TW201942164A - 樹脂組合物、光纖之二次被覆材料及光纖 - Google Patents
樹脂組合物、光纖之二次被覆材料及光纖 Download PDFInfo
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- TW201942164A TW201942164A TW108111723A TW108111723A TW201942164A TW 201942164 A TW201942164 A TW 201942164A TW 108111723 A TW108111723 A TW 108111723A TW 108111723 A TW108111723 A TW 108111723A TW 201942164 A TW201942164 A TW 201942164A
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- acrylate
- resin composition
- monomer
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Classifications
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Abstract
本發明之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;以及疏水性之無機氧化物粒子,且該樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下,具有苯氧基之單體之含量以基礎樹脂之總量為基準,為1質量%以上30質量%以下。
Description
本發明係關於一種樹脂組合物、光纖之二次被覆材料及光纖。
本申請係主張基於2018年4月2日提出申請之日本專利申請第2018-070649號之優先權,並引用上述日本專利申請中所記載之全部記載內容。
本申請係主張基於2018年4月2日提出申請之日本專利申請第2018-070649號之優先權,並引用上述日本專利申請中所記載之全部記載內容。
一般而言,光纖具有用以保護作為光傳輸體之玻璃纖維之被覆樹脂層。光纖為了減少由對光纖賦予有側壓時所產生之微小彎曲引起之傳輸損耗的增加,而要求側壓特性優異。
[先前技術文獻]
[專利文獻]
[先前技術文獻]
[專利文獻]
專利文獻1:日本專利特開2014-219550號公報
本發明之一態樣之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子,且該樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下,具有苯氧基之單體之含量以基礎樹脂之總量為基準,為1質量%以上30質量%以下。
[本發明所欲解決之問題]
含有填料之樹脂組合物存在黏度增高而塗佈性變得不足之傾向。另一方面,為了調整樹脂組合物之黏度,若增加稀釋性單體之添加量,則存在低聚物之比率降低而由樹脂組合物形成之塗膜變脆之傾向。又,若增加稀釋性單體之添加量,則由樹脂組合物形成之塗膜之楊氏模數發生增減,或塗膜之厚度變薄而樹脂層之強度降低。因此,對於光纖之被覆樹脂層中所使用之樹脂組合物,要求兼具塗佈性與塗膜物性。
含有填料之樹脂組合物存在黏度增高而塗佈性變得不足之傾向。另一方面,為了調整樹脂組合物之黏度,若增加稀釋性單體之添加量,則存在低聚物之比率降低而由樹脂組合物形成之塗膜變脆之傾向。又,若增加稀釋性單體之添加量,則由樹脂組合物形成之塗膜之楊氏模數發生增減,或塗膜之厚度變薄而樹脂層之強度降低。因此,對於光纖之被覆樹脂層中所使用之樹脂組合物,要求兼具塗佈性與塗膜物性。
本發明之目的在於提供一種能夠兼具塗佈性與塗膜物性之樹脂組合物、及具有由該樹脂組合物形成之被覆樹脂層之光纖。
[本發明之效果]
根據本發明,可提供一種能夠兼具塗佈性與塗膜物性之樹脂組合物、及具有由該樹脂組合物形成之被覆樹脂層之光纖。
根據本發明,可提供一種能夠兼具塗佈性與塗膜物性之樹脂組合物、及具有由該樹脂組合物形成之被覆樹脂層之光纖。
[本發明之實施形態之說明]
首先,列舉本發明之實施形態之內容進行說明。本發明之一態樣之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子,且該樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下,具有苯氧基之單體之含量以基礎樹脂之總量為基準,為1質量%以上30質量%以下。
首先,列舉本發明之實施形態之內容進行說明。本發明之一態樣之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子,且該樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下,具有苯氧基之單體之含量以基礎樹脂之總量為基準,為1質量%以上30質量%以下。
此種樹脂組合物能夠兼具塗佈性與塗膜物性。又,藉由將上述樹脂組合物用作光纖被覆用之紫外線硬化型樹脂組合物,能夠製作側壓特性優異之光纖。
為調整塗佈性與塗膜物性之平衡性,基礎樹脂亦可進而含有不具有苯氧基之單體。又,若不具有苯氧基之單體之黏度於25℃下為50 mPa・s以下,則易提昇樹脂組合物之塗佈性。
