TW202119886A - 具有加熱功能的轉接板以及電子裝置 - Google Patents

具有加熱功能的轉接板以及電子裝置 Download PDF

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Publication number
TW202119886A
TW202119886A TW108140260A TW108140260A TW202119886A TW 202119886 A TW202119886 A TW 202119886A TW 108140260 A TW108140260 A TW 108140260A TW 108140260 A TW108140260 A TW 108140260A TW 202119886 A TW202119886 A TW 202119886A
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Taiwan
Prior art keywords
conductive
insulating body
electrically connected
conductive contacts
power input
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TW108140260A
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English (en)
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TWI710298B (zh
Inventor
廖建碩
張德富
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台灣愛司帝科技股份有限公司
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Priority to TW108140260A priority Critical patent/TWI710298B/zh
Priority to CN201911379853.XA priority patent/CN112768417A/zh
Priority to US16/891,290 priority patent/US20210136909A1/en
Application granted granted Critical
Publication of TWI710298B publication Critical patent/TWI710298B/zh
Publication of TW202119886A publication Critical patent/TW202119886A/zh

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Abstract

本發明公開一種具有加熱功能的轉接板以及電子裝置。電子裝置包括一電路基板、設置在電路基板上的一轉接板以及被轉接板所承載的至少一電子晶片。轉接板包括一絕緣本體、多個頂端導電接點、多個底端導電接點、多個導電連接結構以及多個微加熱器。絕緣本體設置在電路基板上。多個頂端導電接點與多個底端導電接點設置在絕緣本體上。多個導電連接結構設置在絕緣本體上，且多個導電連接結構分別電性連接於多個頂端導電接點且分別電性連接於多個底端導電接點。多個微加熱器設置在絕緣本體上或者內部，且分別鄰近多個頂端導電接點與多個底端導電接點。藉此，每一微加熱器能針對相對應的頂端導電接點或者相對應的底端導電接點進行加熱。

Description

具有加熱功能的轉接板以及電子裝置
本發明涉及一種轉接板以及電子裝置，特別是涉及一種具有加熱功能的轉接板以及一種使用所述轉接板的電子裝置。
目前，IC晶片可能會透過一轉接板而電性連接於一電路板，然而現有的轉接板仍具有改善空間。
本發明所要解決的技術問題在於，針對現有技術的不足提供一種具有加熱功能的轉接板以及一種使用所述轉接板的電子裝置。
