TW202036775A - Sheet affixation method - Google Patents
Sheet affixation method Download PDFInfo
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- TW202036775A TW202036775A TW108134268A TW108134268A TW202036775A TW 202036775 A TW202036775 A TW 202036775A TW 108134268 A TW108134268 A TW 108134268A TW 108134268 A TW108134268 A TW 108134268A TW 202036775 A TW202036775 A TW 202036775A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C1/00—Labelling flat essentially-rigid surfaces
- B65C1/04—Affixing labels, e.g. wrap-around labels, to two or more flat surfaces of a polyhedral article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1865—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip
- B65C9/1869—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip and being transferred directly from the backing strip onto the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/20—Gluing the labels or articles
- B65C9/24—Gluing the labels or articles by heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/26—Devices for applying labels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Labeling Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Die Bonding (AREA)
Abstract
Description
本發明係關於一種片貼附方法。The invention relates to a method for attaching a sheet.
以往已知有形成被接著體經由第一片以及第二片支持於框架構件之一體物的片貼附方法(例如參照專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there is known a sheet attaching method in which an adherend is formed to be supported by a body of a frame member via a first sheet and a second sheet (for example, refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]
專利文獻1:日本特開2007-165363號公報。Patent Document 1: JP 2007-165363 A.
(發明所欲解決之課題)(The problem to be solved by the invention)
然而,專利文獻1所記載之以往之貼裝方法(片貼附方法)中,若採用藉由賦予預定之能量而伴隨收縮變形或膨脹變形等預定之變形變化為預定之狀態者作為晶粒結著片部DS(第一片),則產生下述不良狀況:形成晶圓W(被接著體)經由第一片以及切割帶DT(第二片)支持於環狀框架RF(框架構件)之一體物,為了使前述第一片變化為預定之狀態而賦予預定之能量,由此如圖1中的(C)所示,因第一片之變形導致於第二片產生皺褶WV之變形。However, in the conventional mounting method (sheet attaching method) described in Patent Document 1, if a predetermined state is changed to a predetermined state due to a predetermined deformation such as shrinkage deformation or expansion deformation by applying predetermined energy as the crystal grain structure On the landing part DS (first sheet), the following problem occurs: the formed wafer W (subsequent body) is supported by the ring frame RF (frame member) via the first sheet and the dicing tape DT (second sheet) The one body is given a predetermined energy in order to change the first sheet to a predetermined state. As shown in Figure 1 (C), the deformation of the first sheet causes the wrinkles WV to be deformed in the second sheet. .
本發明之目的在於提供一種片貼附方法,前述片貼附方法即便採用藉由賦予預定之能量而伴隨預定之變形變化為預定之狀態者作為第一片,形成被接著體經由第一片以及第二片支持於框架構件之一體物,為了使前述第一片變化為預定之狀態而賦予預定之能量,亦不會於第二片形成皺褶。 (用以解決課題的手段)The object of the present invention is to provide a sheet attaching method. Even if the sheet attaching method adopts the first sheet as the first sheet by applying a predetermined energy and changing into a predetermined state with a predetermined deformation, the adhered body is formed through the first sheet and The second sheet is supported by a body of the frame member, and is given a predetermined energy in order to change the aforementioned first sheet to a predetermined state, and no wrinkles are formed in the second sheet. (Means to solve the problem)
本發明採用申請專利範圍中所記載之構成。 (發明功效)The present invention adopts the composition described in the scope of the patent application. (Invention effect)
根據本發明,考慮到賦予預定之能量而第一片發生預定之變形,於第一片準備步驟中,準備不從被接著體之一面伸出之形狀之第一片,於第一貼附步驟中,於第一片不從被接著體之一面伸出之方式,於前述被接著體之一面貼附第一片,故而即便採用藉由賦予預定之能量而伴隨預定之變形變化為預定之狀態者作為第一片,形成被接著體經由第一片以及第二片支持於框架構件之一體物,即便為了使前述第一片變化為預定之狀態而賦予預定之能量,亦不會於第二片形成皺褶。According to the present invention, in consideration of the predetermined deformation of the first sheet due to the application of predetermined energy, in the first sheet preparation step, prepare the first sheet in a shape that does not protrude from one surface of the bonded body, and perform the first attaching step In the method, the first sheet does not protrude from one surface of the adhered body, and the first sheet is attached to one surface of the adhered body, so even if the predetermined energy is applied, the predetermined deformation is changed to a predetermined state As the first sheet, the adhered body is supported by the frame member via the first sheet and the second sheet. Even if a predetermined energy is applied to change the first sheet to a predetermined state, it will not be Sheets form wrinkles.
以下,基於圖式對本發明之實施形態進行說明。 再者,本實施形態中之X軸、Y軸、Z軸處於分別正交之關係,X軸以及Y軸係設為預定平面內之軸,Z軸係設為與前述預定平面正交之軸。進而,本實施形態中,以自與Y軸平行之圖1中近前方向觀看之情形為基準,於未指定圖而表示方向之情形時,「上」為Z軸之箭頭方向且「下」為前述Z軸之箭頭方向之相反方向,「左」為X軸之箭頭方向且「右」為前述X軸之箭頭方向之相反方向,「前」為與Y軸平行之圖1中近前方向且「後」為前述近前方向之相反方向。Hereinafter, an embodiment of the present invention will be described based on the drawings. Furthermore, the X-axis, Y-axis, and Z-axis in this embodiment are in the relationship of being orthogonal respectively, the X-axis and Y-axis are set as the axes in the predetermined plane, and the Z-axis is set as the axis perpendicular to the predetermined plane. . Furthermore, in the present embodiment, the view from the front direction in FIG. 1 parallel to the Y axis is used as a reference. When the direction is shown without specifying the figure, "up" is the arrow direction of the Z axis and "down" is The direction opposite to the direction of the arrow of the aforementioned Z axis, "Left" is the direction of the arrow of the X axis and "Right" is the opposite direction of the arrow of the aforementioned X axis, "Front" is the forward direction in Figure 1 parallel to the Y axis and " "Back" is the opposite direction of the aforementioned front direction.
