TW202113959A - 加工裝置、及晶圓之加工方法 - Google Patents
加工裝置、及晶圓之加工方法 Download PDFInfo
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Abstract
本發明之課題係提案於背面形成圓形之凹部與外周凸部的晶圓中,不從保持平台取下晶圓,可進行晶圓之單片化的技術。
做為解決手段,加工晶圓之加工裝置中,包含:具有保持晶圓之表面側之透明材所成保持部的可旋轉之保持平台、和將以保持平台所保持之晶圓之表面,隔著保持部加以攝像之下方攝像攝影機、和具有切削晶圓之背面之外周凸部,減少外周凸部之高度之第一切削刀的第一切削單元、以及具有沿下方攝像攝影機所攝像之晶圓之表面之切割道,切削晶圓的第二切削刀的第二切削單元。
Description
本發明係有關加工經由背面之圓形之凹部,形成外周凸部之晶圓的加工裝置,及使用加工裝置之加工方法。
於半導體晶圓之加工工程中,於薄化晶圓之背面,成膜金屬膜之工程中,會有由於晶圓之強度不足,產生晶圓破損之疑慮。
為了防止此晶圓破損,已知有在於研磨晶圓之背面時,不研磨外周剩餘領域,以原本之厚度加以殘留,形成外周凸部,於外周凸部構成補強部的技術。
然後,於成膜金屬膜之後,對於個各晶片進行切割時,需在晶圓之表面為上之狀態下加以切削之故,利用了對應於圍繞在外周凸部之圓形之凹部之形狀的保持平台,例如專利文獻1中,則揭示有關於具備嵌合於圓形之凹部之圓盤狀多孔吸附部的所謂凸型之保持平台。
另一方面,專利文獻2中,揭示有關於經由晶圓之背面中相當於裝置領域之領域的研磨,形成圓形之凹部,形成外周凸部,於背面研磨後之晶圓之裝置領域或背面,施以追加加工後,除去追加加工後之晶圓之外周凸部的技術。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2010-016146號公報
[專利文獻2]日本特開2007-019379號公報
[發明欲解決之課題]
但是,補強部之外周凸部之寬度係由於晶圓之圖案(晶圓尺寸或裝置領域之尺寸)等而有所不同。為此,揭示於如專利文獻1之凸型之保持平台所成之構成中,需產生製作對應於各晶圓之寬度之不同之外周凸部的保持平台的同時,會產生該管理負擔,而變得煩雜。又,於加工時會產生交換的麻煩,由此,會有削減到裝置之稼動時間。
做為不使用凸型之保持平台之方法,有將晶圓之背面朝上露出之狀態下,進行晶圓之切削之方法,於晶圓之背面成膜金屬膜時,無法以IR攝影機攝像表面側之故,會有無法檢出切割道,不能對準之問題。
有鑑於以上之問題,雖可不成膜外周凸部之上端,將此領域以IR攝影機加以攝像,以檢出切割道,但外周部分圖案精度低,難以進行高精度之對準,因此難以採用此方法。
另一方面,如專利文獻2,有除去外周凸部,平坦化晶圓之背面後,將晶圓之表面朝上加以切割之方式。根據此方式時,無需使用凸型之保持平台。
此時,露出晶圓之表面進行加工之故,雖需要於晶圓之背面黏貼膠帶之作業,經由除去薄化之晶圓之補強部的外周凸部,晶圓之強度變弱之故,於黏貼膠帶之作業時,晶圓會有破損之疑慮。
因此,本發明之目的係提供於背面形成圓形之凹部與外周凸部的晶圓中,不從保持平台取下晶圓,可進行晶圓之單片化的加工裝置及晶圓之加工方法。
[為解決課題之手段]