為了解決上述的技術問題，本發明所採用的其中一技術方案是，提供一種具有加熱功能的轉接板，其包括：一絕緣本體、多個頂端導電接點、多個底端導電接點、多個導電連接結構以及多個微加熱器。多個所述頂端導電接點設置在所述絕緣本體的一頂端上。多個所述底端導電接點設置在所述絕緣本體的一底端上。多個所述導電連接結構設置在所述絕緣本體的內部，多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點，以使得每一所述導電連接結構電性連接於相對應的所述頂端導電接點與相對應的所述底端導電接點之間。多個所述微加熱器設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點。其中，當多個頂端焊接物分別設置在多個所述頂端導電接點，且多個底端焊接物分別設置在多個所述底端導電接點時，多個所述微加熱器對多個所述頂端焊接物與多個所述底端焊接物進行加熱。
為了解決上述的技術問題，本發明所採用的另外一技術方案是，提供一種具有加熱功能的轉接板，其包括：一絕緣本體、多個頂端導電接點、多個底端導電接點、多個導電連接結構以及多個微加熱器。多個所述頂端導電接點設置在所述絕緣本體上。多個所述底端導電接點設置在所述絕緣本體上。多個所述導電連接結構設置在所述絕緣本體上，且多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點。多個所述微加熱器設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點。其中，每一所述微加熱器對相對應的所述頂端導電接點或者相對應的所述底端導電接點進行加熱。
為了解決上述的技術問題，本發明所採用的另外再一技術方案是，提供一種電子裝置，其包括：一電路基板、設置在所述電路基板上的一轉接板以及被所述轉接板所承載的至少一電子晶片，其特徵在於，所述轉接板包括：一絕緣本體、多個頂端導電接點、多個底端導電接點、多個導電連接結構以及多個微加熱器。所述絕緣本體設置在所述電路基板上。多個所述頂端導電接點設置在所述絕緣本體上。多個所述底端導電接點設置在所述絕緣本體上。多個所述導電連接結構設置在所述絕緣本體上，且多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點。多個所述微加熱器設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點。其中，每一所述微加熱器對相對應的所述頂端導電接點或者相對應的所述底端導電接點進行加熱。
本發明的其中一有益效果在於，本發明所提供的轉接板與電子裝置，其能通過“多個所述微加熱器設置在所述絕緣本體上或者內部”以及“多個所述微加熱器分別鄰近多個所述頂端導電接點與多個所述底端導電接點”的技術方案，以使得每一所述微加熱器能針對相對應的所述頂端導電接點或者相對應的所述底端導電接點進行加熱。藉此，當多個頂端焊接物分別設置在多個所述頂端導電接點，且多個底端焊接物分別設置在多個所述底端導電接點時，多個所述微加熱器能對多個所述頂端焊接物與多個所述底端焊接物進行加熱。
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。
以下是通過特定的具體實施例來說明本發明所公開有關“具有加熱功能的轉接板以及電子裝置”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。
應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”等術語來描述各種元件，但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
[第一實施例]
參閱圖1至圖3所示，本發明第一實施例提供一種具有加熱功能的轉接板B，其包括：一絕緣本體10、多個頂端導電接點11、多個底端導電接點12、多個導電連接結構13以及多個微加熱器14。
更進一步來說，如圖1所示，多個頂端導電接點11設置在絕緣本體10上，並且多個底端導電接點12也設置在絕緣本體10上。另外，多個導電連接結構13設置在絕緣本體10上，並且多個導電連接結構13分別電性連接於多個頂端導電接點11且分別電性連接於多個底端導電接點12。此外，多個微加熱器14設置在絕緣本體10上，並且多個微加熱器14分別鄰近多個頂端導電接點11與多個底端導電接點12。藉此，每一微加熱器14能針對相對應的頂端導電接點11或者相對應的底端導電接點12進行加熱。