本發明之片貼附方法例如可藉由以下之片貼附裝置EA而實施。
亦即,片貼附裝置EA係具備:第一貼附機構10,實施第一片準備步驟,並且實施第一貼附步驟,前述第一片準備步驟準備藉由賦予有作為預定之能量之熱而變化亦即硬化為預定之狀態的第一片AS1,前述第一貼附步驟於被接著體WK之一面WK1貼附第一片AS1;第二貼附機構20,實施準備第二片AS2之第二片準備步驟,並且實施第二貼附步驟,前述第二貼附步驟於貼附於被接著體WK之第一片AS1以及作為框架構件之環狀框架RF貼附第二片AS2,形成被接著體WK經由第一片AS1以及第二片AS2支持於環狀框架RF之一體物UP;以及能量賦予機構30,實施對一體物UP賦予熱而使第一片AS1硬化之能量賦予步驟;並且,片貼附裝置EA配置於搬運機構40之附近,前述搬運機構40實施搬送被接著體WK以及環狀框架RF之搬運步驟。
再者,對於第一片AS1係採用藉由賦予熱而伴隨預定之變形亦即伴隨收縮變形而硬化之物。
另外,設被接著體WK具備不與第一片AS1之收縮變形一併變形之剛性。所謂剛性係指對於壓縮、摩擦、扭轉等外力的物體之不易變形之性質。The sheet attaching method of the present invention can be implemented by the following sheet attaching device EA, for example.
That is, the sheet attaching device EA is provided with: a
第一貼附機構10實施第一切斷步驟作為第一片準備步驟,前述第一切斷步驟使用於第一剝離片RL1暫時黏附有第一片基材BS1之第一原片RS1,於前述第一片基材BS1形成閉環狀之第一切口CU1,於由前述第一切口CU1所隔開之區域形成第一片AS1而準備前述第一片AS1,並且於前述第一片AS1以外之區域形成第一無用片US1。
亦即,第一貼附機構10係具備:支持輥11,支持第一原片RS1;導引輥12,引導第一原片RS1;切斷機構13,於第一片基材BS1形成第一切口CU1;剝離輥14,供繞掛第一無用片US1;作為回收機構之無用片回收輥15,於進行片貼附裝置EA之自動運轉之期間中,對存在於與剝離輥14之間的第一無用片US1一直賦予預定之張力,從而回收前述第一無用片US1;作為剝離機構之剝離板16,利用剝離緣16A使第一剝離片RL1折回,自前述第一剝離片RL1剝離第一片AS1;作為按壓機構之按壓輥17,於被接著體WK之一面WK1按壓並貼附第一片AS1;驅動輥18,支持於作為驅動機器之旋動馬達18A之未圖示之輸出軸,與夾送輥(pinch roller)18B夾持第一剝離片RL1;作為回收機構之回收輥19,支持於未圖示之驅動機器之輸出軸,於進行片貼附裝置EA之自動運轉之期間,對存在於與夾送輥18B之間的第一剝離片RL1一直賦予預定之張力,從而回收前述第一剝離片RL1;以及作為驅動機器之未圖示之直線運動馬達,使前述第一貼附機構10整體沿前後方向移動。
切斷機構13係具備:模切輥13C,支持於作為驅動機器之旋動馬達13A之輸出軸13B;平環狀之作為切斷構件之切斷刀13E,支持於前述模切輥13C之圓周面13D;以及支承輥13F,與模切輥13C同步旋轉。The
第二貼附機構20實施第二切斷步驟作為第二片準備步驟,前述第二切斷步驟使用於第二剝離片RL2暫時黏附有第二片基材BS2之第二原片RS2,於前述第二片基材BS2形成閉環狀之第二切口CU2,於由前述第二切口CU2所隔開之區域形成第二片AS2而準備前述第二片AS2,並且於前述第二片AS2以外之區域形成第二無用片US2。
亦即,第二貼附機構20係具備:支持輥21,支持第二原片RS2;導引輥22,引導第二原片RS2;切斷機構23,於第二片基材BS2形成第二切口CU2;剝離輥24,供繞掛第二無用片US2;作為回收機構之無用片回收輥25,於進行片貼附裝置EA之自動運轉之期間中,對存在於與剝離輥24之間的第二無用片US2一直賦予預定之張力,從而回收前述第二無用片US2;作為剝離機構之剝離板26,利用剝離緣26A使第二剝離片RL2折回,且從前述第二剝離片RL2剝離第二片AS2;作為按壓機構之按壓輥27,於貼附於被接著體WK之第一片AS1以及環狀框架RF按壓並貼附第二片AS2;驅動輥28,支持於作為驅動機器之旋動馬達28A之未圖示之輸出軸,與夾送輥28B夾持第二剝離片RL2;以及作為回收機構之回收輥29,支持於未圖示之驅動機器之輸出軸,於進行片貼附裝置EA之自動運轉之期間,對存在於與夾送輥28B之間的第二剝離片RL2一直賦予預定之張力,從而回收前述第二剝離片RL2。
切斷機構23係具備:模切輥23C,支持於作為驅動機器之旋動馬達23A之輸出軸23B;平環狀之作為切斷構件之切斷刀23E,支持於前述模切輥23C之圓周面23D;以及支承輥23F,與模切輥23C同步旋轉。The
能量賦予機構30係具備:本體箱31,可收納複數個一體物UP;箱蓋32,支持於作為驅動機器之直線運動馬達32A之輸出軸32B,且可開閉本體箱31之開口部31A;以及作為能量產生源之線圈加熱器或熱管之加熱側等加熱機構33,分別支持於本體箱31之底面31B以及箱蓋32之頂面32C。The energy imparting
搬運機構40係具備:保持台42,支持於作為驅動機器之線性馬達41之滑塊41A,具有藉由減壓泵或真空噴射器等未圖示之減壓機構(保持機構)而可進行吸附保持之保持面42A。The
對藉由以上之片貼附裝置EA所實施的本發明之片貼附方法進行說明。
首先,對於在圖1中的(A)中實線所示之初始位置配置有各構件之片貼附裝置EA,前述片貼附裝置EA之使用者(以下簡稱為「使用者」)如前述圖般設置第一原片RS1、第二原片RS2後,經由操作面板或個人電腦等未圖示之操作機構輸入運轉開始之訊號。於是,第一貼附機構10、第二貼附機構20驅動旋動馬達13A、18A以及旋動馬達23A、28A,使模切輥13C、23C旋轉而於第一片基材BS1、第二片基材BS2形成第一切口CU1、第二切口CU2,一邊形成第一片AS1、第二片AS2以及第一無用片US1、第二無用片US2,一邊抽出第一原片RS1、第二原片RS2。The sheet attaching method of the present invention implemented by the above sheet attaching device EA will be described.
