TW202102632A - 黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法 - Google Patents
黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法 Download PDFInfo
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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| JP3594853B2 (ja) | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
| JP4428908B2 (ja) * | 2002-04-08 | 2010-03-10 | 日東電工株式会社 | 粘着シートを用いた被着体加工方法 |
| JP2004018761A (ja) * | 2002-06-19 | 2004-01-22 | Nitto Denko Corp | 加熱剥離性粘着シート |
| JP2007284666A (ja) * | 2006-03-20 | 2007-11-01 | Furukawa Electric Co Ltd:The | 加熱剥離性粘着テープ |
| KR20120022806A (ko) * | 2009-04-21 | 2012-03-12 | 닛토덴코 가부시키가이샤 | 가열 팽창형 재박리성 아크릴계 점착 테이프 또는 시트 |
| JP2011074245A (ja) * | 2009-09-30 | 2011-04-14 | Kyocera Chemical Corp | 仮固定用接着剤組成物及び部品の加工方法 |
| TWI586783B (zh) * | 2011-09-20 | 2017-06-11 | 日東電工股份有限公司 | 電子零件切斷用加熱剝離型黏著片及電子零件切斷方法 |
| JP2013159743A (ja) * | 2012-02-07 | 2013-08-19 | Nitto Denko Corp | 粘着剤積層物の剥離方法およびそれに用いる粘着剤層 |
| JP6000595B2 (ja) * | 2012-03-27 | 2016-09-28 | 日東電工株式会社 | 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法 |
| WO2016076131A1 (ja) * | 2014-11-13 | 2016-05-19 | Dic株式会社 | 両面粘着テープ、物品及び分離方法 |
| KR102365799B1 (ko) * | 2016-03-03 | 2022-02-21 | 린텍 가부시키가이샤 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
| KR102387311B1 (ko) * | 2016-10-17 | 2022-04-15 | 가부시끼가이샤 쓰리본드 | 경화성 수지 조성물 |
| JP6764526B2 (ja) * | 2017-03-31 | 2020-09-30 | リンテック株式会社 | 粘着シート |
| JP6961387B2 (ja) * | 2017-05-19 | 2021-11-05 | 日東電工株式会社 | ダイシングダイボンドフィルム |
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| WO2020196757A1 (ja) | 2020-10-01 |
| CN113825635A (zh) | 2021-12-21 |
| KR20210148105A (ko) | 2021-12-07 |
| JPWO2020196757A1 (ko) | 2020-10-01 |
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