舉例來說，如圖1所示，多個頂端導電接點11能設置在絕緣本體10的一頂端上，並且多個底端導電接點12能設置在絕緣本體10的一底端上。另外，多個導電連接結構13能設置在絕緣本體10的內部，導電連接結構13可為一筆直的或者非筆直的導電連接體，並且導電連接結構13的兩相反端分別電性連接於頂端導電接點11與底端導電接點12。也就是說，當多個導電連接結構13分別電性連接於多個頂端導電接點11且分別電性連接於多個底端導電接點12時，每一導電連接結構13就會電性連接於相對應的頂端導電接點11與相對應的底端導電接點12之間。然而，本發明不以上述所舉的例子為限。
舉例來說，每一個微加熱器14會對應到一個頂端導電接點11或者一個底端導電接點12。此外，微加熱器14可為一圍繞狀，以圍繞頂端導電接點11或者底端導電接點12；微加熱器14亦可設置在頂端導電接點11的任意三側或者設置在底端導電接點12的任意三側；微加熱器14亦可設置在頂端導電接點11的任意兩側或者設置在底端導電接點12的任意兩側（如圖1所示）；或者，微加熱器14亦可設置在頂端導電接點11的任意一側或者設置在底端導電接點12的任意一側。另外，多個微加熱器14可以採用並聯、串聯或者並聯加串聯的方式彼此電性連接。然而，本發明不以上述所舉的例子為限。
再者，配合圖1至圖3所示，本發明第一實施例所提供具有加熱功能的轉接板B還進一步包括：多個第一頂端電源輸入點15、多個底端電源輸入點16以及多個第二頂端電源輸入點17。更進一步來說，多個第一頂端電源輸入點15可設置在絕緣本體10的頂端，並且每一第一頂端電源輸入點15能電性連接於多個頂端微加熱器14T之中的至少一個（如圖2所示）。另外，多個底端電源輸入點16可設置在絕緣本體10的底端，並且每一底端電源輸入點16能電性連接於多個底端微加熱器14B之中的至少一個（如圖3所示）。此外，多個第二頂端電源輸入點17可設置在絕緣本體10的頂端，多個第二頂端電源輸入點17可分別對應於多個底端電源輸入點16，並且每一第二頂端電源輸入點17可通過一導電通道18，以電性連接於相對應的底端電源輸入點16。也就是說，多個第一頂端電源輸入點15與多個第二頂端電源輸入點17可以同時被設置在絕緣本體10的頂端上，以便於使用者直接在絕緣本體10的頂端上對多個第一頂端電源輸入點15與多個第二頂端電源輸入點17輸入電源，藉此以驅動每一微加熱器14對相對應的頂端導電接點11或者相對應的底端導電接點12進行加熱。舉例來說，每一第一頂端電源輸入點15可以包括一正極接點與一負極接點，並且每一第二頂端電源輸入點17可以包括一正極接點與一負極接點。然而，本發明不以上述所舉的例子為限。
[第二實施例]
參閱圖4所示，本發明第二實施例提供一種具有加熱功能的轉接板B，其包括：一絕緣本體10、多個頂端導電接點11、多個底端導電接點12、多個導電連接結構13以及多個微加熱器14。由圖4與圖1的比較可知，本發明第二實施例與第一實施例最大的差別在於：在第二實施例中，多個微加熱器14能被設置在絕緣本體10的內部。換言之，多個微加熱器14可以預先製作成具有多個微加熱器14的一微加熱器薄膜，然後再將具有多個微加熱器14的微加熱器薄膜設置在絕緣本體10的頂端或者底端（如圖1所示的第一實施例），或者在製作絕緣本體10時，直接將多個微加熱器14內嵌在絕緣本體10的內部（如圖4所示的第二實施例）。然而，本發明不以第一實施例或者第二實施例所舉的例子為限，只要是能夠將多個微加熱器14設置在轉接板B的任意位置，都是本發明要保護的技術特徵。
[第三實施例]
參閱圖5至圖7所示，本發明第三實施例提供一種電子裝置E，其包括：一電路基板P、設置在電路基板P上的一轉接板B以及被轉接板B所承載的至少一電子晶片C，並且轉接板B包括一絕緣本體10、多個頂端導電接點11、多個底端導電接點12、多個導電連接結構13以及多個微加熱器14。