具有苯氧基之單體可為選自由(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸3-苯氧基苄酯、苯氧基二乙二醇(甲基)丙烯酸酯及苯氧基聚乙二醇(甲基)丙烯酸酯所組成之群中之至少1種。藉此,變得易調整樹脂組合物之塗佈性與塗膜物性之平衡性。
就於樹脂組合物中之分散性優異,易形成較硬之覆膜之方面而言,上述無機氧化物粒子可為選自由二氧化矽、二氧化鋯、氧化鋁、氧化鎂、氧化鈦、氧化錫及氧化鋅所組成之群中之至少1種。
本發明之一態樣之光纖具備:包含芯及包層之玻璃纖維、與玻璃纖維相接並被覆該玻璃纖維之一次樹脂層、及被覆一次樹脂層之二次樹脂層,二次樹脂層包含上述樹脂組合物之硬化物。藉由將本實施形態之樹脂組合物應用於二次樹脂層,而能夠提昇光纖之側壓特性。
[本發明之詳細之實施形態]
針對本實施形態之樹脂組合物、光纖之二次被覆材料及光纖之具體例,一面視需要參照圖式一面進行說明。再者,本發明並不限定於該等例示,意欲包含由申請專利範圍所示,且與申請專利範圍均等之含義及於範圍內之全部變更。以下之說明中,於圖式之說明中對於相同之要素附上相同之符號,省略重複之說明。
針對本實施形態之樹脂組合物、光纖之二次被覆材料及光纖之具體例,一面視需要參照圖式一面進行說明。再者,本發明並不限定於該等例示,意欲包含由申請專利範圍所示,且與申請專利範圍均等之含義及於範圍內之全部變更。以下之說明中,於圖式之說明中對於相同之要素附上相同之符號,省略重複之說明。
<樹脂組合物>
本實施形態之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子。
本實施形態之樹脂組合物包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子。
此處,所謂(甲基)丙烯酸酯,意指丙烯酸酯或與其相對應之甲基丙烯酸酯。關於(甲基)丙烯酸等亦相同。
(基礎樹脂)
本實施形態之基礎樹脂以基礎樹脂之總量為基準,含有1質量%以上30質量%以下之具有苯氧基之單體。藉由使基礎樹脂於此種範圍內含有具有苯氧基之單體,而能夠提昇樹脂組合物之塗佈性,形成具有作為光纖之被覆用樹脂適當之楊氏模數之塗膜。具有苯氧基之單體之含量較佳為2質量%以上28質量%以下,更佳為3質量%以上25質量%以下。
本實施形態之基礎樹脂以基礎樹脂之總量為基準,含有1質量%以上30質量%以下之具有苯氧基之單體。藉由使基礎樹脂於此種範圍內含有具有苯氧基之單體,而能夠提昇樹脂組合物之塗佈性,形成具有作為光纖之被覆用樹脂適當之楊氏模數之塗膜。具有苯氧基之單體之含量較佳為2質量%以上28質量%以下,更佳為3質量%以上25質量%以下。
作為具有苯氧基之單體,例如可列舉:(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸3-苯氧基苄酯、苯氧基二乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯及壬基苯氧基聚乙二醇(甲基)丙烯酸酯。就調整樹脂組合物之塗佈性與塗膜物性之平衡性之觀點而言,具有苯氧基之單體可為選自由(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸3-苯氧基苄酯、苯氧基二乙二醇(甲基)丙烯酸酯及苯氧基聚乙二醇(甲基)丙烯酸酯所組成之群中之至少1種。其中,作為具有苯氧基之單體,較佳為(甲基)丙烯酸2-苯氧基乙酯或(甲基)丙烯酸3-苯氧基苄酯。具有苯氧基之單體可混合使用2種以上。
就提昇樹脂組合物之塗佈性之觀點而言,具有苯氧基之單體之黏度於25℃下較佳為50 mPa・s以下,更佳為1 mPa・s以上30 mPa・s以下,進而較佳為1 mPa・s以上25 mPa・s以下。
基礎樹脂亦可進而含有不具有苯氧基之單體。不具有苯氧基之單體之黏度於25℃下較佳為50 mPa・s以下,更佳為1 mPa・s以上30 mPa・s以下,進而較佳為1 mPa・s以上25 mPa・s以下。藉此,能夠獲得塗佈性與塗膜物性之平衡性更優異之樹脂組合物。
不具有苯氧基之單體可為具有1個聚合性基之單官能單體或具有2個以上聚合性基之多官能單體。不具有苯氧基之單體可混合使用2種以上。
作為不具有苯氧基之單官能單體,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、4-第三丁基環己醇(甲基)丙烯酸酯、(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸雙環戊酯、壬基苯酚聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸異基酯等(甲基)丙烯酸酯系單體;(甲基)丙烯酸、(甲基)丙烯酸二聚物、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、ω-羧基-聚己內酯(甲基)丙烯酸酯等含羧基之單體;N-丙烯醯啉、N-乙烯基吡咯啶酮、N-乙烯基己內醯胺、N-丙烯醯基哌啶、N-甲基丙烯醯基哌啶、N-丙烯醯基吡咯啶、3-(3-吡啶)(甲基)丙烯酸丙酯、環狀三羥甲基丙烷甲醛丙烯酸酯等含雜環之(甲基)丙烯酸酯;馬來醯亞胺、N-環己基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-己基(甲基)丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等醯胺基系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸丙烯酸胺基丙酯、(甲基)丙烯酸N,N-二甲胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等丁二醯亞胺系單體。
