TW201940968A - 感光性組成物 - Google Patents

感光性組成物 Download PDF

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Publication number
TW201940968A
TW201940968A TW108109655A TW108109655A TW201940968A TW 201940968 A TW201940968 A TW 201940968A TW 108109655 A TW108109655 A TW 108109655A TW 108109655 A TW108109655 A TW 108109655A TW 201940968 A TW201940968 A TW 201940968A
Authority
TW
Taiwan
Prior art keywords
compound
photosensitive composition
group
mass
less
Prior art date
Application number
TW108109655A
Other languages
English (en)
Chinese (zh)
Inventor
奈良裕樹
大河原昂広
田口貴規
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW201940968A publication Critical patent/TW201940968A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW108109655A 2018-03-26 2019-03-21 感光性組成物 TW201940968A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018058036 2018-03-26
JP2018-058036 2018-03-26

Publications (1)

Publication Number Publication Date
TW201940968A true TW201940968A (zh) 2019-10-16

Family

ID=68059974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109655A TW201940968A (zh) 2018-03-26 2019-03-21 感光性組成物

Country Status (4)

Country Link
JP (1) JPWO2019188653A1 (ja)
KR (1) KR20200122349A (ja)
TW (1) TW201940968A (ja)
WO (1) WO2019188653A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202212379A (zh) * 2020-07-22 2022-04-01 日商富士軟片股份有限公司 組成物、轉印薄膜、積層體之製造方法、電路配線之製造方法及電子器件之製造方法
JPWO2022044616A1 (ja) * 2020-08-31 2022-03-03

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201727A (ja) * 1993-11-26 1995-08-04 Hitachi Ltd パターン形成方法
JP4399891B2 (ja) * 1999-04-09 2010-01-20 東レ株式会社 感光性ペーストおよびそれを用いたディスプレイ用部材の製造方法
JP2001183825A (ja) * 1999-12-22 2001-07-06 Mitsubishi Chemicals Corp 光重合性組成物及び画像形成材料
JP4694162B2 (ja) * 2004-07-21 2011-06-08 富士フイルム株式会社 硬化性樹脂組成物並びにこれを用いたカラーフィルタ用樹脂皮膜およびカラーフィルタ
JP2008064963A (ja) * 2006-09-06 2008-03-21 Fujifilm Corp 硬化性組成物、カラーフィルタ及びその製造方法
JP5191241B2 (ja) * 2007-01-12 2013-05-08 東洋インキＳｃホールディングス株式会社 着色組成物およびカラーフィルタの製造方法
CN102770809A (zh) 2009-07-02 2012-11-07 东友精细化工有限公司 用于制备利用300nm以下超短波长曝光器的固体摄像元件的彩色滤光片的着色感光性树脂组合物、利用其的彩色滤光片以及含有该彩色滤光片的固体摄像元件
KR101573937B1 (ko) 2009-07-02 2015-12-03 동우 화인켐 주식회사 초단파장 노광기를 이용한 고체 촬상 소자용 컬러 필터의 제조방법, 그 방법에 의해 제조된 컬러 필터 및 이를 포함하는 고체 촬상 소자
JP2013054079A (ja) * 2011-08-31 2013-03-21 Fujifilm Corp 光硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子
JP2018022023A (ja) * 2016-08-03 2018-02-08 大日本印刷株式会社 感光性着色樹脂組成物、カラーフィルタ及びその製造方法、液晶表示装置、並びに発光表示装置

Also Published As

Publication number Publication date
JPWO2019188653A1 (ja) 2021-02-18
KR20200122349A (ko) 2020-10-27
WO2019188653A1 (ja) 2019-10-03

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