First of all, for the sheet attaching device EA with each member arranged at the initial position shown by the solid line in Fig. 1 (A), the user of the sheet attaching device EA (hereinafter referred to as "user") is as described above After the first original film RS1 and the second original film RS2 are set as shown in the figure, a signal to start operation is input through an operating mechanism not shown such as an operating panel or a personal computer. Then, the
此處,於第一片準備步驟中,考慮到藉由在能量賦予步驟中賦予熱而第一片AS1發生收縮變形,而形成不從被接著體WK之一面WK1伸出之形狀之第一片AS1並準備前述第一片AS1(以下亦相同)。具體而言,於從被接著體WK之一面WK1伸出之形狀之第一片AS1之情形時,預測於藉由能量賦予機構30賦予熱時,如圖1(C)所示,由於第一片AS1之收縮變形而於第二片AS2形成皺褶WV。因此,於本實施形態中,於被接著體WK之一面WK1為直徑300mm之圓形狀之情形時,第一貼附機構10形成直徑299mm之圓形狀之第一片AS1。繼而,如圖1中的(A)所示,若開頭之第一片AS1、第二片AS2之抽出方向前端部由剝離板16、26之剝離緣16A、26A剝離預定長度,則第一貼附機構10、第二貼附機構20停止旋動馬達13A、18A以及旋動馬達23A、28A之驅動。Here, in the first sheet preparation step, it is considered that the first sheet AS1 shrinks and deforms by applying heat in the energy application step, and the first sheet is formed into a shape that does not protrude from one surface WK1 of the adhered body WK AS1 prepares the aforementioned first piece AS1 (the same applies to the following). Specifically, in the case of the first sheet AS1 of the shape extending from one surface WK1 of the adherend WK, it is predicted that when heat is applied by the
然後,如圖1所示,若使用者或多關節機械手臂或者帶式輸送機等未圖示之搬送機構以於環狀框架RF之開口部RF1內配置有被接著體WK之方式將前述環狀框架RF以及被接著體WK等載置於保持台42上後,則搬運機構40驅動未圖示之減壓機構,開始於保持面42A的環狀框架RF以及被接著體WK之吸附保持。繼而,若搬運機構40驅動線性馬達41,使保持台42向左方移動而被接著體WK到達相對於剝離板16之預定之位置時,則第一貼附機構10驅動旋動馬達13A、18A,一邊於第一片基材BS1形成新的切口CU1,一邊配合保持台42之移動速度而抽出第一原片RS1。藉此,如圖1中二點鏈線所示,第一片AS1從第一剝離片RL1剝離,從前述第一剝離片RL1剝離出之第一片AS1由按壓輥17按壓並貼附於被接著體WK。Then, as shown in FIG. 1, if a user, a multi-joint robot arm or a conveyor mechanism not shown, such as a belt conveyor, arranges the bonded body WK in the opening RF1 of the ring frame RF. After the frame RF and the adhered body WK are placed on the holding table 42, the
此處,第一貼附步驟中,考慮到藉由在能量賦予步驟中賦予熱而第一片AS1發生收縮變形,而以不從被接著體WK之一面WK1伸出之方式,於前述被接著體WK之一面WK1貼附第一片AS1。具體而言,若以第一片AS1從被接著體WK之一面WK1伸出之狀態貼附,則預測於利用能量賦予機構30賦予熱時,如圖1中的(C)所示,因第一片AS1之收縮變形導致於第二片AS2形成皺褶WV。因此,於本實施形態中,對於直徑300mm之圓形狀之一面WK1,以直徑299mm之圓形狀之第一片AS1之外緣位於前述一面WK1的距外緣位置0mm至1mm之範圍內之方式,將前述第一片AS1貼附於被接著體WK之一面WK1。此時,第一貼附機構10驅動未圖示之直線運動馬達,使前述第一貼附機構10整體沿前後方向移動,且進行第一片AS1相對於被接著體WK之一面WK1的前後方向之位置調整,並且對於正向左方移動之保持台42,調整旋動馬達13A、18A之驅動開始時序,進行第一片AS1相對於被接著體WK之一面WK1的左右方向之位置調整。繼而,若繼開頭之第一片AS1之後的下個第一片AS1之抽出方向前端部以剝離板16之剝離緣16A剝離預定長度後,則第一貼附機構10停止旋動馬達13A、18A之驅動。Here, in the first attaching step, considering that the first sheet AS1 shrinks and deforms by applying heat in the energy application step, it is adhered as described above so as not to protrude from one surface WK1 of the adhered body WK. One side WK1 of the body WK is attached to the first piece AS1. Specifically, if the first sheet AS1 is attached in a state where it protrudes from one surface WK1 of the adherend WK, it is predicted that when heat is applied by the
接下來,若繼續藉由搬運機構40使保持台42向左方移動,環狀框架RF到達相對於剝離板26之預定之位置時,則第二貼附機構20驅動旋動馬達23A、28A,一邊於第二片基材BS2形成新的第二切口CU2,一邊配合保持台42之移動速度而抽出第二原片RS2。藉此,如圖1中二點鏈線所示,第二片AS2從第二剝離片RL2剝離,從前述第二剝離片RL2剝離出之第二片AS2由按壓輥27按壓並貼附於環狀框架RF以及第一片AS1,從而形成一體物UP。然後,若繼開頭之第二片AS2之後的下個第二片AS2之抽出方向前端部以剝離板26之剝離緣26A剝離預定長度時,則第二貼附機構20停止旋動馬達23A、28A之驅動。Next, if the holding table 42 continues to move to the left by the
接下來,若於環狀框架RF以及第一片AS1貼附有第二片AS2整體,支持有一體物UP之保持台42到達按壓輥27之左方預定位置時,則搬運機構40停止線性馬達41之驅動後,停止未圖示之減壓機構之驅動,從而解除於保持面42A的環狀框架RF以及被接著體WK之吸附保持。而且,使用者或未圖示之搬送機構保持一體物UP,將前述一體物UP收納於本體箱31內後,搬運機構40驅動線性馬達41,使保持台42回到初始位置。接下來,重複上述動作而將預定數量之一體物UP收納於本體箱31內時,則能量賦予機構30驅動直線運動馬達32A,如圖1中的(B)所示,利用箱蓋32封閉本體箱31的開口部31A。然後,能量賦予機構30驅動加熱機構33,以預定溫度之預定時間對一體物UP賦予熱,經過前述預定時間後,則在停止加熱機構33之驅動後,驅動直線運動馬達32A,且解放本體箱31之開口部31A。Next, when the entire second sheet AS2 is attached to the ring frame RF and the first sheet AS1, and the holding table 42 supporting the integrated object UP reaches a predetermined position to the left of the