作為單官能單體,就調整由樹脂組合物形成之塗膜之楊氏模數之觀點而言,較佳為(甲基)丙烯酸異基酯或4-第三丁基環己醇(甲基)丙烯酸酯,更佳為(甲基)丙烯酸異基酯。
作為不具有苯氧基之多官能單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、雙酚A之環氧烷加成物之二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、羥基新戊酸新戊二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、1,14-十四烷二醇二(甲基)丙烯酸酯、1,16-十六烷二醇二(甲基)丙烯酸酯、1,20-二十烷二醇二(甲基)丙烯酸酯、異戊二醇二(甲基)丙烯酸酯、3-乙基-1,8-辛二醇二(甲基)丙烯酸酯、雙酚A之EO加成物二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基辛烷三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基三(甲基)丙烯酸酯、三羥甲基丙烷聚丙氧基三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基聚丙氧基三(甲基)丙烯酸酯、三[(甲基)丙烯醯氧基乙基]異氰脲酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇聚乙氧基四(甲基)丙烯酸酯、季戊四醇聚丙氧基四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯及己內酯改性三[(甲基)丙烯醯氧基乙基]異氰脲酸酯。
作為多官能單體,就降低樹脂組合物之黏度,並且形成具有所需之楊氏模數之塗膜之觀點而言,亦可使用三丙二醇二(甲基)丙烯酸酯、1,6-己二醇(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯。其中,作為多官能單體,較佳為三丙二醇二(甲基)丙烯酸酯。
基礎樹脂以基礎樹脂之總量為基準,較佳為含有單體(具有苯氧基之單體及不具有苯氧基之單體)21質量%以上45質量%以下,更佳為含有22質量%以上43質量%以下。藉由於上述範圍內含有單體,而變得易製備塗佈性與塗膜物性之平衡性更優異之樹脂組合物。
本實施形態之樹脂組合物包含胺基甲酸酯(甲基)丙烯酸酯低聚物。作為胺基甲酸酯(甲基)丙烯酸酯低聚物,能夠使用使多元醇化合物、聚異氰酸酯化合物及含羥基之(甲基)丙烯酸酯化合物反應所獲得之低聚物。
作為多元醇化合物,例如可列舉:聚四亞甲基二醇、聚丙二醇及雙酚A・環氧乙烷加成二醇。多元醇化合物之數量平均分子量可為400~1000。作為聚異氰酸酯化合物,例如可列舉:2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、異佛爾酮二異氰酸酯及二環己基甲烷4,4'-二異氰酸酯。作為含羥基之(甲基)丙烯酸酯化合物,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丁酯、1,6-己二醇單(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基丙酯及三丙二醇單(甲基)丙烯酸酯。
作為合成胺基甲酸酯(甲基)丙烯酸酯低聚物時之觸媒,一般而言使用有機錫化合物。作為有機錫化合物,例如可列舉:二月桂酸二丁基錫、二乙酸二丁基錫、順丁烯二酸二丁基錫、雙(巰基乙酸2-乙基己酯)二丁基錫、雙(巰基乙酸異辛酯)二丁基錫及二丁基氧化錫。就易獲取性或觸媒性能之方面而言,較佳為使用二月桂酸二丁基錫或二乙酸二丁基錫作為觸媒。
於胺基甲酸酯(甲基)丙烯酸酯低聚物合成時亦可使用碳數5以下之低級醇。作為低級醇,例如可列舉:甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、2-丁醇、2-甲基-2-丙醇、1-戊醇、2-戊醇、3-戊醇、2-甲基-1-丁醇、3-甲基-1-丁醇、2-甲基-2-丁醇、3-甲基-2-丁醇及2,2-二甲基-1-丙醇。
本實施形態之樹脂組合物亦可進而含有環氧(甲基)丙烯酸酯低聚物。作為環氧(甲基)丙烯酸酯低聚物,能夠使用使具有(甲基)丙烯醯基之化合物與含有2個以上縮水甘油基之環氧樹脂進行反應所獲得之低聚物。
作為光聚合起始劑,能夠自公知之自由基光聚合起始劑之中適當選擇而使用。作為光聚合起始劑,例如可列舉:1-羥基環己基苯基酮、2,2-二甲氧基-2-苯基苯乙酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、2,4,4-三甲基戊基氧化膦、2,4,4-三甲基苯甲醯基二苯基氧化膦、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-丙烷-1-酮(Omnirad 907,IGM Resins公司製造)、2,4,6-三甲基苯甲醯基二苯基氧化膦(Omnirad TPO,IGM Resins公司製造)及雙(2,4,6-三甲基苯甲醯基)苯基氧化膦(Omnirad 819,IGM Resins公司製造)。
(無機氧化物粒子)
本實施形態之無機氧化物粒子為球狀之粒子,且其表面經疏水處理。本實施形態之疏水處理係指於無機氧化物粒子之表面導入有疏水性之基。導入有疏水性之基之無機氧化物粒子於樹脂組合物中之分散性優異。疏水性之基可為(甲基)丙烯醯基等反應性基、或烴基(例如烷基)、芳基(例如苯基)等非反應性基。於無機氧化物粒子具有反應性基之情形時,變得易形成楊氏模數較高之樹脂層。