根據本發明之一側面視之,提供了對應於在以表面之交叉之複數之切割道分割之各領域,各別形成裝置之裝置領域的背面,形成凹部的同時,加工形成圍繞該凹部之外周凸部的晶圓的加工裝置中,包含:具有保持該晶圓之該表面側之透明材所成保持部的可旋轉之保持平台、和將以保持平台所保持之該晶圓之該表面,隔著該保持部加以攝像之下方攝像攝影機、和具備:具有切削該晶圓之背面之該外周凸部,減少該外周凸部之高度之第一切削刀的第一切削單元、以及具有沿該下方攝像攝影機所攝像之該晶圓之該表面之該切割道,切削該晶圓的第二切削刀的第二切削單元的切削機構、和相對移動該保持平台與該切削機構的移動機構的加工裝置。
較佳係加工裝置係更具備攝像以該保持平台所保持之該晶圓之該背面的上方攝像攝影機。
根據本發明之其他之側面視之,提供具備:對應於在以表面之交叉之複數之切割道分割之各領域,各別形成裝置之裝置領域的背面,形成凹部的同時,準備形成圍繞該凹部之外周凸部之晶圓之晶圓準備步驟、和於該晶圓表面,配設透明之保護構件的保護構件配設步驟、和隔著該保護構件,以具有將該晶圓之表面側由透明材所成保持部的保持平台加以保持的保持步驟、和對於以該保持平台所保持之該晶圓之該外周凸部,將第一切削刀之前端,切入至不達到該凹部之底面之高度,進行切削,減少該外周凸部之高度的第一切削步驟、和實施該第一切削步驟之後,以配設於該保持平台之下方的下方攝像攝影機,隔著透明之該保持部與透明之該保護構件,攝像該晶圓之該表面,檢出切割道的切割道檢出步驟、和沿著以該切割道檢出步驟所檢出之該切割道,以第二切削刀切削該晶圓的第二切削步驟的晶圓之加工方法。
[發明效果]
根據本發明之構成時,於背面形成圓形之凹部與外周凸部的晶圓中,不從保持平台取下晶圓,可進行晶圓之單片化,可防止從保持平台取下晶圓時所產生之晶圓之破損的疑慮。
又,外周凸部係經由第一切削刀加以加工,外周凸部之部分之厚度變薄之故,無需過度設定第二切削刀之刀刃伸出量,可以適切之刀刃伸出量進行切削。由此,可抑制切削刀之破裂,或振動之產生等之不妥情事之產生。
[為實施發明之形態]
以下,將本發明之實施形態,參照圖面加以說明。圖1係關於本發明之第一實施形態之加工裝置2之斜視圖。加工裝置2係做為對向2個切削刀配設之面對雙主軸型之切削裝置加以構成。
於加工裝置2之基台4中,保持平台27經由移動機構23([圖3](A)),可往復作動於X軸方向地加以配設。於保持平台27之周圍,配設有水蓋14,在此水蓋14與基台4連結有蛇腹16。
於基台4之前側角部中,設有為載置收容被加工物之卡匣20的卡匣載置台21。
於基台4上,立設有門型形狀之柱24,於柱24中,固定有延伸於Y軸方向之一對導軌26。於柱24中,第一Y軸移動區塊28則經由滾珠螺桿30和脈衝馬達(未圖示)所成第一Y軸移動機構34,引導至導軌26,可向Y軸方向移動地加以搭載。
第一Y軸移動區塊28中,固定有延伸於Z軸方向之一對導軌36。於第一Y軸移動區塊28上,第一Z軸移動區塊38則經由滾珠螺桿40和脈衝馬達42所成第一Z軸移動機構44,引導至導軌36,可向Z軸方向移動地加以搭載。
於第一Z軸移動區塊38,安裝有第一切削單元46及上方攝像攝影機52。第一切削單元46係如圖7(A)所示、在經由馬達(未圖示)旋轉驅動之主軸48之前端部,將第一切削刀50可裝卸地加以裝設構成。
於門型形狀之柱24中,更將第二Y軸移動區塊28a,經由滾珠螺桿30a和脈衝馬達32a所成第二Y軸移動機構34a,引導至導軌26,可向Y軸方向移動地加以搭載。
第二Y軸移動區塊28a中,固定有延伸於Z軸方向之一對導軌36a。於第二Y軸移動區塊28a上,第二Z軸移動區塊38a則經由滾珠螺桿40a和脈衝馬達42a所成第二Z軸移動機構44a,引導至導軌36a,可向Z軸方向移動地加以搭載。