此處,第一片AS1係以預定溫度被賦予有預定時間之熱而硬化。具體而言,約3GPa(千兆帕)之硬化前之彈性率於硬化後變化為約10GPa之彈性率。此時,第一片AS1欲伴隨收縮變形而硬化,但由於被接著體WK具備不與第一片AS1之收縮變形一併變形的剛性,故而前述第一片AS1之收縮變形因被接著體WK之剛性而受到阻止,未於第二片AS2形成皺褶WV。接下來,使用者或未圖示之搬送機構取出收納於本體箱31內之一體物UP,將前述等一體物UP搬送至下一步驟,以後重複上述相同之動作。Here, the first sheet AS1 is cured by being given heat for a predetermined time at a predetermined temperature. Specifically, the elastic modulus of about 3 GPa (Giga Pascals) before curing changes to an elastic modulus of about 10 GPa after curing. At this time, the first sheet AS1 intends to harden with shrinkage deformation, but since the adhered body WK has rigidity that does not deform together with the shrinkage deformation of the first sheet AS1, the shrinkage deformation of the first sheet AS1 is due to the adhered body WK The rigidity is prevented, and the wrinkle WV is not formed in the second sheet AS2. Next, the user or a transport mechanism not shown in the figure takes out an object UP stored in the
根據以上所述之實施形態,考慮到賦予熱而第一片AS1發生收縮變形,於第一片準備步驟中,準備不從被接著體WK之一面WK1伸出之形狀之第一片AS1,於第一貼附步驟中,由於是以第一片AS1不從被接著體WK之一面WK1伸出之方式,於前述被接著體WK之一面WK1貼附第一片AS1,故而即便採用藉由賦予熱而伴隨收縮變形而硬化者作為第一片AS1,形成被接著體WK經由第一片AS1以及第二片AS2支持於環狀框架RF之一體物UP,即使為了使前述第一片AS1硬化而賦予熱,亦不會於第二片AS2形成皺褶。According to the embodiment described above, considering that heat is applied and the first sheet AS1 shrinks and deforms, in the first sheet preparation step, prepare the first sheet AS1 in a shape that does not protrude from one surface WK1 of the bonded body WK. In the first attaching step, since the first piece AS1 does not protrude from one side WK1 of the adhered body WK, the first piece AS1 is attached to one side WK1 of the adhered body WK, so even if the The first sheet AS1 that is hardened due to shrinkage and deformation by heat is formed as a body UP supported by the bonded body WK via the first sheet AS1 and the second sheet AS2 on the ring frame RF, even if it is used to harden the first sheet AS1 It imparts heat without forming wrinkles on the second sheet AS2.
本發明中之機構以及步驟只要可實現對前述等機構以及步驟所說明之動作、功能或步驟,則並無任何限定,而且完全不限定於前述實施形態所示之簡單的一實施形態之構成物或步驟。例如,能量賦予步驟只要為可對一體物賦予能量而使第一片變化為預定之狀態之步驟,只要對照申請當初之技術常識而為其技術範圍內,則並無任何限定(其他機構以及步驟亦相同)。The mechanisms and steps in the present invention are not limited in any way as long as they can realize the actions, functions, or steps described in the foregoing mechanisms and steps, and are not limited to the simple embodiment shown in the foregoing embodiment at all. Or steps. For example, as long as the energy imparting step is a step that can impart energy to the whole body and change the first piece to a predetermined state, as long as it is within the technical scope based on the technical common sense at the time of the application, there is no limit (other institutions and steps) The same is true).
於第一貼附步驟以及第二貼附步驟中,亦可不從第一剝離片RL1以及第二剝離片RL2剝離第一無用片US1以及第二無用片US2,於支持第一片AS1以及第二片AS2時,亦可不將前述第一片AS1以及第二片AS2捲繞而例如以扇折式(fanfold)折疊之狀態支持,於回收第一剝離片RL1以及第二剝離片RL2時,亦可不進行捲繞而例如進行扇折式折疊或以撕碎機等(shredder)切碎並回收,亦可不進行捲繞或扇折式折疊而簡單地聚集並回收,亦可藉由於第一片基材BS1以及第二片基材BS2形成短條寬度方向整體之第一切口CU1以及第二切口CU2,而將由前述第一切口CU1以及第二切口CU2所隔開之區域設為第一片AS1以及第二片AS2,將其他區域設為第一無用片US1以及第二無用片US2,亦可不使第一原片RS1以及第二原片RS2移動或一邊移動一邊使切斷構件移動,而於第一片基材BS1以及第二片基材BS2形成第一切口CU1以及第二切口CU2。第一貼附步驟以及第二貼附步驟中,例如亦可採用與第一片基材BS1以及第二片基材BS2遠離接近之作為切斷構件之所謂平刀,亦可採用對模切輥13C、23C可裝卸或無法裝卸之切斷刀13E、23E,亦可使按壓輥17以及按壓輥27遠離接近被接著體WK,從而防止對被接著體WK施加應力或損傷,亦可代替按壓輥17、27,而利用支持於作為驅動機器之直線運動馬達之輸出軸且藉由減壓泵或真空噴射器等未圖示之減壓機構而可進行吸附保持之保持構件來保持第一片AS1以及第二片AS2,並將由前述保持構件所保持之第一片AS1以及第二片AS2按壓並貼附於被接著體WK。
於第一貼附步驟中,亦可利用相機或者投影機等攝像機構、或光學感測器或者超音波感測器等各種感測器等檢測機構,來檢測正向左方移動之被接著體WK之一面WK1之位置、以及所抽出之第一片AS1之位置,並基於前述檢測機構之檢測結果,第一貼附機構10驅動未圖示之直線運動馬達,並且調整旋動馬達13A、18A之驅動開始時序,以不從被接著體WK之一面WK1伸出之方式貼附第一片AS1。再者,於正向左方移動之被接著體WK之一面WK1之位置固定之情形時,檢測機構亦可不檢測前述被接著體WK之一面WK1之位置,於抽出之第一片AS1之位置固定之情形時,檢測機構亦可不檢測前述第一片AS1之位置,於正向左方移動之被接著體WK之其中一面WK1之位置、以及抽出之第一片AS1之位置固定之情形時,檢測機構亦可不檢測前述被接著體WK之一面WK1之位置、以及第一片AS1之位置。In the first attaching step and the second attaching step, the first useless sheet US1 and the second useless sheet US2 may not be peeled off from the first peeling sheet RL1 and the second peeling sheet RL2 to support the first sheet AS1 and the second sheet. For the sheet AS2, the first sheet AS1 and the second sheet AS2 may not be wound, but may be supported in a fanfold folded state, for example, when the first peeling sheet RL1 and the second peeling sheet RL2 are recovered, it may not be For winding, such as fan-folding or shredder shredder and recycling, it is also possible to simply gather and recycle without winding or fan-folding, or by using the first substrate BS1 and the second substrate BS2 form a first slit CU1 and a