本實施形態之無機氧化物粒子為球狀之粒子,且其表面經疏水處理。本實施形態之疏水處理係指於無機氧化物粒子之表面導入有疏水性之基。導入有疏水性之基之無機氧化物粒子於樹脂組合物中之分散性優異。疏水性之基可為(甲基)丙烯醯基等反應性基、或烴基(例如烷基)、芳基(例如苯基)等非反應性基。於無機氧化物粒子具有反應性基之情形時,變得易形成楊氏模數較高之樹脂層。
本實施形態之無機氧化物粒子係分散於分散介質中。藉由使用分散於分散介質中之無機氧化物,而能夠使無機氧化物粒子均勻地分散於樹脂組合物中,而可提昇樹脂組合物之保存穩定性。作為分散介質,只要不阻礙樹脂組合物之硬化,則並無特別限制。分散介質可為反應性,亦可為非反應性。
作為反應性之分散介質,可使用(甲基)丙烯醯基化合物、環氧化合物等單體。作為(甲基)丙烯醯基化合物,例如可列舉:1,6-己二醇二(甲基)丙烯酸酯、EO改性雙酚A二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、PO改性雙酚A二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯及聚四亞甲基二醇二(甲基)丙烯酸酯。作為(甲基)丙烯醯基化合物,可使用上述之單體中所例示之化合物。
作為非反應性之分散介質,可使用甲基乙基酮(MEK)等酮系溶劑、丙二醇單甲醚(PGME)等醇系溶劑、或丙二醇單甲醚乙酸酯(PGMEA)等酯系溶劑。於非反應性之分散介質之情形,亦可將基礎樹脂與分散於分散介質中之無機氧化物粒子混合之後,去除分散介質之一部分而製備樹脂組合物。利用光學顯微鏡(倍率約100倍)觀察包含無機氧化物粒子之分散介質,於未觀察到粒子之情形時,可謂無機氧化物粒子以一次粒子分散。
就於樹脂組合物中之分散性優異且易形成較硬之覆膜之方面而言,上述無機氧化物粒子較佳為選自由二氧化矽(Silica)、二氧化鋯(Zirconia)、氧化鋁(Alumina)、氧化鎂(Magnesia)、氧化鈦(Titania)、氧化錫及氧化鋅所組成之群中之至少1種。就廉價性優異、易進行表面處理、具有紫外線透過性、及易賦予樹脂層適當之硬度等觀點而言,更佳為使用疏水性之氧化矽粒子作為本實施形態之無機氧化物粒子。
就提高樹脂層之楊氏模數之觀點而言,無機氧化物粒子之平均一次粒徑較佳為200 nm以下,更佳為5 nm以上200 nm以下,進而較佳為10 nm以上100 nm以下。平均一次粒徑例如可藉由電子顯微鏡照片之圖像分析、光散射法、BET法等進行測定。分散有無機氧化物之一次粒子之分散介質於一次粒子之粒徑較小之情形時,於目視下看起來透明。於一次粒子之粒徑相對較大(40 nm以上)之情形時,分散有一次粒子之分散介質看起來白濁,但未觀察到沈澱物。
無機氧化物粒子之含量以樹脂組合物之總量為基準,較佳為1質量%以上60質量%以下,更佳為7質量%以上50質量%以下,進而較佳為9質量%以上40質量%以下。若無機氧化物粒子之含量為1質量%以上,則變得易形成側壓特性優異之樹脂層。若無機氧化物粒子之含量為60質量%以下,則變得易提昇樹脂組合物之塗佈性。
樹脂組合物亦可進而含有矽烷偶合劑、光酸產生劑、調平劑、消泡劑、抗氧化劑等。
作為矽烷偶合劑,只要不妨礙樹脂組合物之硬化,則並無特別限定。作為矽烷偶合劑,例如可列舉:矽酸四甲酯、矽酸四乙酯、巰丙基三甲氧基矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、乙烯基三(β-甲氧基-乙氧基)矽烷、β-(3,4-環氧基環己基)-乙基三甲氧基矽烷、二甲氧基二甲矽烷、二乙氧基二甲矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、γ-甲基丙烯醯基氧丙基三甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基三甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基三甲基二甲氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、γ-氯丙基三甲氧基矽烷、γ-巰丙基三甲氧基矽烷、γ-胺基丙基三甲氧基矽烷、雙-[3-(三乙氧基矽烷基)丙基]四硫化物、雙-[3-(三乙氧基矽烷基)丙基]二硫化物、γ-三甲氧基矽烷基丙基二甲硫基胺甲醯基四硫化物及γ-三甲氧基矽烷基丙基苯并噻唑基四硫化物。
作為光酸產生劑,亦可使用設為A+
B-
之結構之鎓鹽。作為光酸產生劑,例如可列舉:UVACURE1590(Daicel-Cytec製造)、CPI-100P、110P、210S(San-Apro製造)等鋶鹽、Omnicat 250(IGM Resins公司製造)、WPI-113(Fuji Film和光純藥製造)、Rp-2074(Rhodia-Japan製造)等錪鹽。
本實施形態之樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下,較佳為400 mPa・s以上4000 mPa・s以下,更佳為500 mPa・s以上3500 mPa・s以下。藉由使樹脂組合物之黏度處於上述範圍,能夠提昇樹脂組合物之塗佈性。
<光纖>
圖1係表示本實施形態之光纖之一例之概略剖視圖。光纖10具備:包含芯11及包層12之玻璃纖維13、及包含設於玻璃纖維13之外周之一次樹脂層14及二次樹脂層15之被覆樹脂層16。
