TW202104523A - 磁碟基板之研磨方法 - Google Patents

磁碟基板之研磨方法 Download PDF

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Publication number
TW202104523A
TW202104523A TW109110868A TW109110868A TW202104523A TW 202104523 A TW202104523 A TW 202104523A TW 109110868 A TW109110868 A TW 109110868A TW 109110868 A TW109110868 A TW 109110868A TW 202104523 A TW202104523 A TW 202104523A
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TW
Taiwan
Prior art keywords
polishing
acid
magnetic disk
disk substrate
water
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TW109110868A
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English (en)
Chinese (zh)
Inventor
岩田徹
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日商山口精研工業股份有限公司
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Application filed by 日商山口精研工業股份有限公司 filed Critical 日商山口精研工業股份有限公司
Publication of TW202104523A publication Critical patent/TW202104523A/zh

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  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW109110868A 2019-04-04 2020-03-30 磁碟基板之研磨方法 TW202104523A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-072237 2019-04-04
JP2019072237A JP7269076B2 (ja) 2019-04-04 2019-04-04 磁気ディスク基板の研磨方法

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TW202104523A true TW202104523A (zh) 2021-02-01

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TW109110868A TW202104523A (zh) 2019-04-04 2020-03-30 磁碟基板之研磨方法

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JP (1) JP7269076B2 (ja)
TW (1) TW202104523A (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009172709A (ja) 2008-01-23 2009-08-06 Kao Corp 磁気ディスク基板用研磨液組成物
JP5890088B2 (ja) 2010-07-26 2016-03-22 山口精研工業株式会社 研磨剤組成物
JP6916648B2 (ja) 2017-03-31 2021-08-11 株式会社フジミインコーポレーテッド 磁気ディスク基板の研磨方法、研磨用組成物および研磨用組成物セット
JP6940315B2 (ja) 2017-06-22 2021-09-22 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
JP2019016417A (ja) 2017-07-04 2019-01-31 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物

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JP2020170578A (ja) 2020-10-15
JP7269076B2 (ja) 2023-05-08

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