second slit CU2 in the overall width direction of the short strip, and the area separated by the first slit CU1 and the second slit CU2 is referred to as the first sheet AS1 And the second piece AS2, the other areas are set as the first unnecessary piece US1 and the second unnecessary piece US2, and the first original piece RS1 and the second original piece RS2 may not be moved or the cutting member may be moved while moving. The first substrate BS1 and the second substrate BS2 form a first cut CU1 and a second cut CU2. In the first attaching step and the second attaching step, for example, a so-called flat knife, which is far and close to the first substrate BS1 and the second substrate BS2, can be used as a cutting member, or a pair of die cutting rolls 13C, 23C The
第一片準備步驟亦可不由第一貼附機構10實施,例如亦可採用於第一剝離片RL1預先暫時黏附有預定形狀之第一片AS1之第一原片RS1,於前述情形時,第一切斷步驟亦可不實施。再者,於前述情形時,考慮到藉由在能量賦予步驟中賦予熱而第一片AS1發生收縮變形,而準備不從被接著體WK之一面WK1伸出之形狀之第一片AS1。
第二片準備步驟亦可不由第二貼附機構20實施,例如亦可採用於第二剝離片RL2預先暫時黏附有預定形狀之第二片AS2之第二原片RS2,於前述情形時,第二切斷步驟亦可不實施。The first sheet preparation step may not be performed by the first attaching
能量賦予步驟可由一個或三個以上之能量產生源實施,亦可利用並無本體箱31或箱蓋32實施。於能量賦予步驟中,可利用能量產生源對第一片AS1局部地賦予能量,使前述能量產生源與第一片AS1相對移動而對前述第一片AS1整體賦予能量,亦可對第一片AS1整體一次性賦予能量。於能量賦予步驟中,對第一片AS1照射能量之時間或能量之量可考慮前述第一片AS1之特性、特質、性質、材質、組成以及構成等而任意決定。能量賦予步驟亦可使用賦予紫外線、紅外線、可見光線、音波、X射線或γ射線等電磁波或者熱水或熱風等之熱作為預定之能量、或者賦予冷水或冷風等負熱而實施,可考慮第一片AS1之特性、特質、性質、材質、組成以及構成等而任意地決定預定之能量。於能量賦予步驟中,亦可使用聚光板或收集板等集中機構對第一片AS1集中賦予預定之能量,亦可利用LED(Light Emitting Diode;發光二極體)燈、高壓水銀燈、低壓水銀燈、金屬鹵化物燈、氙燈、鹵素燈等以任何方式產生能量而對第一片AS1進行賦予,亦可將前述LED燈、高壓水銀燈、低壓水銀燈、金屬鹵化物燈、氙燈以及鹵素燈等適當組合產生能量而對第一片AS1賦予。於藉由其他裝置實施能量賦予步驟之情形時,於本發明之片貼附方法中亦可不實施能量賦予步驟。The energy imparting step can be implemented by one or more than three energy generation sources, and can also be implemented by using the
於搬運步驟中,亦可不使被接著體WK移動或一邊移動一邊使第一貼附機構10以及第二貼附機構20移動而於前述被接著體WK貼附第一片AS1以及第二片AS2,或亦可不利用保持台42吸附保持被接著體WK或環狀框架RF等。於藉由其他裝置實施搬送步驟之情形時,於本發明之片貼附方法中亦可不實施搬運步驟。In the transport step, the first sheet AS1 and the second sheet AS2 may be attached to the adherend WK without moving the adherend WK or move the first attaching
被接著體WK之一面WK1之形狀可為300mm以上之圓形狀,亦可為小於300mm之圓形狀。關於第一片準備步驟中準備之第一片AS1之形狀,例如對於直徑300mm之圓形狀之被接著體WK之一面WK1,可為直徑300mm之圓形狀,亦可為直徑299.5mm或280mm等直徑300mm以下之圓形狀,亦可為三角形或四角形以上之多角形、橢圓形等圓形狀以外之形狀。 被接著體WK之一面WK1之形狀亦可為三角形或四角形以上之多角形、橢圓形等圓形以外之形狀。對於具有此種一面WK1之被接著體WK準備的第一片AS1之形狀亦可為三角形或四角形以上之多角形、橢圓形等圓形以外之形狀。例如,可對四角形之一面WK1準備橢圓形之第一片AS1,或亦可對橢圓形之一面WK1準備五角形之第一片AS1。 所謂由賦予能量所致的第一片AS1之預定之變形,可為膨脹變形、擴大變形、收縮變形、縮小變形、蜿蜒變形、應變變形等任何之變形。 所謂由賦予能量所致的第一片AS1之向預定之狀態的變化,例如可進行前述第一片之硬度或強度增加或降低之變化、前述第一片之容積或體積增加或減少之變化、前述第一片對被接著體之接著力增加或降低之變化、前述第一片之色彩改變之變化、前述第一片之溫度上升或降低之變化、前述第一片軟化或熔融之變化等任何之變化。 作為藉由賦予能量而伴隨預定之變形變化為預定之狀態的第一片之例,雖例如可例示:藉由賦予作為預定之能量之熱或紅外線,而伴隨膨脹變形或擴大變形等而體積增加之物;或藉由賦予作為預定之能量之冷氣或冷媒,而伴隨收縮變形或縮小變形等而體積減少之物;或藉由賦予作為預定之能量之紫外線,而伴隨膨脹變形、收縮變形、擴大變形、縮小變形、蜿蜒變形或應變變形等而對被接著體之接著力降低或色彩褪色之物;或藉由賦予作為預定之能量之紅外線或超音波,而伴隨膨脹變形或擴大變形等而溫度上升或軟化之物等,但第一片只要被賦予有能量而伴隨預定之變形變化為預定之狀態,則可為任何之物。 框架構件可為環狀,亦可不為環狀,可為任何形狀。 本發明之片貼附方法亦可藉由片貼附裝置EA以外之裝置或人手而實施。The shape of one surface WK1 of the adherend WK can be a round shape of 300 mm or more, or a round shape of less than 300 mm. Regarding the shape of the first sheet AS1 prepared in the first sheet preparation step, for example, for a round shape with a diameter of 300mm, one surface WK1 of the bonded body WK can be a round shape with a diameter of 300mm, or a diameter such as 299.5mm or 280mm. The round shape of 300mm or less can also be a shape other than a round shape such as a triangle, a polygonal shape of a square or more, an oval shape, etc. The shape of one surface WK1 of the bonded body WK may also be a shape other than a circle such as a triangle, a polygon of a quadrangle or more, or an ellipse. The shape of the first sheet AS1 prepared for the adherend WK having such one side WK1 may also be a shape other than a circle such as a triangle, a polygon of a quadrangle or more, and an ellipse. For example, the first elliptical piece AS1 may be prepared for one side WK1 of the quadrangular shape, or the first pentagonal piece AS1 may be prepared for one side WK1 of the ellipse. The predetermined deformation of the first sheet AS1 caused by the application of energy can be any deformation such as expansion deformation, expansion deformation, contraction