TW202041646A - 研磨方法及組成調整劑 - Google Patents

研磨方法及組成調整劑 Download PDF

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Publication number
TW202041646A
TW202041646A TW109122108A TW109122108A TW202041646A TW 202041646 A TW202041646 A TW 202041646A TW 109122108 A TW109122108 A TW 109122108A TW 109122108 A TW109122108 A TW 109122108A TW 202041646 A TW202041646 A TW 202041646A
Authority
TW
Taiwan
Prior art keywords
polishing
composition
water
polishing composition
soluble polymer
Prior art date
Application number
TW109122108A
Other languages
English (en)
Chinese (zh)
Inventor
織田博之
高見信一郎
髙橋修平
田畑誠
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202041646A publication Critical patent/TW202041646A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW109122108A 2015-05-22 2016-05-19 研磨方法及組成調整劑 TW202041646A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-104552 2015-05-22
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Publications (1)

Publication Number Publication Date
TW202041646A true TW202041646A (zh) 2020-11-16

Family

ID=57392757

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109122108A TW202041646A (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑
TW105115551A TWI758249B (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105115551A TWI758249B (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Country Status (4)

Country Link
JP (1) JP6174625B2 (ja)
KR (1) KR102574629B1 (ja)
TW (2) TW202041646A (ja)
WO (1) WO2016190128A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019142292A1 (ja) * 2018-01-18 2019-07-25 日立化成株式会社 研磨液、研磨液セット及び研磨方法
US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
JP7237933B2 (ja) * 2018-03-28 2023-03-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP7253335B2 (ja) * 2018-07-31 2023-04-06 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法
TWI794474B (zh) * 2019-04-15 2023-03-01 日商昭和電工材料股份有限公司 研磨液、研磨液套組及研磨方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598607U (ja) 1978-12-28 1980-07-09
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP5760403B2 (ja) * 2010-11-24 2015-08-12 株式会社Sumco 薬液リサイクル方法および該方法に用いる装置
DE112012000575B4 (de) * 2011-01-26 2022-05-25 Fujimi Incorporated Polierzusammensetzung, Polierverfahren unter Verwendung derselben und Substrat-Herstellungsverfahren
JP5656960B2 (ja) * 2012-11-14 2015-01-21 株式会社フジミインコーポレーテッド Ｌｐｄ低減剤及びそれを用いたシリコンウエハの欠陥低減方法
JP5843036B1 (ja) * 2015-06-23 2016-01-13 コニカミノルタ株式会社 再生研磨材スラリーの調製方法

Also Published As

Publication number Publication date
WO2016190128A1 (ja) 2016-12-01
JP6174625B2 (ja) 2017-08-02
JP2016215336A (ja) 2016-12-22
TWI758249B (zh) 2022-03-21
KR20180011046A (ko) 2018-01-31
KR102574629B1 (ko) 2023-09-06
TW201710458A (zh) 2017-03-16

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