於第二Z軸移動區塊38a,安裝有第二切削單元46a。第二切削單元46a係在經由馬達(未圖示)旋轉驅動之主軸之前端部,將第二切削刀可裝卸地加以裝設構成。
於基台4上,設置具有旋轉平台56之旋轉洗淨單元54,將切削加工後之被加工物以旋轉平台56加以吸引保持,旋轉洗淨,於洗淨後,旋轉乾燥。
圖2係對於保持平台27之構成加以說明之圖。保持平台27係具有環狀支持構件62、和圓盤狀之保持墊74。環狀支持構件62係貝有嵌合凸部64、和較嵌合凸部64大口徑之帶回捲部66、和與嵌合凸部64略同一口徑之環狀收容部68、貫通於軸方向之貫通部65、形成貫通部65之內周面65a。
環狀收容部68係具有與保持墊74外形略相同之內徑,於環狀收容部68之內側底部,形成有支持保持墊74之環狀支持部70。
保持墊74係由石英玻璃、硼矽酸玻璃、藍寶石、氟化鈣、氟化鋰、氟化鎂等之透明物質所形成,該表面之保持部74a中,開口有多數之細孔76。然而,透明物質之「透明」係指「透過可見光之至少一部之波長之光,不吸收、散亂者」,可進行後述之外周凸部檢出步驟、或切割道檢出步驟即可,可為有著色者。又,對於細孔76之配置,尤其非限定於圖2所示配置於圓周上者,例如亦可配置於保持部74a之整面。
各細孔76係連通於形設於保持墊74之內部的吸引溝78a(圖4),於環狀支持構件62之環狀支持部70,形成連通保持墊74之吸引溝78a(圖4)之連通路徑72。連通路徑72係連接於吸引源80。
將保持墊74搭載於環狀支持構件62之環狀支持部70上,將環狀支持構件62之嵌合凸部64嵌合於支持匣體15之圓形開口15a中之時,如圖3(A)所示,成為保持平台27可旋轉搭載於支持匣體15之狀態。
支持匣體15之連結板15b中,安裝有馬達17,於連結於馬達17之輸出軸帶輪17a與環狀支持構件62之帶回捲部66,回捲橫渡皮帶29。驅動馬達17時,隔著皮帶29,旋轉保持平台27。
馬達17係例如由脈衝馬達所構成,於進行對準時,將馬達17以特定所定脈衝驅動時,保持平台27則旋轉預定量(θ旋轉),進行如圖5(A)所示之晶圓10之切割道(分割預定線)13之對準。
於支持匣體15之上板15c中,形成複數(本實施形態為4個)之框架支持台15d,在此等之框架支持台15d之上面,支持後述之環狀框體。
如圖3(A)所示,支持匣體15係可滑動載置於固定延伸存在於X軸方向之一對之導軌31,經由移動機構23向X軸方向移動。移動機構23係具有平行配置於導軌31之間之滾珠螺桿23a、和脈衝馬達23b加以構成。
如圖3(A)所示,滾動螺旋23a係螺合於設在支持匣體15之下板15e之下面的母螺絲部,驅動脈衝馬達23b,經由旋轉滾珠螺桿23a、支持匣體15向X軸方向移動。
如圖3(A)所示,於保持平台27之支持匣體15之附近,設置將保持於保持平台27之半導體晶圓等之被加工物,從保持墊74之下側加以攝像之下方攝像攝影機82。
如圖3(A)所示,下方攝像攝影機82係設置於立設於Y軸移動區塊83之柱96。Y軸移動區塊83係可滑動載置於固定延伸存在於Y軸方向之一對之導軌81,經由驅動手段85向Y軸方向移動。驅動手段85係具有平行配置於導軌81之間之滾珠螺桿85a、和脈衝馬達85b而構成。
如圖3(A)所示,滾動螺旋85a係螺合於設在Y軸移動區塊83之下面的母螺絲部,驅動脈衝馬達85b,經由旋轉滾珠螺桿85a、Y軸移動區塊83向Y軸方向移動。