deformation, contraction deformation, meandering deformation, and strain deformation. The so-called change of the first sheet AS1 to a predetermined state caused by the application of energy can be, for example, the change of increasing or decreasing the hardness or strength of the aforementioned first sheet, the change of increasing or decreasing the volume or volume of the aforementioned first sheet, Changes in the increase or decrease of the adhesion of the first sheet to the adherend, changes in the color of the first sheet, changes in the temperature rise or fall of the first sheet, changes in the softening or melting of the first sheet, etc. The change. As an example of the first sheet that changes to a predetermined state due to a predetermined deformation by applying energy, for example, it is exemplified that by applying heat or infrared rays as predetermined energy, the volume increases due to expansion deformation or expansion deformation, etc. The thing; or by the application of air-conditioning or refrigerant as a predetermined energy, the volume is reduced with shrinkage deformation or shrinking deformation, etc.; or by the application of ultraviolet rays as predetermined energy, which is accompanied by expansion, deformation, shrinkage and expansion Deformation, shrinkage deformation, meandering deformation or strain deformation, etc., which reduce the adhesion to the adherend or the color fades; or by giving predetermined energy infrared or ultrasonic waves, accompanied by expansion deformation or expansion deformation, etc. The temperature rises or softens, but the first sheet can be anything as long as it is given energy and changes to a predetermined state with a predetermined deformation. The frame member may be ring-shaped or not, and may have any shape. The sheet attaching method of the present invention can also be implemented by a device other than the sheet attaching device EA or manually.
本發明中之第一片AS1、第二片AS2以及被接著體WK之材質、類別、形狀等並無特別限定。例如,第一片AS1以及第二片AS2亦可為感壓接著性、感熱接著性等接著形態之物,於感熱接著性之第一片AS1以及第二片AS2之情形時,只要利用設置對前述第一片AS1以及前述第二片AS2進行加熱的適當之線圈加熱器或熱管之加熱側等加熱機構的適當方法進行接著即可。另外,此種第一片AS1以及第二片AS2例如亦可為僅接著劑層之單層之物、於基材與接著劑層之間具有中間層之物、於基材之上表面具有蓋層等三層以上之物、進而可將基材從接著劑層剝離之所謂雙面接著片之類者,雙面接著片亦可為具有單層或複數層之中間層之物、或並無中間層之單層或複數層之物。另外,作為被接著體WK,例如可為食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等半導體晶圓、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等之單體物,亦可為由前述等之兩個以上所形成之複合物,任意形態之構件或物品等亦可設為對象。再者,第一片AS1以及第二片AS2亦可換成帶有功能性、用途性之稱謂者,例如亦可稱為資訊記載用標籤、裝飾用標籤、保護片、切割帶、晶粒接合膜(die attach film)、黏晶帶、記錄層形成樹脂片等任意之片、膜、帶等。The material, type, shape, etc. of the first sheet AS1, the second sheet AS2, and the adherend WK in the present invention are not particularly limited. For example, the first sheet AS1 and the second sheet AS2 can also be pressure-sensitive adhesive, heat-sensitive adhesive and other adhesive forms. In the case of the first sheet AS1 and the second sheet AS2 with thermal adhesive, just use the setting pair The first sheet AS1 and the second sheet AS2 may be heated by an appropriate method of heating mechanism such as an appropriate coil heater or the heating side of the heat pipe. In addition, the first sheet AS1 and the second sheet AS2 may be, for example, a single layer of only the adhesive layer, a thing with an intermediate layer between the substrate and the adhesive layer, and a cover on the upper surface of the substrate. Layers and other three or more layers, and the so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. The double-sided adhesive sheet may have a single-layer or multiple-layer intermediate layer, or none Single layer or multiple layers in the middle layer. In addition, as the adherend WK, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, ceramics, wood boards, resins, etc. The single substance may also be a composite formed by two or more of the foregoing, and any form of member or article may also be targeted. Furthermore, the first sheet AS1 and the second sheet AS2 can also be replaced with functional and useful titles, such as labels for information recording, labels for decoration, protection sheets, dicing tape, die bonding Any sheet, film, tape, etc. such as die attach film, die attach tape, and recording layer forming resin sheet.