圖1係表示本實施形態之光纖之一例之概略剖視圖。光纖10具備:包含芯11及包層12之玻璃纖維13、及包含設於玻璃纖維13之外周之一次樹脂層14及二次樹脂層15之被覆樹脂層16。
包層12包裹芯11。芯11及包層12主要含有石英玻璃等玻璃,例如,芯11可使用添加有鍺之石英,包層12可使用純石英、或添加有氟之石英。
於圖1中,例如玻璃纖維13之外徑(D2)為125 μm左右,構成玻璃纖維13之芯11之直徑(D1)為7~15 μm左右。
被覆樹脂層16之厚度通常為60~70 μm左右。一次樹脂層14及二次樹脂層15之各層之厚度可為10~50 μm左右,例如,一次樹脂層14之厚度可為35 μm,二次樹脂層15之厚度可為25 μm。光纖10之外徑可為245~265 μm左右。
本實施形態之樹脂組合物能夠應用於二次樹脂層。二次樹脂層能夠使含有上述基礎樹脂及無機氧化物粒子之樹脂組合物硬化而形成。本實施形態之樹脂組合物作為光纖之二次被覆材料適宜。藉此,可提昇光纖之側壓特性。
二次樹脂層之楊氏模數於23℃下較佳為1300 MPa以上,更佳為1300~2600 MPa,進而較佳為1300~2500 MPa。若二次樹脂層之楊氏模數為1300 MPa以上,則易提昇側壓特性,若為2600 MPa以下,則能夠賦予二次樹脂層適度之韌性,因此二次樹脂層變得不易產生破裂等。
分散於分散介質中之無機氧化物粒子於樹脂層硬化後亦以分散於樹脂層中之狀態存在。於使用反應性之分散介質之情形時,無機氧化物粒子係與分散介質一起混合至樹脂組合物中,並於分散狀態維持之狀態下被吸收至樹脂層中。於使用非反應性之分散介質之情形時,分散介質係至少一部分自樹脂組合物揮發而消失,無機氧化物粒子以分散狀態直接殘留於樹脂組合物中,於硬化後之樹脂層中亦以分散之狀態存在。樹脂層中所存在之無機氧化物粒子於利用電子顯微鏡觀察之情形時,觀察到一次粒子分散之狀態。
一次樹脂層14例如能夠使包含胺基甲酸酯(甲基)丙烯酸酯低聚物、單體、光聚合起始劑及矽烷偶合劑之樹脂組合物硬化而形成。一次樹脂層用之樹脂組合物能夠使用先前公知之技術。作為胺基甲酸酯(甲基)丙烯酸酯低聚物、單體、光聚合起始劑及矽烷偶合劑,亦可自上述基礎樹脂中所例示之化合物適當選擇。但,形成一次樹脂層之樹脂組合物具有與形成二次樹脂層之基礎樹脂不同之組成。
[實施例]
以下,示出使用本發明之實施例及比較例之評價試驗之結果,進一步詳細地說明本發明。再者,本發明並不限定於該等實施例。
以下,示出使用本發明之實施例及比較例之評價試驗之結果,進一步詳細地說明本發明。再者,本發明並不限定於該等實施例。
(低聚物)
作為低聚物,準備藉由使分子量600之聚丙二醇、2,4-甲苯二異氰酸酯及丙烯酸羥基乙酯進行反應所獲得之丙烯酸胺基甲酸酯低聚物(UA)、以及環氧丙烯酸酯低聚物(EA)。
作為低聚物,準備藉由使分子量600之聚丙二醇、2,4-甲苯二異氰酸酯及丙烯酸羥基乙酯進行反應所獲得之丙烯酸胺基甲酸酯低聚物(UA)、以及環氧丙烯酸酯低聚物(EA)。
(具有苯氧基之單體)
作為具有苯氧基之單體,準備丙烯酸3-苯氧基苄酯(共榮化學股份有限公司之商品名「Light Acrylate POB-A」)、丙烯酸2-苯氧基乙酯(共榮化學股份有限公司之商品名「Light Acrylate PO-A」)、苯氧基二乙二醇丙烯酸酯(共榮化學股份有限公司之商品名「Light Acrylate P2H-A」)、及苯氧基聚乙二醇丙烯酸酯(共榮化學股份有限公司之商品名「Light Acrylate P-200A」)。
作為具有苯氧基之單體,準備丙烯酸3-苯氧基苄酯(共榮化學股份有限公司之商品名「Light Acrylate POB-A」)、丙烯酸2-苯氧基乙酯(共榮化學股份有限公司之商品名「Light Acrylate PO-A」)、苯氧基二乙二醇丙烯酸酯(共榮化學股份有限公司之商品名「Light Acrylate P2H-A」)、及苯氧基聚乙二醇丙烯酸酯(共榮化學股份有限公司之商品名「Light Acrylate P-200A」)。
(不具有苯氧基之單體)
作為不具有苯氧基之單體,準備丙烯酸異基酯(大阪有機化學工業股份有限公司之商品名「IBXA」)及三丙二醇二丙烯酸酯(Daicel-Allnex股份有限公司之商品名「TPGDA」)。
作為不具有苯氧基之單體,準備丙烯酸異基酯(大阪有機化學工業股份有限公司之商品名「IBXA」)及三丙二醇二丙烯酸酯(Daicel-Allnex股份有限公司之商品名「TPGDA」)。
(光聚合起始劑)
作為光聚合起始劑,準備1-羥基環己基苯酮及2,4,6-三甲基苯甲醯基二苯基氧化膦。
作為光聚合起始劑,準備1-羥基環己基苯酮及2,4,6-三甲基苯甲醯基二苯基氧化膦。
(無機氧化物粒子)
作為無機氧化物粒子,準備平均粒徑為70~100 nm之疏水性氧化矽粒子、平均粒徑為40~60 nm之疏水性氧化矽粒子、平均粒徑為10~15 nm之疏水性氧化矽粒子。該等氧化矽粒子具有甲基丙烯醯基,且分散至甲基乙基酮(MEK)中。
作為無機氧化物粒子,準備平均粒徑為70~100 nm之疏水性氧化矽粒子、平均粒徑為40~60 nm之疏水性氧化矽粒子、平均粒徑為10~15 nm之疏水性氧化矽粒子。該等氧化矽粒子具有甲基丙烯醯基,且分散至甲基乙基酮(MEK)中。
[樹脂組合物之製作]
首先,混合上述低聚物、單體及光聚合起始劑而製備基礎樹脂。其次,將基礎樹脂與氧化矽粒子混合之後,於減壓下將作為分散介質之MEK之大部分去除,分別製作樹脂組合物。再者,殘存於樹脂組合物中之MEK之含量為5質量%以下。
