TW202114927A - 移轉設備以及移轉方法 - Google Patents
移轉設備以及移轉方法 Download PDFInfo
- Publication number
- TW202114927A TW202114927A TW109131205A TW109131205A TW202114927A TW 202114927 A TW202114927 A TW 202114927A TW 109131205 A TW109131205 A TW 109131205A TW 109131205 A TW109131205 A TW 109131205A TW 202114927 A TW202114927 A TW 202114927A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- stage
- laser
- alignment
- transfer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 53
- 239000000758 substrate Substances 0.000 claims abstract description 350
- 230000001678 irradiating effect Effects 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims description 69
- 230000007547 defect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0007—Applications not otherwise provided for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190122271A KR102409763B1 (ko) | 2019-10-02 | 2019-10-02 | 전사장치 및 전사방법 |
KR10-2019-0122271 | 2019-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202114927A true TW202114927A (zh) | 2021-04-16 |
Family
ID=75180187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109131205A TW202114927A (zh) | 2019-10-02 | 2020-09-11 | 移轉設備以及移轉方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021061394A (ja) |
KR (1) | KR102409763B1 (ja) |
CN (1) | CN112599462A (ja) |
TW (1) | TW202114927A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102534310B1 (ko) * | 2022-01-28 | 2023-05-26 | 주식회사 셀코스 | 마이크로 led 전사 장치 및 이를 이용한 레이저 전사 방법 |
JP2023147767A (ja) * | 2022-03-30 | 2023-10-13 | 東レエンジニアリング株式会社 | 転写方法、及び転写装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4420065B2 (ja) * | 2007-05-21 | 2010-02-24 | ソニー株式会社 | 転写方法および転写装置ならびに有機発光素子の製造方法 |
KR20120138472A (ko) * | 2011-06-15 | 2012-12-26 | 삼성디스플레이 주식회사 | 레이저 열전사 장치, 레이저 열전사 방법, 및 그를 이용한 유기 발광 표시장치의 제조 방법 |
KR102001226B1 (ko) * | 2012-11-12 | 2019-07-25 | 삼성디스플레이 주식회사 | 레이저 열전사 장치 및 레이저 열전사 방법 |
JP2018060993A (ja) * | 2016-09-29 | 2018-04-12 | 東レエンジニアリング株式会社 | 転写方法、実装方法、転写装置、及び実装装置 |
KR102488274B1 (ko) | 2017-12-27 | 2023-01-12 | 엘지디스플레이 주식회사 | 마이크로 led 전사 방법, 이를 이용한 마이크로 led 표시 패널 제조 방법 및 마이크로 led 표시 패널 |
-
2019
- 2019-10-02 KR KR1020190122271A patent/KR102409763B1/ko active IP Right Grant
-
2020
- 2020-09-11 TW TW109131205A patent/TW202114927A/zh unknown
- 2020-09-24 JP JP2020159713A patent/JP2021061394A/ja active Pending
- 2020-09-25 CN CN202011023766.3A patent/CN112599462A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102409763B1 (ko) | 2022-06-20 |
KR20210040210A (ko) | 2021-04-13 |
CN112599462A (zh) | 2021-04-02 |
JP2021061394A (ja) | 2021-04-15 |
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