前述實施形態中之驅動機器可採用旋動馬達、直線運動馬達、線性馬達、單軸機械手臂、具備雙軸或三軸以上之關節的多關節機械手臂等電動機器、氣缸、油壓缸、無桿缸(rodless cylinder)以及旋轉氣缸(rotary cylinder)等致動器等,而且亦可採用將前述等直接或間接地組合而得之機器。 於前述實施形態中,於採用輥等旋動構件之情形時,可具備使前述旋動構件旋轉驅動之驅動機器,亦可利用橡膠或樹脂等可變形之構件構成旋轉構件之表面或旋轉構件自身,亦可利用不變形之構件構成旋轉構件之表面或旋轉構件自身,亦可採用旋轉或不旋轉之軸桿(shaft)或刀片(blade)等其他構件代替輥,於採用按壓輥或按壓頭等按壓機構或按壓構件等按壓被按壓物之構件之情形時,可代替上述例示之構件或併用而採用輥、圓桿、刀片材、橡膠、樹脂、橡膠等構件,或採用藉由大氣或瓦斯(gas)等氣體之吹附進行按壓之構成,亦可利用橡膠或樹脂等可變形之構件構成進行按壓之構件,亦可利用不變形之構件構成,於採用剝離板或剝離輥等剝離機構或剝離構件等剝離被剝離物之構件之情形時,可代替上述例示的構成或併用而採用板狀構件、圓桿、輥等構件,亦可利用橡膠或樹脂等可變形之構件構成進行剝離之構件,亦可利用不變形之構件構成,於採用支持(保持)機構或支持(保持)構件等支持(保持)被支持構件(被保持構件) 之構件之情形時,亦可採用藉由機械夾緊或夾緊缸(chunk cylinder)等握持機構、庫侖力、接著劑(接著片、接著帶)、黏著劑(黏著片、黏著帶)、磁力、伯努利(Bernoulli)吸附、抽吸吸附、驅動機器等支持(保持)被支持構件之構成,於採用切斷機構或切斷構件等切斷被切斷構件或於被切斷構件形成切口或切斷線之構件之情形時,可代替上述所例示之構件或併用而採用藉由切割刀、雷射切割機、離子束、火力、熱、水壓、電熱線、氣體或液體等之吹附等進行切斷之構件,或使藉由組合有適當之驅動機器而得的機器進行切斷之構件移動而進行切斷。The driving machine in the foregoing embodiment can use rotary motors, linear motion motors, linear motors, single-axis robotic arms, multi-joint robotic arms with two-axis or three-axis or more joints, such as electric machines, air cylinders, hydraulic cylinders, and Actuators such as rodless cylinders and rotary cylinders, etc., and machines obtained by directly or indirectly combining the foregoing can also be used. In the foregoing embodiment, when a rotating member such as a roller is used, a driving device that drives the rotating member may be provided, or a deformable member such as rubber or resin may be used to form the surface of the rotating member or the rotating member itself It can also use non-deformable components to form the surface of the rotating component or the rotating component itself, or use rotating or non-rotating shafts or blades instead of rollers, and use pressing rollers or pressing heads, etc. When the pressing mechanism or pressing member presses the member to be pressed, instead of the above-exemplified member or in combination, it is possible to use rollers, rods, blade materials, rubber, resin, rubber, etc., or use air or gas ( Gas) and other gas blowing to press the structure, can also use rubber or resin and other deformable members to form the pressing member, can also be constructed with non-deformable members, in the use of peeling plate or peeling roller or other peeling mechanism or peeling In the case of peeling off a member such as a member, a plate-shaped member, round rod, roller, etc. may be used instead of the above-exemplified configuration or in combination, or a deformable member such as rubber or resin may be used to form the peeling member. It can also be constructed with non-deformable members. When supporting (holding) the supported member (member to be held) such as a supporting (holding) mechanism or supporting (holding) member, mechanical clamping or Clamp cylinder (chunk cylinder) and other holding mechanisms, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli (Bernoulli) adsorption, suction adsorption, drive The structure of supporting (holding) the supported member by a machine, etc., can be used instead of the above when a cutting mechanism or cutting member is used to cut the member to be cut, or when the member to be cut is formed with a cut or cutting line. The exemplified components or the combined use use components that are cut by cutting blades, laser cutters, ion beams, firepower, heat, water pressure, electric heating wires, gas or liquid, etc., or by combining them with The machine obtained by appropriately driving the machine moves the cutting member to perform cutting.
10:第一貼附機構 11、21:支持輥 12、22:導引輥 13、23:切斷機構 13A、18A、23A、28A:旋轉馬達 13B、23B、32B:輸出軸 13C、23C:模切輥 13D、23D:圓周面 13E、23E:切斷刀 13F、23F:支承輥 14、24:剝離輥 15、25:無用片回收輥 16、26:剝離板 16A、26A:剝離緣 17、27:按壓輥 18、28:驅動輥 18B、28B:夾送輥 19、29:回收輥 20:第二貼附機構 30:能量賦予機構 31:本體箱 31A:開口部 31B:底面 32:箱蓋 32A:直線運動馬達 32C:頂面 33:加熱機構 40:搬運機構 41:線性馬達 41A:滑塊 42:保持台 42A:保持面 AS1:第一片 AS2:第二片 BS1:第一片基材 BS2:第二片基材 CU1:第一切口 CU2:第二切口 EA:片貼附裝置 RF:環狀框架(框架構件) RF1:開口部 RL1:第一剝離片 RL2:第二剝離片 RS1:第一原片 RS2:第二原片 UP:一體物 US1:第一無用片 US2:第二無用片 WK:被接著體 WK1:一面 WK2:另一面 WV:皺褶 10: The first attachment agency 11.21: Support roller 12, 22: guide roller 13, 23: Cut off mechanism 13A, 18A, 23A, 28A: rotating motor 13B, 23B, 32B: output shaft 13C, 23C: Die cutting roll 13D, 23D: circumferential surface 13E, 23E: cutting knife 13F, 23F: Support roller 14, 24: peeling roller 15, 25: Useless sheet recovery roller 16, 26: Peel board 16A, 26A: Peeling edge 17, 27: pressing roller 18, 28: drive roller 18B, 28B: pinch roller 19, 29: Recovery roller 20: The second attachment mechanism 30: Energy Endowment Mechanism 31: Body box 31A: Opening 31B: bottom surface 32: cover 32A: Linear motion motor 32C: Top surface 33: heating mechanism 40: handling mechanism 41: Linear motor 41A: Slider 42: hold the stage 42A: Keep the surface AS1: the first piece AS2: second piece BS1: The first substrate BS2: The second substrate CU1: First cut CU2: second incision EA: Chip attaching device RF: Ring frame (frame member) RF1: Opening RL1: The first release sheet RL2: The second release sheet RS1: The first original film RS2: The second original film UP: One thing US1: The first useless piece US2: The second useless piece WK: The body is followed WK1: One side WK2: the other side WV: Wrinkle
圖1中之(A)至(C)為本發明之說明圖。(A) to (C) in FIG. 1 are explanatory diagrams of the present invention.