如圖3(B)所示,下方攝像攝影機82係具有低倍率攝影機86及高倍率攝影機88之攝影機單元84。於攝影機單元84之側面中,安裝有在於攝影機單元84之攝像時,為照明攝像處所之2個照明裝置90,92。
如圖3(B)所示,攝影機單元84經由支持板94加以支持,支持板94之基端部係固定於Z軸移動區塊98。立設於Y軸移動區塊83之柱96中,經由滾珠螺桿100和脈衝馬達102所構成Z軸移動手段104,構成下方攝像攝影機82之攝影機單元84係沿一對之導軌106,向Z軸方向移動(上下方向)。。
如圖4所示,支持匣體15係於上板15c、下板15e及連結板15b,就側面視之,成為略ㄈ字,於連結板15b之相反側,於上板15c與下板15e間之空間,形成可達成下方攝像攝影機82之進入的開口部15g。
接著,對於使用以上之裝置構成之晶圓之加工方法之例加以說明。
<晶圓準備步驟>
首先,準備圖5(A)及(B)所示被加工物之一例之晶圓10。
圖5(A)係顯示晶圓10之表面10a者,裝置11則排列成格子狀,經由沿切割道13施以切削加工等之分割加工,分割成為晶片者。
圖5(B)係顯示晶圓10之背面10b者,包圍圓盤狀之晶圓10、和同心上之圓形之凹部18、和凹部18之周圍,形設有外周凸部19。凹部18係於表面10a中,形成於對應在形成裝置11之裝置領域的部分。然而,於凹部18或外周凸部19中,於該表面,有形成金屬膜之情形。
<保護構件配設步驟>
對於以上之晶圓10,如圖6(A)所示,於晶圓10之表面10a側,做為保護裝置之保護構件,黏貼透明之膠帶T的同時,如圖6(B)所示,將膠帶T之外周部黏貼於環狀框體F,構成晶圓單元8。然而,在此所稱膠帶T之「透明」係指「透過可見光之至少一部之波長之光,不吸收、散亂者」,可進行後述之外周凸部檢出步驟、或切割道檢出步驟即可,亦可為有著色者。又,做為保護構件,除了有伸縮性之樹脂製之膠帶之外,亦可為硬板(玻璃或樹脂等)。
膠帶T係例如以具有10~200μm之厚度氯化乙烯、聚對苯二甲酸乙二醇酯(PET)、或聚醯亞胺(PI)等之基材與丙烯酸或橡膠系之糊層加以構成。
<保持步驟>
接著,如圖4所示、成為將晶圓單元8配置於保持平台27之上,將晶圓10隔著膠帶T,於保持平台27加以保持之狀態。具體而言、晶圓單元8之膠帶T係載置於保持平台27之保持墊74上,開始吸引源80所進行之吸引,透過細孔76,吸引保持膠帶T之背面側。又,此時晶圓單元8之環狀框體F係載置於框架支持台15d。
<外周凸部檢出步驟>
接著,如圖4所示,經由上方攝像攝影機52,檢出晶圓10之外周凸部19之位置。具體而言,畫像解析以上方攝像攝影機52所攝像之畫像,檢出外周凸部19外之外周緣之位置,即檢出晶圓之外周緣之位置。又、外周凸部19之寬度W(晶圓10之半徑方向之寬度)或晶圓徑係對於每一晶圓之種類,做為晶圓10之屬性資訊,預先在加工裝置側加以辨識。
然而,代替如此經由上方攝像攝影機52(圖4)之攝像畫像,檢出外周凸部19之外周緣之位置之部分,以下方攝像攝影機82從下側攝像晶圓10,畫像解析攝像之畫像,檢出外周凸部19之外周緣(晶圓之外周緣)之位置亦可。根據如此,經由省略上方攝像攝影機52(圖4)所成攝像或装置構成,可省略上方攝像攝影機52(圖4)之設置。
<第一切削步驟>
接著,如圖7(A)所示,將第一切削單元46之第一切削刀50,定位於外周凸部19之同時,藉由將第一切削刀50切入外周凸部19,將外周凸部19經由切削加以除去。
