TW201946725A - 研磨墊及以該研磨墊進行的研磨方法 - Google Patents
研磨墊及以該研磨墊進行的研磨方法 Download PDFInfo
- Publication number
- TW201946725A TW201946725A TW108113809A TW108113809A TW201946725A TW 201946725 A TW201946725 A TW 201946725A TW 108113809 A TW108113809 A TW 108113809A TW 108113809 A TW108113809 A TW 108113809A TW 201946725 A TW201946725 A TW 201946725A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing pad
- adsorption layer
- shielding member
- platform
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 286
- 238000000034 method Methods 0.000 title claims description 14
- 238000001179 sorption measurement Methods 0.000 claims abstract description 95
- 239000002002 slurry Substances 0.000 claims abstract description 54
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 16
- -1 polysiloxane Polymers 0.000 claims description 43
- 238000000227 grinding Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 26
- 238000004132 cross linking Methods 0.000 abstract description 4
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 102
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-089603 | 2018-05-08 | ||
| JP2018089603A JP7026943B2 (ja) | 2018-05-08 | 2018-05-08 | 研磨パッド及び該研磨パッドによる研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201946725A true TW201946725A (zh) | 2019-12-16 |
Family
ID=68468265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108113809A TW201946725A (zh) | 2018-05-08 | 2019-04-19 | 研磨墊及以該研磨墊進行的研磨方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7026943B2 (ja) |
| KR (1) | KR102639470B1 (ja) |
| CN (1) | CN111819033B (ja) |
| TW (1) | TW201946725A (ja) |
| WO (1) | WO2019216301A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230173637A1 (en) * | 2020-03-26 | 2023-06-08 | Fujibo Holdings, Inc. | Polishing pad, polishing unit, polishing device, and method for manufacturing polishing pad |
| KR20240049977A (ko) | 2022-10-11 | 2024-04-18 | 건국대학교 글로컬산학협력단 | 미산성 차아염소산수의 제조장치 및 이를 이용한 미산성 차아염소산수의 제조방법 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3175511B2 (ja) * | 1994-12-26 | 2001-06-11 | 住友金属工業株式会社 | 研磨装置及び研磨パッドの着脱装置 |
| JP2842865B1 (ja) * | 1997-08-22 | 1999-01-06 | 九州日本電気株式会社 | 研磨装置 |
| JPH11243135A (ja) * | 1998-02-26 | 1999-09-07 | Kyocera Corp | 真空吸着盤 |
| JP4041577B2 (ja) * | 1998-03-16 | 2008-01-30 | スピードファム株式会社 | ポリッシング装置の定盤及び研磨パッド貼着方法 |
| US6227950B1 (en) * | 1999-03-08 | 2001-05-08 | Speedfam-Ipec Corporation | Dual purpose handoff station for workpiece polishing machine |
| US6464576B1 (en) * | 1999-08-31 | 2002-10-15 | Rodel Holdings Inc. | Stacked polishing pad having sealed edge |
| JP2003510826A (ja) * | 1999-09-29 | 2003-03-18 | ロデール ホールディングス インコーポレイテッド | 研磨パッド |
| JP3992092B2 (ja) * | 2000-04-07 | 2007-10-17 | 東京エレクトロン株式会社 | 試料研磨装置、試料研磨方法及び研磨パッド |
| JP4686010B2 (ja) * | 2000-07-18 | 2011-05-18 | ニッタ・ハース株式会社 | 研磨パッド |
| US7201647B2 (en) * | 2002-06-07 | 2007-04-10 | Praxair Technology, Inc. | Subpad having robust, sealed edges |
| US6783437B1 (en) * | 2003-05-08 | 2004-08-31 | Texas Instruments Incorporated | Edge-sealed pad for CMP process |
| JP2006255809A (ja) * | 2005-03-15 | 2006-09-28 | Disco Abrasive Syst Ltd | 研磨装置 |
| JP5061308B2 (ja) * | 2007-01-05 | 2012-10-31 | フジコピアン株式会社 | 密着シート |
| JP5310259B2 (ja) * | 2009-05-26 | 2013-10-09 | 信越半導体株式会社 | 研磨装置およびワークの研磨方法 |
| JP4680314B1 (ja) * | 2010-02-04 | 2011-05-11 | 東邦エンジニアリング株式会社 | 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法 |
| JP5789870B2 (ja) * | 2011-09-14 | 2015-10-07 | 東邦エンジニアリング株式会社 | 防浸構造を備えた研磨パッド用補助板および研磨装置 |
| JP5765858B2 (ja) * | 2012-12-04 | 2015-08-19 | 丸石産業株式会社 | 研磨パッド |
| JP6074245B2 (ja) * | 2012-12-07 | 2017-02-01 | ニッタ・ハース株式会社 | 研磨パッド |
-
2018
- 2018-05-08 JP JP2018089603A patent/JP7026943B2/ja active Active
-
2019
- 2019-04-19 TW TW108113809A patent/TW201946725A/zh unknown
- 2019-05-07 CN CN201980017337.4A patent/CN111819033B/zh active Active
- 2019-05-07 WO PCT/JP2019/018209 patent/WO2019216301A1/ja active Application Filing
- 2019-05-07 KR KR1020207027235A patent/KR102639470B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN111819033A (zh) | 2020-10-23 |
| JP7026943B2 (ja) | 2022-03-01 |
| CN111819033B (zh) | 2022-05-13 |
| KR20210006325A (ko) | 2021-01-18 |
| KR102639470B1 (ko) | 2024-02-21 |
| JP2019195855A (ja) | 2019-11-14 |
| WO2019216301A1 (ja) | 2019-11-14 |
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