首先,混合上述低聚物、單體及光聚合起始劑而製備基礎樹脂。其次,將基礎樹脂與氧化矽粒子混合之後,於減壓下將作為分散介質之MEK之大部分去除,分別製作樹脂組合物。再者,殘存於樹脂組合物中之MEK之含量為5質量%以下。
於表1及表2中,單體之數值為以基礎樹脂之總量為基準之含量,低聚物之數值為以單體、低聚物及氧化矽粒子之總量為基準之含量,氧化矽粒子之數值為以樹脂組合物之總量為基準之含量。
使用實施例及比較例中所獲得之樹脂組合物,進行以下之評價。將結果示於表1及表2。
(黏度)
使用作為B型黏度計之Brookfield公司之「數位黏度計DV-II」(使用Spindle:No.18,轉數:10 rpm)測定樹脂組合物於45℃下之黏度。
使用作為B型黏度計之Brookfield公司之「數位黏度計DV-II」(使用Spindle:No.18,轉數:10 rpm)測定樹脂組合物於45℃下之黏度。
(楊氏模數)
使用旋轉塗佈機,將樹脂組合物塗佈於聚對苯二甲酸乙二酯(PET)膜上之後,使用Heraeus製造之無電極UV Lump-System「VPS6(D閥門)」,於1000±100 mJ/cm2 之條件下使其硬化,於PET膜上形成厚度200±20 μm之樹脂層(塗膜)。將樹脂層自PET膜剝離,獲得樹脂膜。
使用旋轉塗佈機,將樹脂組合物塗佈於聚對苯二甲酸乙二酯(PET)膜上之後,使用Heraeus製造之無電極UV Lump-System「VPS6(D閥門)」,於1000±100 mJ/cm2 之條件下使其硬化,於PET膜上形成厚度200±20 μm之樹脂層(塗膜)。將樹脂層自PET膜剝離,獲得樹脂膜。
將樹脂膜衝壓成JIS K7127 類型5之啞鈴形狀,於23±2℃、50±10%RH之條件下使用拉伸試驗機於1 mm/分鐘之伸張速度、標線間25 mm之條件下進行拉伸而獲得應力-應變曲線。藉由2.5%割線求出楊氏模數。
[光纖之製作]
將藉由使分子量2000之聚丙二醇、2,4-甲苯二異氰酸酯、丙烯酸羥基乙酯及甲醇進行反應所獲得之丙烯酸胺基甲酸酯低聚物75質量份、壬基苯氧基聚乙二醇丙烯酸酯12質量份、N-乙烯基己內醯胺6質量份、1,6-己二醇二丙烯酸酯2質量份、2,4,6-三甲基苯甲醯基二苯基氧化膦(Omnirad TPO)1質量份、3-巰丙基三甲氧基矽烷(MPTS)1質量份混合,獲得樹脂組合物A1。
將藉由使分子量2000之聚丙二醇、2,4-甲苯二異氰酸酯、丙烯酸羥基乙酯及甲醇進行反應所獲得之丙烯酸胺基甲酸酯低聚物75質量份、壬基苯氧基聚乙二醇丙烯酸酯12質量份、N-乙烯基己內醯胺6質量份、1,6-己二醇二丙烯酸酯2質量份、2,4,6-三甲基苯甲醯基二苯基氧化膦(Omnirad TPO)1質量份、3-巰丙基三甲氧基矽烷(MPTS)1質量份混合,獲得樹脂組合物A1。
於包含芯及包層之直徑125 μm之玻璃纖維之外周,使用樹脂組合物A1形成厚度35 μm之一次樹脂層,進而於一次樹脂層之外周使用實施例或比較例中所製作之樹脂組合物形成二次樹脂層,製作光纖。線速度係設為1500 m/分鐘。
(塗佈性)
針對所製作之光纖,藉由確認有無斷線而評價樹脂組合物之塗佈性。將無斷線之情形設為「OK」,將確認有斷線之情形設為「NG」。若樹脂組合物之黏度過高,則形成二次樹脂層時之被覆直徑不穩定而易斷線。另一方面,若樹脂組合物之黏度過低,則自調芯力難以起作用而變得易產生偏差。
針對所製作之光纖,藉由確認有無斷線而評價樹脂組合物之塗佈性。將無斷線之情形設為「OK」,將確認有斷線之情形設為「NG」。若樹脂組合物之黏度過高,則形成二次樹脂層時之被覆直徑不穩定而易斷線。另一方面,若樹脂組合物之黏度過低,則自調芯力難以起作用而變得易產生偏差。
[表1]
[表2]
確認到實施例之樹脂組合物能夠兼具塗佈性與塗膜物性。
10‧‧‧光纖
11‧‧‧芯
12‧‧‧包層
13‧‧‧玻璃纖維
14‧‧‧一次樹脂層
15‧‧‧二次樹脂層
16‧‧‧被覆樹脂層
D1‧‧‧芯之直徑
D2‧‧‧玻璃纖維之外徑
圖1係表示本實施形態之光纖之一例之概略剖視圖。
Claims (9)
- 一種樹脂組合物,其包含含有胺基甲酸酯(甲基)丙烯酸酯低聚物、具有苯氧基之單體及光聚合起始劑之基礎樹脂;及疏水性之無機氧化物粒子,且 該樹脂組合物之黏度於45℃下為300 mPa・s以上4200 mPa・s以下, 上述具有苯氧基之單體之含量以上述基礎樹脂之總量為基準,為1質量%以上30質量%以下。
- 如請求項1之樹脂組合物,其中上述基礎樹脂進而含有不具有苯氧基之單體。
- 如請求項2之樹脂組合物,其中上述不具有苯氧基之單體之黏度於25℃下為50 mPa・s以下。
- 如請求項1至3中任一項之樹脂組合物,其中上述具有苯氧基之單體係選自由(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸3-苯氧基苄酯、苯氧基二乙二醇(甲基)丙烯酸酯及苯氧基聚乙二醇(甲基)丙烯酸酯所組成之群中之至少1種。
- 如請求項1至4中任一項之樹脂組合物,其中上述無機氧化物粒子係選自由二氧化矽、二氧化鋯、氧化鋁、氧化鎂、氧化鈦、氧化錫及氧化鋅所組成之群中之至少1種。
- 如請求項1至5中任一項之樹脂組合物,其中上述無機氧化物粒子之平均一次粒徑為200 nm以下。
- 如請求項1至6中任一項之樹脂組合物,其中上述無機氧化物粒子之含量以上述樹脂組合物之總量為基準,為1質量%以上60質量%以下。
- 一種光纖之二次被覆材料,其包含如請求項1至7中任一項之樹脂組合物。
- 一種光纖,其具備:包含芯及包層之玻璃纖維、 與上述玻璃纖維相接並被覆該玻璃纖維之一次樹脂層、及 被覆上述一次樹脂層之二次樹脂層,且 上述二次樹脂層包含如請求項1至7中任一項之樹脂組合物之硬化物。