更具體而言,將定位於外周凸部19之上方之第一切削刀50,下降至第一之特定高度加以切入的同時,藉由旋轉保持平台27,將外周凸部19經由切削加以除去。保持平台27之旋轉係如圖3(A)所示,經由驅動馬達17,隔著皮帶29,旋轉保持平台27加以進行。第一切削刀50與保持平台27(外周凸部19)之對位係可利用藉由上述之外周凸部檢出步驟所求得之晶圓10之外周凸部19之外周緣(晶圓之外周緣)之座標加以進行。
在此,「第一之特定高度」係第一切削刀50,不到達裝置領域之背面10b(圖7(A)之例中,為金屬膜18a)之高度,根據晶圓10之厚度,或凹部18之深度加以規定者。
如以上所述,經由除去外周凸部19,成為圖7(B)所示之狀態。然而,圖7(A)及圖7(B)所示之晶圓10中,於凹部18之範圍,雖形成金屬膜18a,對於未形成金屬膜18a之晶圓10,亦可適用本發明。
又,如以上所述,代替嚴密進行外周凸部19與第一切削刀50之對位,經由切削加以除去之部分,如以下加以實施亦可。首先,將第一切削刀50定位於上述第一之特定高度。接著,重複保持平台27之X軸方向移動(圖1)與第一切削刀50之Y軸方向(圖1)之索引輸送,使覆蓋晶圓10之全範圍,相對移動晶圓10與第一切削刀50。由此,可除去晶圓10之全範圍之外周凸部19。
又,保持平台27為可360度旋轉之構成中,不實施外周凸部檢出步驟,根據晶圓10之直徑與保持平台27之中心位置,將第一切削刀50定位於晶圓10之外周緣,藉由將保持平台27在360度之範圍下旋轉,實施第1切削步驟亦可。
又,保持平台27可180度旋轉之構成中,不實施外周凸部檢出步驟,根據晶圓10之直徑與保持平台27之中心位置,將第一切削刀50定位於晶圓10之外周緣之一端側,使將保持平台27以順時鐘在180度之範圍下旋轉,除去晶圓10之180度之範圍之外周凸部19後,令第一切削刀50挾著晶圓10之中心,定位於與該一端側對向之另一端側,使將保持平台27以逆時鐘在180度之範圍下旋轉,除去殘留之外周凸部19,實施第1切削步驟亦可。
如以上之形態中,可省略上方攝像攝影機52或下方攝像攝影機82所進行之為檢出外周凸部19之外周緣的攝像,可省略外周凸部檢出步驟。
<切割道檢出步驟>
接著,如圖4及圖8(A)所示,經由移動Y軸移動區塊83,將下方攝像攝影機82定位於晶圓10之下方,隔著保持平台27之保持墊74、膠帶T,攝像晶圓10之表面10a(圖8(A)中之下側之面),檢出晶圓10之切割道13(圖5(A))。
<第二切削步驟>
接著,如圖8(B)所示,沿著檢出之切割道13(圖5(A)),進行第二切削單元46a之第二切削刀50a所進行之切削加工。
於進行此切削加工之前,實施對準。即,如圖3(A)所示,驅動馬達17,隔著皮帶29,旋轉保持平台27變更角度,使切割道13(圖5(A))與X軸方向或Y軸方向平行的同時,藉由將第二切削單元46a向Y軸方向移動,使切割道13(圖5(A))與第二切削單元46a之第二切削刀50a之位置一致。
實施對準之後,將第二切削單元46a之第二切削刀50a,定位在前端切入晶圓之第二之特定高度下,將保持平台27向X軸方向(圖1)加工輸送,將第二切削單元46a向Y軸方向(圖1)索引輸送,對於伸長於第一之方向之所有切割道13,進行第二切削刀50a之切削加工。接著,將保持平台27旋轉90度,對於伸長於正交在第一之方向之第二之方向所有之切割道13,進行第二切削刀50a之切削加工。令第2之特定高度,經由設定刀之前端切入至保護構件之高度,晶圓10則分割成晶片。