更進一步來說，配合圖5與圖6所示，絕緣本體10設置在電路基板P上，多個頂端導電接點11設置在絕緣本體10上，並且多個底端導電接點12設置在絕緣本體10上。另外，多個導電連接結構13設置在絕緣本體10上，並且多個導電連接結構13分別電性連接於多個頂端導電接點11且分別電性連接於多個底端導電接點12。此外，多個微加熱器14設置在絕緣本體10上或者內部，多個微加熱器14分別鄰近多個頂端導電接點11與多個底端導電接點12，並且每一微加熱器14能針對相對應的頂端導電接點11或者相對應的底端導電接點12進行加熱。藉此，當多個頂端焊接物S1分別設置在多個頂端導電接點11，並且多個底端焊接物S2分別設置在多個底端導電接點12時，多個微加熱器14能對多個頂端焊接物S1與多個底端焊接物S2進行加熱，藉此以使得至少一電子晶片C能通過多個頂端焊接物S1的加熱而穩固地固接在轉接板B上，並且使得轉接板B能通過多個底端焊接物S2的加熱而穩固地固接在電路基板P上。舉例來說，頂端焊接物S1與底端焊接物S2可為錫球、錫膏或者任何能用於焊接的導電材料，然而本發明不以上述所舉的例子為限。
更進一步來說，配合圖5與圖6所示，當絕緣本體10被設置在電路基板P上且承載至少一電子晶片C時，至少一電子晶片C能通過轉接板B以電性連接於電路基板P。藉此，多個底端導電接點12能分別通過多個底端焊接物S2的電性導通，以分別電性連接於電路基板P的多個基板導電接點P10，並且多個頂端導電接點11能分別通過多個頂端焊接物S1的電性導通，以分別電性連接於至少一電子晶片C的多個晶片導電接點C10。
更進一步來說，配合圖5與圖6所示，本發明第三實施例的電子裝置E還能進一步包括一第一非導電薄膜F1（或者第一非導電膠，例如底部填充劑）以及一第二非導電薄膜F2（或者第二非導電膠，例如底部填充劑）。當第一非導電薄膜F1被設置在絕緣本體10與電路基板P之間，並且第二非導電薄膜F2被設置在至少一電子晶片C與絕緣本體10之間時，多個微加熱器14就能對第一非導電薄膜F1與第二非導電薄膜F2進行加熱。藉此，第一非導電薄膜F1會因為受熱而能穩固地被設置在絕緣本體10與電路基板P之間，以將絕緣本體10與電路基板P之間的空隙填滿而避免產生多餘的空隙，並且第二非導電薄膜F2會因為受熱而能穩固地被設置在至少一電子晶片C與絕緣本體10之間，以將至少一電子晶片C與絕緣本體10之間的空隙填滿而避免產生多餘的空隙。舉例來說，當多個微加熱器14對第一非導電薄膜F1與第二非導電薄膜F2進行加熱時，第一非導電薄膜F1與第二非導電薄膜F2會因為受熱而改變形狀，藉此以將絕緣本體10與電路基板P之間的空隙填滿而避免產生多餘的空隙，並且將至少一電子晶片C與絕緣本體10之間的空隙填滿而避免產生多餘的空隙。
值得注意的是，如圖6所示，當多個微加熱器14區分成多個頂端微加熱器14T以及多個底端微加熱器14B時，頂端微加熱器14T會比底端微加熱器14B更靠近至少一電子晶片C，而底端微加熱器14B會比頂端微加熱器14T更靠近電路基板P。配合圖6與圖7所示，多個第二頂端電源輸入點17可設置在絕緣本體10的頂端，多個第二頂端電源輸入點17可分別對應於多個底端電源輸入點16，並且每一第二頂端電源輸入點17可通過一導電通道18，以電性連接於相對應的底端電源輸入點16。也就是說，多個第一頂端電源輸入點15與多個第二頂端電源輸入點17可以同時被設置在絕緣本體10的頂端上，以便於使用者直接在絕緣本體10的頂端上對多個第一頂端電源輸入點15與多個第二頂端電源輸入點17輸入電源，藉此以驅動每一微加熱器14對相對應的頂端導電接點11或者相對應的底端導電接點12進行加熱。
[實施例的有益效果]
本發明的其中一有益效果在於，本發明所提供的轉接板B與電子裝置E，其能通過“多個微加熱器14設置在絕緣本體10上或者內部”以及“多個微加熱器14分別鄰近多個頂端導電接點11與多個底端導電接點12”的技術方案，以使得每一微加熱器14能針對相對應的頂端導電接點11或者相對應的底端導電接點12進行加熱。藉此，當多個頂端焊接物S1分別設置在多個頂端導電接點11，且多個底端焊接物S2分別設置在多個底端導電接點12時，多個微加熱器14能對多個頂端焊接物S1與多個底端焊接物S2進行加熱。
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。
E:電子裝置 P:電路基板 P10:基板導電接點 C:電子晶片 C10:晶片導電接點 B:轉接板 10:絕緣本體 11:頂端導電接點 12:底端導電接點 13:導電連接結構 14:微加熱器 14T:頂端微加熱器 14B:底端微加熱器 15:第一頂端電源輸入點 16:底端電源輸入點 17:第二頂端電源輸入點 18:導電通道 S1:頂端焊接物 S2:底端焊接物 F1:第一非導電薄膜 F2:第二非導電薄膜