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WO2020255774A1 (ja) * | 2019-06-17 | 2020-12-24 | 住友電気工業株式会社 | 樹脂組成物、光ファイバ及び光ファイバの製造方法 |
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Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS632834A (ja) * | 1986-04-09 | 1988-01-07 | Mitsubishi Petrochem Co Ltd | 光学ガラスフアイバ−用一次被覆材料 |
JPH0269706A (ja) | 1988-09-06 | 1990-03-08 | Sumitomo Electric Ind Ltd | 被覆光ファイバ |
DE69015181T2 (de) * | 1989-05-12 | 1995-07-20 | Dsm Nv | Lichthärtende pigmentierte sekundär-optische faserbeschichtungen. |
JP3292348B2 (ja) | 1994-10-11 | 2002-06-17 | ジェイエスアール株式会社 | 液状硬化性樹脂組成物 |
DE19535935A1 (de) * | 1995-09-27 | 1997-04-03 | Basf Lacke & Farben | Strahlenhärtbarer Überzug |
US5908873A (en) * | 1995-12-20 | 1999-06-01 | Borden Chemicals, Inc. | Peelable bonded ribbon matrix material; optical fiber bonded ribbon arrays containing same; and process for preparing said optical fiber bonded ribbon arrays |
JP3787189B2 (ja) | 1996-03-04 | 2006-06-21 | Jsr株式会社 | 液状硬化性樹脂組成物 |
JP2000007717A (ja) | 1998-06-19 | 2000-01-11 | Takeda Chem Ind Ltd | 紫外線硬化型樹脂組成物 |
JP3882028B2 (ja) * | 1998-07-07 | 2007-02-14 | Jsr株式会社 | 液状硬化性樹脂組成物 |
US6304705B1 (en) | 1999-07-27 | 2001-10-16 | Lucent Technologies Inc. | Mode coupling buffered optical fiber apparatus and method for making |
JP3912532B2 (ja) | 2002-02-21 | 2007-05-09 | 住友電気工業株式会社 | 被覆光ファイバ心線、コネクタ付被覆光ファイバ心線、及び、光ファイバケーブル |
US20050148676A1 (en) * | 2002-03-18 | 2005-07-07 | Yasuhiro Doi | Resin composition and optical element |
JP2004204206A (ja) | 2002-03-29 | 2004-07-22 | Mitsubishi Chemicals Corp | 光硬化性組成物及びその製造方法、並びに硬化物 |
US7542644B2 (en) | 2003-02-20 | 2009-06-02 | Sumitomo Electric Industries, Ltd. | Coated optical fiber and coated optical fiber with connector |
CA2558425A1 (en) * | 2004-03-08 | 2005-09-22 | Ecology Coating, Inc. | Environmentally friendly coating compositions for coating metal objects, coated objects therefrom, and methods, processes and assemblages for coating thereof |
JP2005301236A (ja) | 2004-03-15 | 2005-10-27 | Jsr Corp | 液状硬化性樹脂組成物 |
JP2005301237A (ja) * | 2004-03-15 | 2005-10-27 | Jsr Corp | 液状硬化性樹脂組成物 |
JP4555061B2 (ja) | 2004-09-28 | 2010-09-29 | Jsr株式会社 | 光ファイバアップジャケット用放射線硬化型液状樹脂組成物 |
WO2006041289A1 (en) | 2004-10-15 | 2006-04-20 | Dsm Ip Assets B.V. | Radiation curable coating composition |
