TW202017683A - 加工系統以及加工方法 - Google Patents

加工系統以及加工方法 Download PDF

Info

Publication number
TW202017683A
TW202017683A TW108139328A TW108139328A TW202017683A TW 202017683 A TW202017683 A TW 202017683A TW 108139328 A TW108139328 A TW 108139328A TW 108139328 A TW108139328 A TW 108139328A TW 202017683 A TW202017683 A TW 202017683A
Authority
TW
Taiwan
Prior art keywords
processing
light
measurement
energy beam
irradiation
Prior art date
Application number
TW108139328A
Other languages
English (en)
Chinese (zh)
Inventor
江上茂樹
立崎陽介
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202017683A publication Critical patent/TW202017683A/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW108139328A 2018-10-31 2019-10-30 加工系統以及加工方法 TW202017683A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/040626 WO2020090075A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法
WOPCT/JP2018/040626 2018-10-31

Publications (1)

Publication Number Publication Date
TW202017683A true TW202017683A (zh) 2020-05-16

Family

ID=70463641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139328A TW202017683A (zh) 2018-10-31 2019-10-30 加工系統以及加工方法

Country Status (6)

Country Link
US (2) US12397367B2 (https=)
EP (1) EP3875207A4 (https=)
JP (6) JP7235054B2 (https=)
CN (4) CN117245209A (https=)
TW (1) TW202017683A (https=)
WO (2) WO2020090075A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111971622A (zh) * 2018-03-29 2020-11-20 Asml荷兰有限公司 位置测量系统、干涉仪系统和光刻装置
JP7515074B2 (ja) * 2020-06-19 2024-07-12 パナソニックIpマネジメント株式会社 レーザ溶接方法および装置
KR102935679B1 (ko) * 2020-09-22 2026-03-06 삼성디스플레이 주식회사 빔 교정부를 포함하는 레이저 장치 및 이를 이용한 레이저 조사 방법
WO2022086557A1 (en) * 2020-10-23 2022-04-28 Hewlett-Packard Development Company, L.P. Scanning systems
KR102518030B1 (ko) * 2021-03-25 2023-04-05 한국광기술원 선박의 용접선 작업 처리용 이동 장치
EP4414119A4 (en) * 2021-09-13 2025-12-24 Nikon Corp TREATMENT SYSTEM
US20260014623A1 (en) * 2022-07-14 2026-01-15 Nikon Corporation Build system
WO2024013930A1 (ja) * 2022-07-14 2024-01-18 株式会社ニコン 造形システム、加工システム、造形方法及び加工方法
CN115255772B (zh) * 2022-07-29 2024-03-22 中国原子能科学研究院 用于放射性样品焊接夹具的自动拧紧装置及自动拧紧方法
WO2025069363A1 (en) * 2023-09-29 2025-04-03 Nikon Corporation Beam scanning apparatus, processing apparatus, and processing method
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
CN117564489B (zh) * 2024-01-15 2024-03-26 鑫业诚智能装备(无锡)有限公司 一种半导体晶圆激光打标设备

