TW202003236A - 電子機器及電磁波屏蔽性放熱片材 - Google Patents

電子機器及電磁波屏蔽性放熱片材 Download PDF

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Publication number
TW202003236A
TW202003236A TW108118482A TW108118482A TW202003236A TW 202003236 A TW202003236 A TW 202003236A TW 108118482 A TW108118482 A TW 108118482A TW 108118482 A TW108118482 A TW 108118482A TW 202003236 A TW202003236 A TW 202003236A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
resin layer
conductive resin
heat dissipation
electromagnetic wave
Prior art date
Application number
TW108118482A
Other languages
English (en)
Chinese (zh)
Inventor
五十嵐和幸
中島剛介
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202003236A publication Critical patent/TW202003236A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108118482A 2018-05-29 2019-05-29 電子機器及電磁波屏蔽性放熱片材 TW202003236A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018102144 2018-05-29
JP2018-102144 2018-05-29

Publications (1)

Publication Number Publication Date
TW202003236A true TW202003236A (zh) 2020-01-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108118482A TW202003236A (zh) 2018-05-29 2019-05-29 電子機器及電磁波屏蔽性放熱片材

Country Status (3)

Country Link
JP (3) JPWO2019230607A1 (enExample)
TW (1) TW202003236A (enExample)
WO (1) WO2019230607A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111136851B (zh) * 2019-12-31 2021-10-26 九牧厨卫股份有限公司 一种高强度耐腐蚀制品及其制备方法
JP6805382B1 (ja) * 2020-03-30 2020-12-23 Ｊｘ金属株式会社 電磁波シールド材
CN111315197A (zh) * 2020-04-02 2020-06-19 深圳市龙航科技有限公司 一种带有散热结构的车载导航仪
JPWO2023008538A1 (enExample) * 2021-07-29 2023-02-02
JP7771709B2 (ja) * 2021-12-14 2025-11-18 オムロン株式会社 実装基板、及び実装基板を搭載した電気機器
JP2023115732A (ja) * 2022-02-08 2023-08-21 株式会社レゾナック 放熱構造形成用部材、電子装置の製造方法、及び、電子装置
CN114628368B (zh) * 2022-03-10 2022-11-11 深圳市赛元微电子股份有限公司 一种芯片电路模块的电磁屏蔽装置
WO2023190440A1 (ja) * 2022-03-29 2023-10-05 デンカ株式会社 二液硬化型組成物セット、硬化物及び電子機器
TW202419283A (zh) 2022-07-22 2024-05-16 日商拓自達電線股份有限公司 散熱片

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102452U (enExample) * 1989-02-02 1990-08-15
JP3498823B2 (ja) * 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途
JP3372462B2 (ja) * 1997-11-27 2003-02-04 電気化学工業株式会社 ゴムシートの製造方法
JPH11317591A (ja) * 1998-05-07 1999-11-16 Porimatec Kk 熱伝導性電磁波シールドシート
JP3313685B2 (ja) * 1999-12-28 2002-08-12 北川工業株式会社 電子部品用放熱体
JP2002194306A (ja) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd 熱伝導性シート
JP2003224386A (ja) * 2002-01-31 2003-08-08 Toyota Motor Corp 自動車用電子装置及び自動車用電子装置用ハウジング
JP2005228955A (ja) 2004-02-13 2005-08-25 Denki Kagaku Kogyo Kk 放熱部材、その製造方法及び用途
JP4798629B2 (ja) * 2006-11-13 2011-10-19 北川工業株式会社 熱伝導性電磁波シールドシート及び電磁波シールド構造
JP2012059811A (ja) 2010-09-07 2012-03-22 Mochida Shoko Kk 放熱シート
JP5749536B2 (ja) * 2011-03-28 2015-07-15 電気化学工業株式会社 熱伝導性成形体とその用途
JP2015153743A (ja) * 2014-02-19 2015-08-24 日立建機株式会社 蓄電装置及びこれを搭載した作業機械
JP2016186972A (ja) * 2015-03-27 2016-10-27 東レ株式会社 電磁波シールドシート、それを硬化させてなる硬化膜、金属箔積層電磁波シールドシートの製造方法、積層体および半導体装置
JP2017112144A (ja) 2015-12-14 2017-06-22 富士通株式会社 電子装置、熱伝導部材、及び電子装置の製造方法

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WO2019230607A1 (ja) 2019-12-05
JP7351874B2 (ja) 2023-09-27
JP2021005715A (ja) 2021-01-14
JPWO2019230607A1 (ja) 2020-07-02
JP2021177561A (ja) 2021-11-11

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