JP2007046047A (ja) * | 2005-07-14 | 2007-02-22 | Sanyo Chem Ind Ltd | 活性エネルギー線硬化型樹脂組成物 |
ATE423175T1 (de) | 2006-12-05 | 2009-03-15 | Dsm Ip Assets Bv | Strahlungshärtbare beschichtungszusammensetzung |
EP2504288B1 (en) | 2009-11-26 | 2019-04-17 | Prysmian S.p.A. | Optical fiber with double coating |
JP2012219110A (ja) * | 2011-04-04 | 2012-11-12 | Bridgestone Corp | 固体状光硬化性樹脂組成物 |
KR102040799B1 (ko) | 2011-05-13 | 2019-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 미세구조화 광학 필름에 적합한 벤질 (메트)아크릴레이트 단량체 |
AR087305A1 (es) | 2011-07-28 | 2014-03-12 | Regeneron Pharma | Formulaciones estabilizadas que contienen anticuerpos anti-pcsk9, metodo de preparacion y kit |
JP5962094B2 (ja) | 2012-03-16 | 2016-08-03 | 凸版印刷株式会社 | 積層基板の製造方法 |
KR102180159B1 (ko) * | 2012-11-27 | 2020-11-18 | 교에이샤 케미칼 주식회사 | 하드코트용 조성물 및 하드코트층이 형성된 성형품 |
JP2014219550A (ja) | 2013-05-08 | 2014-11-20 | 住友電気工業株式会社 | 光ファイバ心線 |
JP6245015B2 (ja) * | 2014-03-24 | 2017-12-13 | 住友電気工業株式会社 | 光ファイバ |
JP2018503707A (ja) | 2014-11-18 | 2018-02-08 | オーエフエス ファイテル,エルエルシー | 低密度uv硬化性光ファイバコーティング剤、それとともに製造されるファイバ、及びファイバ製造方法 |
JP2018077303A (ja) | 2016-11-08 | 2018-05-17 | 住友電気工業株式会社 | 光ファイバ心線 |
TW201942164A (zh) | 2018-04-02 | 2019-11-01 | 日商住友電氣工業股份有限公司 | 樹脂組合物、光纖之二次被覆材料及光纖 |
TWI828776B (zh) * | 2018-10-04 | 2024-01-11 | 日商住友電氣工業股份有限公司 | 樹脂組合物及光纖 |
KR20210093278A (ko) * | 2018-11-16 | 2021-07-27 | 스미토모 덴키 고교 가부시키가이샤 | 수지 조성물, 광 파이버 및 광 파이버의 제조 방법 |
CN113993923A (zh) * | 2019-06-11 | 2022-01-28 | 住友电气工业株式会社 | 树脂组合物、光纤及光纤的制造方法 |
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- 2019-04-02 US US16/637,512 patent/US11629269B2/en active Active
- 2019-04-02 CN CN201980022116.6A patent/CN111902442B/zh active Active
- 2019-04-02 JP JP2020512270A patent/JP7255588B2/ja active Active
- 2019-04-02 WO PCT/JP2019/014681 patent/WO2019194198A1/ja unknown
- 2019-04-02 EP EP19782095.4A patent/EP3778682A4/en active Pending
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CN111902442B (zh) | 2023-04-04 |
KR20200140842A (ko) | 2020-12-16 |
JP7255588B2 (ja) | 2023-04-11 |
RU2020135063A3 (zh) | 2022-05-04 |
CN111902442A (zh) | 2020-11-06 |
WO2019194198A1 (ja) | 2019-10-10 |
US11629269B2 (en) | 2023-04-18 |
EP3778682A4 (en) | 2021-12-15 |
RU2020135063A (ru) | 2022-05-04 |
EP3778682A1 (en) | 2021-02-17 |
US20200216714A1 (en) | 2020-07-09 |
JPWO2019194198A1 (ja) | 2021-05-13 |
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