於此第二切削步驟中,如圖7(B)所示,外周凸部19係經由第一切削刀50加以加工,外周凸部19之部分之厚度變薄之故,無需過度設定第二切削刀50a之刀刃伸出量,可以適切之刀刃伸出量進行切削。即,即使,存在外周凸部19之時,雖然在切削外周凸部19下,需將刀刃到達晶圓10之表面側,設定較多之刀刃伸出量,而有切削刀之破裂或振動之產生等不妥之疑慮,但仍有回避如此不妥之產生之可能。又,以較少之刀刃伸出量即可之故,可選擇更薄之切削刀,由此更可實現更精密之切削加工。
然而,於第二切削步驟中,除了於晶圓10之厚度方向,貫通晶圓10,加以進行切削之全切割之外,進行在於晶圓10之厚度方向,切削至中途位置之半切割亦可。
如以上所述,可實現本發明。
即,如圖1至圖8所示,根據本發明之一個之側面視之,
提供了對應於在以表面10a之交叉之複數之切割道13分割之各領域,各別形成裝置11之裝置領域的背面10b,形成凹部18的同時,加工形成圍繞凹部18之外周凸部19的晶圓10的加工裝置中,具備:
具有保持晶圓10之表面10a側之透明材所成保持部74a的可旋轉之保持平台27、
和將以保持平台27所保持之晶圓10之表面10a,隔著保持部74a加以攝像之下方攝像攝影機82、
和具備:具有切削晶圓10之背面10b之外周凸部19,減少外周凸部19之高度之第一切削刀50的第一切削單元46、以及具有沿下方攝像攝影機82所攝像之晶圓10之表面10a之切割道13,切削晶圓10的第二切削刀50a的第二切削單元46a的切削機構(第一切削單元46、第二切削單元46a)、
和相對移動保持平台27與該切削機構的移動機構23的加工裝置2。
由此,於背面10b形成圓形之凹部18與外周凸部19的晶圓10中,不從保持平台27取下晶圓,可進行晶圓10之單片化,可防止從保持平台27取下晶圓10處理時所產生之晶圓10之破損的疑慮。
又,外周凸部19係經由第一切削刀50加以加工,外周凸部19之部分之厚度變薄之故,無需過度設定第二切削刀50a之刀刃伸出量,可以適切之刀刃伸出量進行切削。由此,可抑制切削刀之破裂,或振動之產生等之不妥情事之產生。
又,如圖4所示,更具備攝像以保持平台27所保持之晶圓10之背面10b的上方攝像攝影機52為佳。
由此,可檢出外周凸部19之位置,可將第一切削刀50之位置配合外周凸部19,進行外周凸部19之加工。
又,即,如圖1至圖8所示,根據本發明之另一之側面視之,
提供包含:對應於在以表面10a之交叉之複數之切割道13分割之各領域,各別形成裝置11之裝置領域的背面10b,形成凹部18的同時,準備形成圍繞凹部18之外周凸部19的晶圓10之晶圓10準備步驟、
和於晶圓10之表面10a,配設透明之保護構件(膠帶T)的保護構件配設步驟、
和隔著保護構件,將晶圓10之表面10a側以保持平台27加以保持的保持步驟、
和對於以保持平台27所保持之晶圓10之外周凸部19,將第一切削刀50之前端,切入至不達到凹部18之底面之高度,進行切削,減少外周凸部19之高度的第一切削步驟、
和實施第一切削步驟之後,以下方攝像攝影機82,隔著保持部74a與保護構件,攝像晶圓10之表面10a,檢出切割道13的切割道檢出步驟、
和沿著以切割道檢出步驟所檢出之切割道13,以第二切削刀50a切削晶圓10的第二切削步驟的加工方法。
由此,於背面10b形成圓形之凹部18與外周凸部19的晶圓10中,不從保持平台27取下晶圓,可進行晶圓10之單片化,可防止從保持平台27取下晶圓10處理時所產生之晶圓10之破損的疑慮。
2:加工裝置
10:晶圓
10a:表面
