曝光裝置的物品之製造方法進行說明。[Method of manufacturing the article] Next, a description will be given of a method of manufacturing an article using the exposure device provided with the positioning device according to any of the first to fourth embodiments.

在此，作為製造出的物品，例如包括半導體IC元件、液晶顯示元件、MEMS等。 本實施方式涉及的物品之製造方法包括使用具備第一至第四實施方式中的任意實施方式涉及的位置對準裝置的曝光裝置，對塗佈有感光劑的晶圓、玻璃基板等基板進行曝光的程序。Here, as manufactured articles, for example, semiconductor IC elements, liquid crystal display elements, MEMS, etc. are included. The manufacturing method of the article according to this embodiment includes using an exposure device equipped with the positioning device according to any of the first to fourth embodiments to expose substrates such as wafers and glass substrates coated with a photosensitive agent program of.

此外，本實施方式涉及的物品之製造方法包括對曝光後的基板(光敏劑)進行顯影的程序、通過其它公知的程序對顯影了的基板進行加工和處理的程序。 另外，作為其它公知的程序，可以列舉出蝕刻、抗蝕劑剝離、切割、接合、封裝等。In addition, the method of manufacturing an article according to the present embodiment includes a procedure of developing the exposed substrate (photosensitizer) and a procedure of processing and processing the developed substrate by other well-known procedures. In addition, as other well-known procedures, etching, resist peeling, dicing, bonding, packaging, etc. can be cited.

根據本實施方式涉及的物品之製造方法，能夠製造與以往相比高品質的物品。According to the method of manufacturing an article according to the present embodiment, it is possible to manufacture a higher-quality article than in the past.

1:基板 1a:槽口 2:檢測部 3:基板保持部 3a:第一基板保持部 3b:第二基板保持部 4:X軸驅動部 5:Y軸驅動部 6:θ軸驅動部 6a:軸部 7:Z軸驅動部 8:基板調溫部 8a:配線 9:殼體 10:溫度測量部 20:晶圓臺 50:曝光裝置 51:光源 52:照明光學系統 53:原版 54:投影光學系統 60:位置對準裝置 70:位置對準裝置 80:位置對準裝置 90:位置對準裝置 95:位置對準裝置1: substrate 1a: Notch 2: Detection Department 3: Board holding part 3a: First substrate holding part 3b: Second substrate holding part 4: X-axis drive unit 5: Y-axis drive unit 6: Theta axis drive unit 6a: Shaft 7: Z-axis drive unit 8: Substrate temperature control department 8a: Wiring 9: Shell 10: Temperature measurement department 20: Wafer table 50: Exposure device 51: light source 52: Illumination optical system 53: Original 54: Projection optical system 60: Position alignment device 70: Position alignment device 80: Position alignment device 90: Position alignment device 95: Position alignment device

[圖1A]是第一實施方式涉及的位置對準裝置的示意性剖視圖。 [圖1B]是第一實施方式涉及的位置對準裝置的示意性剖視圖。 [圖1C]是第一實施方式涉及的位置對準裝置的局部示意立體圖。 [圖2]是第二實施方式涉及的位置對準裝置的示意性剖視圖。 [圖3A]是第三實施方式涉及的位置對準裝置的示意性剖視圖。 [圖3B]是第三實施方式涉及的位置對準裝置的示意性剖視圖。 [圖4]是第四實施方式涉及的位置對準裝置的示意性剖視圖。 [圖5]是具備第一至第四實施方式中的任一實施方式涉及的位置對準裝置的曝光裝置的示意圖。[Fig. 1A] is a schematic cross-sectional view of the position alignment device according to the first embodiment. [Fig. 1B] is a schematic cross-sectional view of the position alignment device according to the first embodiment. [Fig. 1C] is a partial schematic perspective view of the position alignment device according to the first embodiment. [Fig. 2] is a schematic cross-sectional view of the positioning device according to the second embodiment. [Fig. 3A] is a schematic cross-sectional view of the position alignment device according to the third embodiment. [Fig. 3B] is a schematic cross-sectional view of the positioning device according to the third embodiment. [Fig. 4] is a schematic cross-sectional view of the positioning device according to the fourth embodiment. [Fig. 5] is a schematic diagram of an exposure apparatus provided with the positioning apparatus according to any one of the first to fourth embodiments.

1:基板 1: substrate

3:基板保持部 3: Board holding part

4:X軸驅動部 4: X-axis drive unit

5:Y軸驅動部 5: Y-axis drive unit

6:θ軸驅動部 6: Theta axis drive unit

6a:軸部 6a: Shaft

7:Z軸驅動部 7: Z-axis drive unit

8:基板調溫部 8: Substrate temperature control department

8a:配線 8a: Wiring

9:殼體 9: Shell

60:位置對準裝置 60: Position alignment device

Claims (11)