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3518079B2 (ja) * 1995-07-20 2004-04-12 株式会社デンソー レーザ加工方法
JPH1015684A (ja) * 1996-07-01 1998-01-20 Nikon Corp レーザ加工装置
JPH1058174A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
JPH115185A (ja) * 1997-06-11 1999-01-12 Nikon Corp レーザ加工装置
JP3410989B2 (ja) 1999-08-02 2003-05-26 住友重機械工業株式会社 精密レーザ照射装置及び制御方法
US7456949B2 (en) * 1999-09-14 2008-11-25 Amo Manufacturing Usa, Llc Methods and systems for laser calibration and eye tracker camera alignment
JP2001208513A (ja) * 2000-01-27 2001-08-03 Amada Co Ltd 駆動装置における変位量検出方法及びその装置、並びに板材加工機における高品質加工方法及び高品質加工システム
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
US20030038121A1 (en) * 2001-01-16 2003-02-27 Christensen C. Paul Laser system and method for marking gemstones
CN1265933C (zh) * 2001-03-23 2006-07-26 三菱电机株式会社 激光加工方法
JP2002347128A (ja) 2001-05-24 2002-12-04 Nakakin:Kk 光造形品とその製造方法
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
JP2006337873A (ja) * 2005-06-03 2006-12-14 Fujifilm Holdings Corp 露光装置及び露光方法
WO2007142351A1 (ja) * 2006-06-09 2007-12-13 Nikon Corporation 移動体装置、露光装置及び露光方法、並びにデバイス製造方法
JP2008055436A (ja) 2006-08-29 2008-03-13 Sharp Corp レーザ照射装置
JP2008093682A (ja) * 2006-10-10 2008-04-24 Tokyo Electron Ltd レーザ発光装置の位置調整方法
JP5064862B2 (ja) * 2007-03-30 2012-10-31 富士フイルム株式会社 アライメントマーク測定方法および装置並びに描画方法および装置
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
US8053279B2 (en) * 2007-06-19 2011-11-08 Micron Technology, Inc. Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
JP2009016412A (ja) * 2007-07-02 2009-01-22 Nikon Corp 計測方法、設定方法及びパターン形成方法、並びに移動体駆動システム及びパターン形成装置
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
US8378252B2 (en) * 2009-05-29 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for hybrid resolution feedback of a motion stage
US20100326962A1 (en) * 2009-06-24 2010-12-30 General Electric Company Welding control system
CN102198607A (zh) * 2010-03-23 2011-09-28 发那科株式会社 工件形状测量方法以及具有机上测量装置的机床
WO2012029142A1 (ja) * 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
CN102642083B (zh) * 2011-02-22 2015-01-07 陈鸿隆 激光加工机构
CN103128439B (zh) * 2011-11-24 2015-05-20 三菱电机株式会社 透镜单元以及激光加工装置
CN103781590B (zh) * 2011-12-14 2016-07-06 松下知识产权经营株式会社 超精密复合加工装置中的加工机构的判断方法及超精密复合加工装置
DE112012003796B4 (de) * 2011-12-14 2018-03-01 Panasonic Intellectual Property Management Co., Ltd. Bearbeitungsdatenerzeugungsverfahren für kombinierte Ultrapräzisionsbearbeitungsvorrichtung und kombinierte Ultrapräzisionsbearbeitungsvorrichtung
CN105026076B (zh) * 2013-02-27 2017-06-09 Slm方案集团股份公司 用于生产具有定制微观结构的工件的装置和方法
JP6218770B2 (ja) * 2014-06-23 2017-10-25 三菱電機株式会社 レーザ加工装置
US10252466B2 (en) 2014-07-28 2019-04-09 Massachusetts Institute Of Technology Systems and methods of machine vision assisted additive fabrication
CN117484866A (zh) * 2014-11-14 2024-02-02 株式会社 尼康 造型装置及造型方法
US11007603B2 (en) * 2015-01-30 2021-05-18 Makino Milling Machine Co., Ltd. Laser beam machine and alignment adjusting method
EP3251784B1 (en) * 2015-01-30 2024-06-12 Makino Milling Machine Co., Ltd. Laser processing machine and laser processing method
JP5947941B1 (ja) * 2015-03-26 2016-07-06 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械
JP5807134B1 (ja) 2015-04-30 2015-11-10 アイエムエス ソフトウェア サービシズ リミテッド 情報処理装置、情報処理方法及びプログラム
JP5948462B1 (ja) * 2015-05-19 2016-07-06 株式会社ソディック 積層造形装置
JP2016215251A (ja) * 2015-05-22 2016-12-22 三菱重工業株式会社 レーザ切断装置
DE102015012565B3 (de) * 2015-09-25 2016-10-27 Lessmüller Lasertechnik GmbH Vorrichtung und Verfahren zur Erhöhung der Genauigkeit eines OCT-Messsystems für die Lasermaterialbearbeitung
EP3383573B1 (en) * 2015-12-04 2023-11-08 Raytheon Company Electron beam additive manufacturing
JP6348101B2 (ja) 2015-12-17 2018-06-27 ファナック株式会社 ワークの傾きを考慮したギャップ制御軸の落下防止機能を備えた制御装置
JP2017113788A (ja) * 2015-12-24 2017-06-29 株式会社リコー 光加工装置
JP6412049B2 (ja) 2016-04-14 2018-10-24 ファナック株式会社 金属粉を供給しながらレーザを照射する加工部を移動させて積層造形を行う積層造形加工方法及び積層造形加工装置
CN106077956B (zh) * 2016-06-28 2018-02-23 英诺激光科技股份有限公司 一种去除薄膜或涂层的激光加工方法及设备
DE102016014564B4 (de) * 2016-12-07 2024-09-26 Lessmüller Lasertechnik GmbH Messvorrichtung zum Überwachen eines Bearbeitungsprozesses unter Verwendung von an unterschiedlichen Messpositionen erfassten Messinformationen
JP6809952B2 (ja) * 2017-03-23 2021-01-06 住友重機械工業株式会社 レーザ加工装置
JP7036129B2 (ja) * 2018-01-31 2022-03-15 株式会社ニコン 加工システム、及び、加工方法
CN109158600B (zh) * 2018-09-18 2020-06-05 西北工业大学 同步送粉激光增材制造光斑与粉斑相对位置自动匹配的装置及方法

Also Published As

Publication number Publication date
JP2024019574A (ja) 2024-02-09
JPWO2020090962A1 (ja) 2021-09-24
JP7613546B2 (ja) 2025-01-15
CN117245209A (zh) 2023-12-19
JP7409315B2 (ja) 2024-01-09
WO2020090962A1 (ja) 2020-05-07
EP3875207A4 (en) 2022-12-14
CN112930242B (zh) 2023-09-29
JP2023057171A (ja) 2023-04-20
JP7552756B2 (ja) 2024-09-18
CN117226248A (zh) 2023-12-15
JP7235054B2 (ja) 2023-03-08
CN117182292A (zh) 2023-12-08
CN112930242A (zh) 2021-06-08
US12397367B2 (en) 2025-08-26
JP2025031984A (ja) 2025-03-07
EP3875207A1 (en) 2021-09-08
WO2020090075A1 (ja) 2020-05-07
JPWO2020090075A1 (ja) 2021-09-24
US20250339920A1 (en) 2025-11-06
JP2024160010A (ja) 2024-11-08
US20210379693A1 (en) 2021-12-09

Similar Documents

Publication Publication Date Title
JP7613546B2 (ja) 加工システム、及び、加工方法
JP7533712B2 (ja) 加工システム、及び、加工方法
TWI447468B (zh) 用於晶圓劃線的自動聚焦方法與設備
JP5743123B1 (ja) レーザーダイシング装置及びダイシング方法
KR101540174B1 (ko) 레이저 스크라이빙 장치에서 빔 특성화를 수행하는 방법, 및 이러한 방법을 수행할 수 있는 레이저 스크라이빙 장치
CN115485093B (zh) 加工系统