10b:背面
11:裝置
13:切割道
18:凹部
18a:金屬膜
19:外周凸部
23:移動機構
27:保持平台
46:第一切削單元
46a:第二切削單元
50:第一切削刀
50a:第二切削刀
52:上方攝像攝影機
74:保持墊
74b:保持部
82:下方攝像攝影機
T:膠帶
[圖1]顯示本發明實施形態之加工裝置的斜視圖。
[圖2]支持匣體及保持平台部分之分解斜視圖。
[圖3](A)係搭載於支持匣體上之保持平台部分之斜視圖。(B)係下方攝像攝影機及該支持構造之斜視圖。
[圖4]對於保持平台與下方攝像攝影機之位置關係加以說明之圖。
[圖5](A)係被加工物之一例之晶圓之斜視圖。(B)係晶圓之背面側斜視圖。
[圖6](A)係對於保護構件之黏貼加以說明之圖。(B)係晶圓單元之斜視圖。
[圖7](A)係顯示在於第一切削刀,除去外周凸部之第一切削步驟的一部分剖面側面圖。(B)係除去外周凸部之晶圓之剖面圖。
[圖8](A)係對於隔著保持襯墊,攝像晶圓之表面加以說明一部分剖面側面圖。(B)係對於第二切削單元所成切削加工加以說明一部分剖面側面圖。
8:構成晶圓單元
10:晶圓
10a:表面
15a:圓形開口
15b:連結板
15c:上板
15d:框架支持台
15e:下板
15g:開口部
17:馬達
18:凹部
19:外周凸部
27:保持平台
29:皮帶
52:上方攝像攝影機
65a:內周面
70:環狀支持部
72:連通路徑
74:保持墊
74a:保持部
76:細孔
78a:吸引溝
80:吸引源
82:下方攝像攝影機
83:Y軸移動區塊
85b:脈衝馬達
85:驅動手段
96:柱
102:脈衝馬達
104:Z軸移動手段
T:膠帶
F:環狀框體
Claims (3)
- 一種加工裝置,對應於在以表面之交叉之複數之切割道分割之各領域,各別形成裝置之裝置領域的背面,形成凹部的同時,加工形成圍繞該凹部之外周凸部的晶圓的加工裝置,其特徵係具備: 具有保持該晶圓之該表面側之透明材所成之保持部的可旋轉之保持平台、 和將以該保持平台所保持之該晶圓之該表面,隔著該保持部加以攝像之下方攝像攝影機、 和包含:具有切削該晶圓之背面之該外周凸部,減少該外周凸部之高度之第一切削刀的第一切削單元、以及具有沿該下方攝像攝影機所攝像之該晶圓之該表面之該切割道,切削該晶圓的第二切削刀的第二切削單元的切削機構、 和相對移動該保持平台與該切削機構的移動機構。
- 如請求項1記載之加工裝置,其中,更具備攝像以該保持平台所保持之該晶圓之該背面的上方攝像攝影機。
- 一種晶圓之加工方法,其特徵係具備: 對應於在以表面之交叉之複數之切割道分割之各領域,各別形成裝置之裝置領域的背面,形成凹部的同時,準備形成圍繞該凹部之外周凸部之晶圓之晶圓準備步驟、 和於該晶圓表面,配設透明之保護構件的保護構件配設步驟、 和隔著該保護構件,以具有將該晶圓之表面側由透明材所成之保持部的保持平台加以保持的保持步驟、 和對於以該保持平台所保持之該晶圓之該外周凸部,將第一切削刀之前端,切入至不達到該凹部之底面之高度,進行切削,減少該外周凸部之高度的第一切削步驟、 和實施該第一切削步驟之後,以配設於該保持平台之下方的下方攝像攝影機,隔著透明之該保持部與透明之該保護構件,攝像該晶圓之該表面,檢出切割道的切割道檢出步驟、 和沿著以該切割道檢出步驟所檢出之該切割道,以第二切削刀切削該晶圓的第二切削步驟。
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