10:第一貼附機構 10: The first attachment agency
11、21:支持輥 11.21: Support roller
12、22:導引輥 12, 22: guide roller
13、23:切斷機構 13, 23: Cut off mechanism
13A、18A、23A、28A:旋動馬達 13A, 18A, 23A, 28A: rotating motor
13B、23B、32B:輸出軸 13B, 23B, 32B: output shaft
13C、23C:模切輥 13C, 23C: Die cutting roll
13D、23D:圓周面 13D, 23D: circumferential surface
13E、23E:切斷刀 13E, 23E: cutting knife
13F、23F:支承輥 13F, 23F: Support roller
14、24:剝離輥 14, 24: peeling roller
15、25:無用片回收輥 15, 25: Useless sheet recovery roller
16、26:剝離板 16, 26: Peel board
16A、26A:剝離緣 16A, 26A: Peeling edge
17、27:按壓輥 17, 27: pressing roller
18、28:驅動輥 18, 28: drive roller
18B、28B:夾送輥 18B, 28B: pinch roller
19、29:回收輥 19, 29: Recovery roller
20:第二貼附機構 20: The second attachment mechanism
30:能量賦予機構 30: Energy Endowment Mechanism
31:本體箱 31: Body box
31A:開口部 31A: Opening
31B:底面 31B: bottom surface
32:箱蓋 32: cover
32A:直線運動馬達 32A: Linear motion motor
32C:頂面 32C: Top surface
33:加熱機構 33: heating mechanism
40:搬運機構 40: handling mechanism
41:線性馬達 41: Linear motor
41A:滑塊 41A: Slider
42:保持台 42: hold the stage
42A:保持面 42A: Keep the surface
AS1:第一片 AS1: the first piece
AS2:第二片 AS2: second piece
BS1:第一片基材 BS1: The first substrate
BS2:第二片基材 BS2: The second substrate
CU1:第一切口 CU1: First cut
CU2:第二切口 CU2: second incision
EA:片貼附裝置 EA: Chip attaching device
RF:環狀框架(框架構件) RF: Ring frame (frame member)
RF1:開口部 RF1: Opening
RL1:第一剝離片 RL1: The first release sheet
RL2:第二剝離片 RL2: The second release sheet
RS1:第一原片 RS1: The first original film
RS2:第二原片 RS2: The second original film
UP:一體物 UP: One thing
US1:第一無用片 US1: The first useless piece
US2:第二無用片 US2: The second useless piece
WK:被接著體 WK: The body is followed
WK1:一面 WK1: One side
WK2:另一面 WK2: the other side
WV:皺褶 WV: Wrinkle
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JP4311522B2 (en) * | 2002-03-07 | 2009-08-12 | 日東電工株式会社 | Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method |
JP4312419B2 (en) * | 2002-05-09 | 2009-08-12 | リンテック株式会社 | Semiconductor wafer processing method |
JP4468884B2 (en) | 2005-12-09 | 2010-05-26 | リンテック株式会社 | Tape sticking device, mounting device, and mounting method |
JP4637057B2 (en) * | 2006-05-25 | 2011-02-23 | リンテック株式会社 | Sheet sticking device and sticking method |
JP2008300521A (en) * | 2007-05-30 | 2008-12-11 | Disco Abrasive Syst Ltd | Semiconductor wafer and its processing method |
JP4801016B2 (en) * | 2007-07-19 | 2011-10-26 | リンテック株式会社 | Sheet sticking device and sticking method |
JP5181810B2 (en) * | 2008-04-30 | 2013-04-10 | 新日鐵住金株式会社 | Speed control device for pinch roll in continuous casting machine. |
JP2009269041A (en) * | 2008-05-01 | 2009-11-19 | Tsutsumi Denki:Kk | Automatic soldering equipment |
JP2010073955A (en) * | 2008-09-19 | 2010-04-02 | Lintec Corp | Device and method for sticking sheet |
JP4462638B1 (en) * | 2009-07-17 | 2010-05-12 | 上野精機株式会社 | Pasting device and classification pasting method |
JP5542583B2 (en) * | 2010-08-26 | 2014-07-09 | リンテック株式会社 | Sheet sticking device and sticking method |
KR20220035981A (en) * | 2013-03-22 | 2022-03-22 | 린텍 가부시키가이샤 | Protective film-forming film and protective film-forming composite sheet |
JP2014204034A (en) * | 2013-04-08 | 2014-10-27 | 日東電工株式会社 | Sealing sheet adhesive method and sealing sheet adhesive apparatus |
JP6219196B2 (en) * | 2014-02-26 | 2017-10-25 | リンテック株式会社 | Sheet sticking method and sticking device |
JP7154737B2 (en) * | 2017-03-27 | 2022-10-18 | リンテック株式会社 | Sheet sticking device and sticking method |
JP7073606B2 (en) * | 2017-04-11 | 2022-05-24 | リンテック株式会社 | Separation device and separation method |
-
2018
- 2018-10-25 JP JP2018201024A patent/JP7108516B2/en active Active
-
2019
- 2019-09-19 CN CN201980058925.2A patent/CN112655082B/en active Active
- 2019-09-19 SG SG11202102358PA patent/SG11202102358PA/en unknown
- 2019-09-19 WO PCT/JP2019/036714 patent/WO2020084969A1/en active Application Filing
- 2019-09-19 KR KR1020217007143A patent/KR20210083248A/en not_active Application Discontinuation
- 2019-09-23 TW TW108134268A patent/TWI818084B/en active
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2021
- 2021-03-11 PH PH12021550544A patent/PH12021550544A1/en unknown
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WO2020084969A1 (en) | 2020-04-30 |
PH12021550544A1 (en) | 2022-02-14 |
CN112655082A (en) | 2021-04-13 |
KR20210083248A (en) | 2021-07-06 |
CN112655082B (en) | 2024-05-24 |
JP2020068328A (en) | 2020-04-30 |
JP7108516B2 (en) | 2022-07-28 |
TWI818084B (en) | 2023-10-11 |
SG11202102358PA (en) | 2021-05-28 |
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