TW202128814A - 環氧樹脂組成物及其硬化物 - Google Patents
環氧樹脂組成物及其硬化物 Download PDFInfo
- Publication number
- TW202128814A TW202128814A TW109131256A TW109131256A TW202128814A TW 202128814 A TW202128814 A TW 202128814A TW 109131256 A TW109131256 A TW 109131256A TW 109131256 A TW109131256 A TW 109131256A TW 202128814 A TW202128814 A TW 202128814A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- anion
- group
- salt
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-206979 | 2019-11-15 | ||
JP2019206979 | 2019-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202128814A true TW202128814A (zh) | 2021-08-01 |
Family
ID=75911375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109131256A TW202128814A (zh) | 2019-11-15 | 2020-09-11 | 環氧樹脂組成物及其硬化物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7389815B2 (fr) |
TW (1) | TW202128814A (fr) |
WO (1) | WO2021095328A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115820184A (zh) * | 2022-12-26 | 2023-03-21 | 无锡创达新材料股份有限公司 | 一种高压功率器件封装用热固性树脂组合物 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2690295C (fr) | 2007-06-11 | 2014-12-30 | Georg Degen | Catalyseur pour le durcissement d'epoxydes |
JP5407861B2 (ja) | 2007-07-26 | 2014-02-05 | 味の素株式会社 | 樹脂組成物 |
JP2015209492A (ja) | 2014-04-25 | 2015-11-24 | 旭化成イーマテリアルズ株式会社 | 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物 |
WO2018018458A1 (fr) | 2016-07-27 | 2018-02-01 | Dow Global Technologies Llc | Mélange de catalyseur latent pour compositions époxy/durcisseur anhydride |
JP6985040B2 (ja) | 2017-07-04 | 2021-12-22 | 積水化学工業株式会社 | 熱硬化性樹脂組成物 |
-
2020
- 2020-09-03 WO PCT/JP2020/033408 patent/WO2021095328A1/fr active Application Filing
- 2020-09-03 JP JP2021555911A patent/JP7389815B2/ja active Active
- 2020-09-11 TW TW109131256A patent/TW202128814A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7389815B2 (ja) | 2023-11-30 |
JPWO2021095328A1 (fr) | 2021-05-20 |
WO2021095328A1 (fr) | 2021-05-20 |
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