一種位置對準裝置，其具備： 基板保持部，其將基板保持於第一面； 基板調溫部，其經由前述基板保持部來對前述基板進行調溫； 驅動部，其使前述基板保持部移動；以及 控制部，其控制前述驅動部， 前述基板調溫部在與前述第一面不同的前述基板保持部的第二面接觸的狀態下對前述基板進行調溫。A position alignment device, which is provided with: A substrate holding portion, which holds the substrate on the first surface; A substrate temperature regulating part, which regulates the temperature of the aforementioned substrate via the aforementioned substrate holding part; A driving part which moves the aforementioned substrate holding part; and The control unit, which controls the aforementioned drive unit, The substrate temperature adjustment section adjusts the temperature of the substrate in a state in which the substrate holding section is in contact with the second surface of the substrate holding section that is different from the first surface. 如請求項1的位置對準裝置，其中， 前述控制部控制前述驅動部，使得前述基板保持部在與前述第一面垂直的方向，在前述基板保持部載置於前述基板調溫部上的第一狀態與前述基板保持部不載置於前述基板調溫部上的第二狀態之間移動。Such as the position alignment device of claim 1, in which, The control section controls the drive section so that the substrate holding section is in a direction perpendicular to the first surface in the first state where the substrate holding section is placed on the substrate temperature control section and the substrate holding section is not placed The aforementioned substrate temperature adjustment part moves between the second states. 如請求項2的位置對準裝置，其中， 前述控制部控制前述驅動部，使得在前述第二狀態下前述基板保持部繞前述垂直的方向旋轉。Such as the position alignment device of claim 2, in which, The aforementioned control unit controls the aforementioned drive unit so that the aforementioned substrate holding portion rotates around the aforementioned vertical direction in the aforementioned second state. 如請求項1的位置對準裝置，其中， 前述基板保持部被分割為多個基板保持部， 前述控制部控制前述驅動部，使得前述多個基板保持部中的部分基板保持部在與前述第一面垂直的方向上移動於，前述基板載置於前述多個基板保持部上並且前述多個基板保持部載置於前述基板調溫部上的第一狀態與前述基板載置於前述部分基板保持部上並且前述部分基板保持部不載置於前述基板調溫部上的第二狀態之間。Such as the position alignment device of claim 1, in which, The aforementioned substrate holding portion is divided into a plurality of substrate holding portions, The control section controls the drive section so that part of the substrate holding sections of the plurality of substrate holding sections move in a direction perpendicular to the first surface, the substrate is placed on the plurality of substrate holding sections and the plurality of substrate holding sections Between the first state in which the substrate holding portion is placed on the substrate temperature adjustment portion and the second state in which the substrate is placed on the partial substrate holding portion and the partial substrate holding portion is not placed on the substrate temperature adjustment portion . 如請求項4的位置對準裝置，其中， 前述控制部控制前述驅動部，使得在前述第二狀態下前述部分基板保持部繞前述垂直的方向旋轉。Such as the position alignment device of claim 4, in which, The aforementioned control unit controls the aforementioned drive unit so that the aforementioned partial substrate holding portion rotates around the aforementioned vertical direction in the aforementioned second state. 如請求項4的位置對準裝置，其中， 前述部分基板保持部的厚度與其餘的基板保持部的厚度不同。Such as the position alignment device of claim 4, in which, The thickness of the aforementioned partial substrate holding portion is different from the thickness of the remaining substrate holding portions. 如請求項2的位置對準裝置，其中， 前述控制部控制前述驅動部，使得在前述第一狀態下前述基板保持部以及前述基板調溫部在與前述第一面平行的方向移動。Such as the position alignment device of claim 2, in which, The control section controls the drive section so that the substrate holding section and the substrate temperature adjustment section move in a direction parallel to the first surface in the first state. 如請求項1的位置對準裝置，其中， 在前述基板保持部設置有用於計測前述基板的溫度的溫度計測部。Such as the position alignment device of claim 1, in which, The substrate holding part is provided with a temperature measuring part for measuring the temperature of the substrate. 一種圖案形成裝置，其用於在基板上形成圖案， 具備對前述基板進行位置對準的如請求項1至8中任一項的位置對準裝置。A pattern forming device, which is used to form a pattern on a substrate, A position alignment device according to any one of claims 1 to 8 for position alignment of the aforementioned substrate is provided. 一種物品之製造方法，其包括： 使用如請求項9的圖案形成裝置在前述基板上形成圖案的程序；以及 對形成了圖案的前述基板進行加工來獲得物品的程序。A method of manufacturing an article, which includes: A procedure for forming a pattern on the aforementioned substrate using the pattern forming apparatus as in claim 9; and A procedure for processing the patterned substrate to obtain an article. 一種位置對準方法，其包括： 在將基板保持於第一面的基板保持部不載置於對前述基板進行調溫的基板調溫部上的狀態下，使該基板保持部繞與前述第一面垂直的方向旋轉的程序； 使前述基板保持部在前述垂直的方向移動使得前述基板保持部載置於前述基板調溫部上的程序；以及 在前述基板保持部載置於前述基板調溫部上的狀態下使前述基板保持部以及前述基板調溫部在與前述第一面平行的方向移動的程序。A position alignment method, which includes: A procedure of rotating the substrate holding portion in a direction perpendicular to the first surface in a state where the substrate holding portion that holds the substrate on the first surface is not placed on the substrate temperature adjustment portion that adjusts the temperature of the substrate; A procedure of moving the substrate holding portion in the vertical direction so that the substrate holding portion is placed on the substrate temperature regulating portion; and A process of moving the substrate holding part and the substrate temperature adjusting part in a direction parallel to the first surface in a state where the substrate holding part is placed on the substrate temperature adjusting part.
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