圖1為本發明第一實施例所提供具有加熱功能的轉接板的示意圖。
圖2為本發明第一實施例所提供的第一頂端電源輸入點與頂端微加熱器的相互關係的功能方塊圖。
圖3為本發明第一實施例所提供的底端電源輸入點與底端微加熱器的相互關係的功能方塊圖。
圖4為本發明第二實施例所提供具有加熱功能的轉接板的示意圖。
圖5為本發明第三實施例所提供的電子裝置的分解示意圖。
圖6為本發明第三實施例所提供的電子裝置的組合示意圖。
圖7為本發明第三實施例所提供的電子裝置的俯視示意圖。
B:轉接板
10:絕緣本體
11:頂端導電接點
12:底端導電接點
13:導電連接結構
14:微加熱器
14T:頂端微加熱器
14B:底端微加熱器
15:第一頂端電源輸入點
16:底端電源輸入點
17:第二頂端電源輸入點
18:導電通道

Claims (10)

  1. 一種具有加熱功能的轉接板，其包括： 一絕緣本體； 多個頂端導電接點，其設置在所述絕緣本體的一頂端上； 多個底端導電接點，其設置在所述絕緣本體的一底端上； 多個導電連接結構，其設置在所述絕緣本體的內部，多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點，以使得每一所述導電連接結構電性連接於相對應的所述頂端導電接點與相對應的所述底端導電接點之間；以及 多個微加熱器，其設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點； 其中，當多個頂端焊接物分別設置在多個所述頂端導電接點，且多個底端焊接物分別設置在多個所述底端導電接點時，多個所述微加熱器對多個所述頂端焊接物與多個所述底端焊接物進行加熱。
  2. 如申請專利範圍第1項所述之具有加熱功能的轉接板，其中，當所述絕緣本體被設置在一電路基板上且承載至少一電子晶片時，一第一非導電薄膜被設置在所述絕緣本體與所述電路基板之間，且一第二非導電薄膜被設置在所述至少一電子晶片與所述絕緣本體之間；其中，所述至少一電子晶片通過所述轉接板以電性連接於所述電路基板，且多個所述微加熱器對所述第一非導電薄膜與所述第二非導電薄膜進行加熱；其中，多個所述底端導電接點分別通過多個所述底端焊接物的電性導通，以分別電性連接於所述電路基板的多個基板導電接點，且多個所述頂端導電接點分別通過多個所述頂端焊接物的電性導通，以分別電性連接於所述至少一電子晶片的多個晶片導電接點；其中，所述導電連接結構為一筆直的或者非筆直的導電連接體，且所述導電連接結構的兩相反端分別電性連接於所述頂端導電接點與所述底端導電接點；其中，多個所述微加熱器區分成多個頂端微加熱器以及多個底端微加熱器，所述頂端微加熱器比所述底端微加熱器更靠近所述至少一電子晶片，所述底端微加熱器比所述頂端微加熱器更靠近所述電路基板。
  3. 如申請專利範圍第2項所述之具有加熱功能的轉接板，還進一步包括： 多個第一頂端電源輸入點，其設置在所述絕緣本體的所述頂端，每一所述第一頂端電源輸入點電性連接於多個所述頂端微加熱器之中的至少一個； 多個底端電源輸入點，其設置在所述絕緣本體的所述底端，每一所述底端電源輸入點電性連接於多個所述底端微加熱器之中的至少一個；以及 多個第二頂端電源輸入點，其設置在所述絕緣本體的所述頂端，且分別對應於多個所述底端電源輸入點，每一所述第二頂端電源輸入點通過一導電通道，以電性連接於相對應的所述底端電源輸入點。
  4. 一種具有加熱功能的轉接板，其包括： 一絕緣本體； 多個頂端導電接點，其設置在所述絕緣本體上； 多個底端導電接點，其設置在所述絕緣本體上； 多個導電連接結構，其設置在所述絕緣本體上，多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點；以及 多個微加熱器，其設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點； 其中，每一所述微加熱器對相對應的所述頂端導電接點或者相對應的所述底端導電接點進行加熱。
  5. 如申請專利範圍第4項所述之具有加熱功能的轉接板，其中，當所述絕緣本體被設置在一電路基板上且承載至少一電子晶片時，一第一非導電薄膜被設置在所述絕緣本體與所述電路基板之間，且一第二非導電薄膜被設置在所述至少一電子晶片與所述絕緣本體之間；其中，所述至少一電子晶片通過所述轉接板以電性連接於所述電路基板，且多個所述微加熱器對所述第一非導電薄膜與所述第二非導電薄膜進行加熱；其中，多個所述底端導電接點分別通過多個底端焊接物的電性導通，以分別電性連接於所述電路基板的多個基板導電接點，且多個所述頂端導電接點分別通過多個頂端焊接物的電性導通，以分別電性連接於所述至少一電子晶片的多個晶片導電接點；其中，所述導電連接結構為一筆直的或者非筆直的導電連接體，且所述導電連接結構的兩相反端分別電性連接於所述頂端導電接點與所述底端導電接點；其中，多個所述微加熱器區分成多個頂端微加熱器以及多個底端微加熱器，所述頂端微加熱器比所述底端微加熱器更靠近所述至少一電子晶片，所述底端微加熱器比所述頂端微加熱器更靠近所述電路基板。
  6. 如申請專利範圍第5項所述之具有加熱功能的轉接板，還進一步包括： 多個第一頂端電源輸入點，其設置在所述絕緣本體的所述頂端，每一所述第一頂端電源輸入點電性連接於多個所述頂端微加熱器之中的至少一個； 多個底端電源輸入點，其設置在所述絕緣本體的所述底端，每一所述底端電源輸入點電性連接於多個所述底端微加熱器之中的至少一個；以及 多個第二頂端電源輸入點，其設置在所述絕緣本體的所述頂端，且分別對應於多個所述底端電源輸入點，每一所述第二頂端電源輸入點通過一導電通道，以電性連接於相對應的所述底端電源輸入點。
  7. 一種電子裝置，其包括：一電路基板、設置在所述電路基板上的一轉接板以及被所述轉接板所承載的至少一電子晶片，其特徵在於，所述轉接板包括： 一絕緣本體，其設置在所述電路基板上； 多個頂端導電接點，其設置在所述絕緣本體上； 多個底端導電接點，其設置在所述絕緣本體上； 多個導電連接結構，其設置在所述絕緣本體上，多個所述導電連接結構分別電性連接於多個所述頂端導電接點且分別電性連接於多個所述底端導電接點；以及 多個微加熱器，其設置在所述絕緣本體上或者內部，且分別鄰近多個所述頂端導電接點與多個所述底端導電接點； 其中，每一所述微加熱器對相對應的所述頂端導電接點或者相對應的所述底端導電接點進行加熱。
  8. 如申請專利範圍第7項所述之電子裝置，還進一步包括：一第一非導電薄膜以及一第二非導電薄膜，所述第一非導電薄膜被設置在所述絕緣本體與所述電路基板之間，且所述第二非導電薄膜被設置在所述至少一電子晶片與所述絕緣本體之間；其中，所述至少一電子晶片通過所述轉接板以電性連接於所述電路基板，且多個所述微加熱器對所述第一非導電薄膜與所述第二非導電薄膜進行加熱；其中，多個所述底端導電接點分別通過多個底端焊接物的電性導通，以分別電性連接於所述電路基板的多個基板導電接點，且多個所述頂端導電接點分別通過多個頂端焊接物的電性導通，以分別電性連接於所述至少一電子晶片的多個晶片導電接點；其中，所述導電連接結構為一筆直的或者非筆直的導電連接體，且所述導電連接結構的兩相反端分別電性連接於所述頂端導電接點與所述底端導電接點；其中，多個所述微加熱器區分成多個頂端微加熱器以及多個底端微加熱器，所述頂端微加熱器比所述底端微加熱器更靠近所述至少一電子晶片，所述底端微加熱器比所述頂端微加熱器更靠近所述電路基板。
  9. 如申請專利範圍第8項所述之電子裝置，其中，所述轉接板還進一步包括： 多個第一頂端電源輸入點，其設置在所述絕緣本體的所述頂端，每一所述第一頂端電源輸入點電性連接於多個所述頂端微加熱器之中的至少一個； 多個底端電源輸入點，其設置在所述絕緣本體的所述底端，每一所述底端電源輸入點電性連接於多個所述底端微加熱器之中的至少一個；以及 多個第二頂端電源輸入點，其設置在所述絕緣本體的所述頂端，且分別對應於多個所述底端電源輸入點，每一所述第二頂端電源輸入點通過一導電通道，以電性連接於相對應的所述底端電源輸入點。
  10. 如申請專利範圍第7項所述之電子裝置，其中，多個所述頂端焊接物分別設置在多個所述頂端導電接點，多個所述底端焊接物分別設置在多個所述底端導電接點，多個所述微加熱器對多個所述頂端焊接物與多個所述底端焊接物進行加熱。
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